IP Library › Granted Patent US 12,523,558
Granted Patent B2
US 12,523,558 · App. 18/254,235 · Granted Jan 13, 2026

Pressure sensor that mitigates zero drop phenomena

Inventors: Atsushi Hidaka (Osaka, JP); Takatoshi Nakatani (Osaka, JP); Kaoru Hirata (Osaka, JP); Kouji Nishino (Osaka, JP); Nobukazu Ikeda (Osaka, JP); Masaki Fukasawa (Sano, JP)
Assignees: FUJIKIN INCORPORATED; NIDEC COPAL ELECTRONICS CORPORATION
G01L9/0044G01L19/0007
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Quick Facts
Patent No.
US 12,523,558
App. No.
18/254,235
Granted
Jan 13, 2026
Kind
B2
Abstract

The pressure sensor 10 comprises: a bottomed cylindrical sensor module 11 having inside a pressure receiving chamber C 1 communicating with a flow path and including a diaphragm 11 a in contact with the pressure receiving chamber; a pressure detecting element 12 for outputting a strain of the diaphragm 11 a as a pressure; a base ring 14 fixed at an outer edge of an open-side end part 11 c of the sensor module and disposed on an outer peripheral side of the sensor module 11 ; a hermetic member 13 fixed to the base ring 14 for forming a sealed vacuum chamber C 2 opposite to the pressure receiving chamber C 1 across the diaphragm 11 a; a gasket 18 sandwiched between the base ring 14 and a body 5 ; and a pressing flange 19 for pressing the base ring 14 to the body 5 through the gasket 18.

Claims (20)

1 . A pressure sensor fixed to a body formed with a flow path, comprising:

a bottomed cylindrical sensor module having inside a pressure receiving chamber communicating with the flow path and including a diaphragm in contact with the pressure receiving chamber;

a pressure detecting element fixed to the diaphragm for outputting a strain of the diaphragm as a pressure;

a base ring disposed on an outer peripheral side of the sensor module and fixed at an outer edge of an open side end portion of the sensor module;

a hermetic member fixed to the base ring for forming a sealed vacuum chamber opposite to the pressure receiving chamber across the diaphragm;

a gasket sandwiched between the base ring and the body; and

a pressing flange for pressing and fixing the base ring to the body through the gasket, the pressing flange being configured to apply a pressing force to the base ring from an outside to the body.

2 . The pressure sensor according to claim 1 , wherein the diaphragm is formed from a cobalt-nickel alloy.

3 . The pressure sensor according to claim 2 , wherein a groove is formed on the base ring for relaxing a stress transmitted to the diaphragm when fixing to the body using the pressing flange.

4 . The pressure sensor according to claim 2 , wherein the diaphragm is formed from a cobalt-nickel alloy subjected to heating treatment at a temperature of 500° C. or higher for 100 minutes or more.

5 . The pressure sensor according to claim 4 , wherein a groove is formed on the base ring for relaxing a stress transmitted to the diaphragm when fixing to the body using the pressing flange.

6 . The pressure sensor according to claim 1 , wherein a groove is formed on the base ring for relaxing a stress transmitted to the diaphragm when fixing to the body using the pressing flange.

7 . The pressure sensor according to claim 6 , wherein the groove is formed along a circumferential direction at an end face of the base ring on a side where the hermetic member is fixed.

8 . The pressure sensor according to claim 6 , wherein the groove is formed along the circumferential direction in an inner peripheral surface of the base ring facing the sensor module.

9 . The pressure sensor according to claim 1 , further comprising a cylindrical outer peripheral wall being fixed to an outer peripheral portion of the base ring and having a diameter same as the base ring, wherein the hermetic member is arranged on inner side of the outer peripheral wall with a gap in between.

10 . The pressure sensor according to claim 1 , wherein the hermetic member comprises a hermetic ring fixed to the base ring and a lid for sealing the hermetic ring, the lid being disposed so as to cover the diaphragm with a gap.

11 . The pressure sensor according to claim 1 , when vacuuming the flow path and the pressure receiving chamber after sealing a fluid in the flow path and the pressure receiving chamber under the conditions where a temperature of a sealed fluid is 210° C., a sealing period is 120 minutes, and a sealing pressure is 200 kPa abs, a pressure output from the pressure detecting element at the time of evacuation is less than zero but a magnitude of a drop from zero is less than 0.25% of the sealing pressure.

12 . The pressure sensor according to claim 1 , wherein a tightening torque of the pressing flange to the body is 50 N·m or less.

13 . The pressure sensor according to claim 1 , wherein the body has a housing recess for accommodating the base ring, the sensor module is accommodated in the base ring, and the pressing flange is configured to press the base ring to a bottom face of the housing recess.

14 . The pressure sensor according to claim 13 , wherein the gasket is provided between an outer peripheral portion of the base ring and the bottom face of the housing recess.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2023
From: HIDAKA, ATSUSHI; NAKATANI, TAKATOSHI; HIRATA, KAORU; NISHINO, KOUJI; IKEDA, NOBUKAZU; FUKASAWA, MASAKI
To: FUJIKIN INCORPORATED; NIDEC COPAL ELECTRONICS CORPORATION
Reel/Frame 063746/0556 →
Priority Claims (1)
JP 2020-213900 · Dec 23, 2020 · national
Continuity (1)
Related Publication 20240094078A1 · Mar 21, 2024
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