IP Library Granted Patent US 12,519,213
Granted Patent B2
US 12,519,213 · App. 18/184,207 · Granted Jan 6, 2026

Antenna module and electronic device including the same

Inventors: Junsig Kum (Suwon-si, KR); Yoongeon Kim (Suwon-si, KR); Seokmin Lee (Suwon-si, KR); Seungho Choi (Suwon-si, KR); Youngju Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q1/246H01Q21/065
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Quick Facts
Patent No.
US 12,519,213
App. No.
18/184,207
Filed
Mar 15, 2023
Granted
Jan 6, 2026
Kind
B2
Examiner
HO, ANH N
Art Unit
2845
USPC
343/893
Abstract

The disclosure relates to a pre-5 th -Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4 th -Generation (4G) communication system such as Long Term Evolution (LTE). An antenna module is provided. The antenna module includes multiple antennas, a distribution circuit disposed to provide an electrical connection with each of the multiple antennas, a metal plate, and a dielectric substrate disposed between a pattern layer of the distribution circuit and the metal plate, wherein the dielectric substrate includes one or more dielectric film layers and one or more adhesive layers.

Claims (52)

1 . An antenna module comprising:

a dielectric substrate including a first dielectric layer and a second dielectric layer disposed on the first dielectric layer;

a metal plate coupled to the first dielectric layer;

a film structure including a film layer coupled to a face of the second dielectric layer, an adhesive layer disposed on the film layer, and a pattern layer disposed on the adhesive layer, wherein openings are formed in the film structure;

a plurality of antennas; and

a plurality of support members for supporting the plurality of antennas,

wherein the plurality of support members are disposed in the openings and disposed on the face of the second dielectric layer, and

wherein the pattern layer of the film structure is configured to supply power to the plurality of antennas.

2 . The antenna module of claim 1 , further comprising:

a first adhesive layer disposed between the metal plate and the first dielectric layer; and

a second adhesive layer disposed between the first dielectric layer and the second dielectric layer.

3 . The antenna module of claim 1 , wherein the film layer, the adhesive layer, and the pattern layer are stacked in order from the dielectric substrate.

4 . The antenna module of claim 1 , further comprising:

a feeding line connected to a metal pattern of the pattern layer,

wherein the feeding line is disposed to be spaced apart from an antenna among the plurality of antennas by a predetermined interval for a coupling feeding.

5 . The antenna module of claim 1 ,

wherein the first dielectric layer has a first permittivity and the second dielectric layer has a second permittivity, and

wherein the first permittivity is different from the second permittivity.

6 . The antenna module of claim 1 , wherein a type of a dielectric of the first dielectric layer is different from a type of a dielectric of the second dielectric layer.

7 . The antenna module of claim 1 ,

wherein a total permittivity of the dielectric substrate is configured to have a permittivity with an error range of 5% in 2 to 6 farad/meter, and

wherein each of the first dielectric layer and the second dielectric layer is configured to have a thickness with an error range of 5% in 100 micrometer or less.

8 . The antenna module of claim 1 , wherein the dielectric substrate is coupled to the metal plate by a screw or a plastic rivet.

9 . The antenna module of claim 1 , wherein the pattern layer includes a metal pattern for supplying the power.

10 . A massive multiple-input multiple-output (MIMO) unit (MMU) device comprising:

at least one processor; and

an antenna module,

wherein the antenna module comprises:

a dielectric substrate including a first dielectric layer and a second dielectric layer disposed on the first dielectric layer,

a metal plate coupled to the first dielectric layer,

a film structure including a film layer coupled to a face of the second dielectric layer, an adhesive layer disposed on the film layer, and a pattern layer disposed on the adhesive layer, wherein openings are formed in the film structure,

a plurality of antennas, and

a plurality of support members for supporting the plurality of antennas,

wherein the plurality of support members are disposed in the openings and disposed on the face of the second dielectric layer, and

wherein the pattern layer of the film structure is configured to supply power to the plurality of antennas.

11 . The MMU device of claim 10 , further comprising:

a first adhesive layer disposed between the metal plate and the first dielectric layer, and

a second adhesive layer disposed between the first dielectric layer and the second dielectric layer.

12 . The MMU device of claim 10 ,

wherein the film layer, the adhesive layer, and the pattern layer are stacked in order from the dielectric substrate.

13 . The MMU device of claim 10 ,

wherein the antenna module further comprises a feeding line connected to a metal pattern of the pattern layer, and

wherein the feeding line is disposed to be spaced apart from an antenna among the plurality of antennas by a predetermined interval for a coupling feeding.

14 . The MMU device of claim 10 ,

wherein the first dielectric layer has a first permittivity and the second dielectric layer has a second permittivity, and

wherein the first permittivity is different from the second permittivity.

15 . The MMU device of claim 10 , wherein a type of a dielectric of the first dielectric layer is different from a type of a dielectric of the second dielectric layer.

16 . The MMU device of claim 10 ,

wherein a total permittivity of the dielectric substrate is configured to have a permittivity with an error range of 5% in 2 to 6 farad/meter, and

wherein each of the first dielectric layer and the second dielectric layer is configured to have a thickness with an error range of 5% in 100 micrometer or less.

17 . The MMU device of claim 10 , wherein the dielectric substrate is coupled to the metal plate by a screw or a plastic rivet.

18 . The MMU device of claim 10 , wherein the pattern layer includes a metal pattern for supplying the power.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2023
From: KUM, JUNSIG; KIM, YOONGEON; LEE, SEOKMIN; CHOI, SEUNGHO; LEE, YOUNGJU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062989/0207 →
Priority Claims (1)
KR 10-2021-0036236 · Mar 19, 2021 · national
Continuity (2)
Continuation PCTKR2022003852 · Mar 18, 2022
Related Publication 20230216179A1 · Jul 6, 2023
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