Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism
A monitoring mechanism at least includes a monitoring unit, the monitoring unit is disposed in a slicing chamber and is configured to continuously monitor a state of a wire mesh and have no contact with the wire mesh. The monitoring mechanism of the present disclosure can continuously monitor the state of the wire mesh in the slicing chamber, especially accurately and timely track and monitor in a location of wire mesh nonstop in a non-contact way in a darkroom with serious vapor and a lot of silicon mud during slicing, which provides a solid foundation for precise determination of an abnormal wire mesh. The entire structure occupies a small space in the limited slicing chamber, and the structure is simple and safe such that data of the state of the wire mesh can be obtained timely accurately to prevent a risk of missing or wrong determination.
1 . A monitoring mechanism, at least comprising a monitoring unit, wherein the monitoring unit is disposed in a slicing chamber, is configured to continuously monitor a state of a wire mesh, and has no contact with the wire mesh;
wherein the monitoring unit is at least equipped with a monitor, and a launch port of the monitor is disposed downward obliquely or vertically toward a side near the workpiece;
wherein the monitoring unit further comprises a casing and a position adjustment bar, the monitor is disposed in the casing, and a side of the casing which a launch port of the monitor faces is configured as a transparent surface;
a lower end of the position adjustment bar is connected to a top portion of the casing, an end of the position adjustment bar connected to the casing is structured as an arc surface; and
controlling the arc surface of the position adjustment bar adjusts a facing position of the launch port of the monitor.
2 . The monitoring mechanism according to claim 1 , wherein the monitoring unit is disposed toward any region of the wire mesh other than a region where a workpiece contacts the wire mesh and is disposed near the workpiece.
3 . The monitoring mechanism according to claim 1 , wherein the monitoring unit is two, and the monitoring units are disposed on two side surfaces of the slicing chamber and monitor the state of the wire mesh along a length direction of the workpiece; and
the monitoring units disposed on the two side surfaces of the slicing chamber are disposed oppositely.
4 . The monitoring mechanism according to claim 3 , wherein the monitoring units disposed on the two side surfaces of the slicing chamber monitor the wire mesh rotating along a first rotational direction and the wire mesh rotating along a second rotational direction, respectively; and
the monitoring units disposed on the two side surfaces of the slicing chamber alternately monitor the state of the wire mesh when the wire mesh switches from one of the first rotational direction and the second rotational direction to the other of the first rotational direction and the second rotational direction.
5 . The monitoring mechanism according to claim 1 , wherein the monitor is a radar sensor or a laser sensor.
6 . The monitoring mechanism according to claim 1 , wherein the monitoring unit is suspended on a positioning unit disposed along a length direction of the slicing chamber, the positioning unit is disposed with a long passageway and a connection block, and the long passageway matches the connection block; and
a mounting block is disposed under the connection block, an upper end surface of the mounting block is connected to a lower end surface of the connection block, and a side surface of an end portion of the mounting block is connected to an end of the position adjustment bar away from the monitor.
7 . An application of the monitoring mechanism according to claim 1 during a slicing process.
8 . A slicing machine, comprising the monitoring mechanism according to claim 1 .
9 . The monitoring mechanism according to claim 1 , further comprising a cleaning unit disposed independently from the monitoring unit, wherein the cleaning unit is disposed directly opposite to the launch port of the monitor and is disposed opposite to the monitor, and the cleaning unit is disposed at an end portion of the slicing chamber to clean a transparent surface corresponding to the launch port of the monitor when the monitoring unit stops.
10 . The monitoring mechanism according to claim 9 , wherein the monitoring units disposed on two side surfaces of the slicing chamber correspond to two cleaning units, and are cleaned by the cleaning units respectively;
or,
the monitoring units disposed on the two side surfaces of the slicing chamber share the cleaning unit, and the cleaning unit alternately cleans the monitoring units disposed on the two side surfaces of the slicing chamber.
11 . The monitoring mechanism according to claim 10 , wherein the cleaning unit is disposed with a cleaning element and a riser board, the riser board is disposed on one of side surfaces of the cleaning element, the cleaning element is connected to the riser board by a shaft, and the cleaning element is controlled to rotate around the shaft as a center such that the cleaning element is disposed opposite to the monitor.
12 . The monitoring mechanism according to claim 11 , wherein a baffle and a guide plate are disposed on a top portion of the cleaning element, the baffle is connected to the cleaning element; the guide plate is connected to the riser board; the riser board, and the baffle and the guide plate form a channel with multiple bends.
13 . The monitoring mechanism according to claim 9 , wherein an inner cavity and spraying holes communicating with the inner cavity are formed in the cleaning element, the inner cavity is connected to a gas pipe and a liquid pipe, and gas and liquid are mixed in the inner cavity and then flow out from the spraying holes.
14 . A monitoring mechanism, at least comprising a monitoring unit, wherein the monitoring unit is disposed in a slicing chamber, is configured to continuously monitor a state of a wire mesh, and has no contact with the wire mesh;
wherein the monitoring unit is at least equipped with a monitor, and a launch port of the monitor is disposed downward obliquely or vertically toward a side near the workpiece;
wherein the monitoring unit is suspended on a positioning unit disposed along a length direction of the slicing chamber, the positioning unit is disposed with a long passageway and a connection block, and the long passageway matches the connection block; and
a mounting block is disposed under the connection block, an upper end surface of the mounting block is connected to a lower end surface of the connection block, and a side surface of an end portion of the mounting block is connected to an end of the position adjustment bar away from the monitor.
15 . The monitoring mechanism according to claim 14 , wherein the monitoring unit is disposed toward any region of the wire mesh other than a region where a workpiece contacts the wire mesh and is disposed near the workpiece.
16 . The monitoring mechanism according to claim 14 , wherein the monitoring unit is two, and the monitoring units are disposed on two side surfaces of the slicing chamber and monitor the state of the wire mesh along a length direction of the workpiece; and
the monitoring units disposed on the two side surfaces of the slicing chamber are disposed oppositely.
17 . A monitoring mechanism, at least comprising a monitoring unit, wherein the monitoring unit is disposed in a slicing chamber, is configured to continuously monitor a state of a wire mesh, and has no contact with the wire mesh;
wherein the monitoring unit is at least equipped with a monitor, and a launch port of the monitor is disposed downward obliquely or vertically toward a side near the workpiece;
wherein the monitoring mechanism further comprises a cleaning unit disposed independently from the monitoring unit, the cleaning unit is disposed directly opposite to the launch port of the monitor and is disposed opposite to the monitor, and the cleaning unit is disposed at an end portion of the slicing chamber to clean a transparent surface corresponding to the launch port of the monitor when the monitoring unit stops.
18 . The monitoring mechanism according to claim 17 , wherein the monitoring unit is disposed toward any region of the wire mesh other than a region where a workpiece contacts the wire mesh and is disposed near the workpiece.
19 . The monitoring mechanism according to claim 17 , wherein the monitoring unit is two, and the monitoring units are disposed on two side surfaces of the slicing chamber and monitor the state of the wire mesh along a length direction of the workpiece; and
the monitoring units disposed on the two side surfaces of the slicing chamber are disposed oppositely.