Method for producing radiation-emitting semiconductor chips, radiation-emitting semiconductor chip and radiation-emitting component
In an embodiment a method for producing radiation-emitting semiconductor chips includes providing a semiconductor wafer, applying first contact layers on the semiconductor wafer, applying a second dielectric layer on the semiconductor wafer and the first contact layers, attaching a carrier arrangement to the semiconductor wafer, singulating the semiconductor wafer into semiconductor bodies and applying second contact layers on the semiconductor bodies, wherein the second dielectric layer is formed such that it mechanically stabilizes itself.
1 . A method for producing radiation-emitting semiconductor chips, the method comprising:
providing a semiconductor wafer;
applying a first dielectric layer to the semiconductor wafer;
creating first recesses in the first dielectric layer;
applying first contact layers on the semiconductor wafer in the first recesses;
applying a second dielectric layer on the first dielectric layer and the first contact layers;
forming fourth recesses in the second dielectric layer;
attaching a carrier arrangement to the semiconductor wafer;
singulating the semiconductor wafer into semiconductor bodies; and
applying second contact layers on the semiconductor bodies,
wherein the second dielectric layer is formed such that it mechanically stabilizes itself, and
wherein each fourth recess overlaps in lateral directions with one of the first recesses.
2 . The method according to claim 1 , further comprising:
forming a sacrificial layer in a single contiguous manner on the semiconductor wafer,
wherein the carrier arrangement comprises a second carrier layer and a third carrier layer, and
wherein the second carrier layer is applied to the sacrificial layer.
3 . The method according to claim 1 , further comprising, after applying the first contact layers, creating a sacrificial layer penetrated by openings on the semiconductor wafer,
wherein the carrier arrangement is fixed to the sacrificial layer,
wherein holding elements of the carrier arrangement are each formed in an opening of the sacrificial layer, and
wherein the sacrificial layer is removed in such a way that the carrier arrangement is mechanically connected to the semiconductor bodies only in a region of the holding elements.
4 . The method according to claim 1 , further comprising:
forming fifth recesses spaced apart in the lateral directions from the first recesses in the second dielectric layer; and
arranging second contacts in each of the fifth recesses.
5 . The method according to claim 4 , further comprising:
applying a passivation layer; and
applying further second contact layers on side surfaces of the passivation layer,
wherein the second contact layers and the further second contact layers each electrically conductively connect one of the second contacts with a respective one of the exposed semiconductor bodies.
6 . The method according to claim 1 , further comprising applying a passivation layer over the semiconductor bodies, after singulating the semiconductor wafer.
7 . The method according to claim 6 , further comprising:
forming second recesses in the passivation layer, the second recesses being spaced apart in the lateral directions from the semiconductor bodies; and
forming third recesses, each overlapping in the lateral directions with one of the semiconductor bodies in the passivation layer,
wherein each of the third recesses exposes a region of one of the semiconductor bodies.
8 . The method according to claim 7 , wherein each of the second contact layers is applied to one of the exposed semiconductor bodies.
9 . The method according to claim 7 , further comprising applying further first contact layers on side surfaces of the passivation layer, wherein each of the further first contact layers is electrically conductively connected with one of the first contact layers in a respective one of the second recesses.
10 . A radiation emitting semiconductor chip comprising:
a semiconductor body configured to emit electromagnetic radiation;
a first contact layer with a first recess;
a second contact layer;
a first dielectric layer in the first recess; and
a second dielectric layer arranged on the first dielectric layer and the first contact layer,
wherein the second dielectric layer mechanically stabilizes itself,
wherein a current is impressable into the semiconductor body through the first contact layer and the second contact layer, and
wherein a fourth recess is arranged in the second dielectric layer, the fourth recess overlapping in lateral directions with the first recess.
11 . The radiation emitting semiconductor chip according to claim 10 , wherein the first contact layer and the second contact layer comprise a transparent conductive material.
12 . The radiation emitting semiconductor chip according to claim 10 ,
wherein the first contact layer is arranged on a bottom surface of the semiconductor body, and
wherein the first contact layer extends from the bottom surface of the semiconductor body into the semiconductor body.
13 . A radiation emitting device comprising:
the radiation emitting semiconductor chip according to claim 10 ; and
a carrier comprising at least a first contact element,
wherein the radiation emitting semiconductor chip is arranged on the carrier by a direct bond connection and/or an adhesive.
14 . The radiation emitting device according to claim 13 , wherein the carrier and/or the first contact element are configured to be transparent to the electromagnetic radiation emitted by the semiconductor body.
15 . The radiation emitting device according to claim 13 , wherein the first contact element is configured to be reflective for the electromagnetic radiation emitted by the semiconductor body.
16 . The radiation emitting device according to claim 15 , wherein the first contact element comprises a curved shape.