Multilayer electronic component
A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.
1 . A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and
an external electrode including:
an electrode layer disposed on the body to be connected to the plurality of internal electrodes, and a conductive resin layer disposed on the electrode layer, wherein the electrode layer includes an island region, and wherein the island region has an average diameter of 0.3 to 1 μm.
2 . The multilayer electronic component of claim 1 , wherein the electrode layer includes copper.
3 . The multilayer electronic component of claim 2 , wherein a ratio of a length of a region on which the electrode layer is disposed to a total length of a surface of the body on which the external electrode is disposed is 50% or more.
4 . The multilayer electronic component of claim 1 , wherein the electrode layer directly contacts a surface of the body.
5 . The multilayer electronic component of claim 1 , wherein the electrode layer has an average thickness of 0.3 to 1 μm.
6 . The multilayer electronic component of claim 1 , wherein the conductive resin layer includes a conductive metal particle.
7 . The multilayer electronic component of claim 6 , wherein the conductive metal particle is a tin particle.
8 . The multilayer electronic component of claim 6 , wherein the conductive metal particle has an average particle diameter of 0.3 to 1 μm.
9 . The multilayer electronic component of claim 1 , wherein the conductive resin layer has an average thickness of 2 to 30 μm.
10 . The multilayer electronic component of claim 1 , further comprising:
a copper-tin alloy layer between the electrode layer and the conductive resin layer.
11 . The multilayer electronic component of claim 10 , wherein the copper-tin alloy layer has an average thickness of 2 to 30 μm.
12 . The multilayer electronic component of claim 1 , wherein the electrode layer includes a plurality of the island region, and each of the island region is spaced apart from each other.
13 . The multilayer electronic component of claim 3 , wherein the ratio is 50% or more and 70% or less.
14 . The multilayer electronic component of claim 2 , wherein a ratio of a length of a region on which the electrode layer is disposed to a total length of a surface of the body on which the external electrode is disposed is 50% or more and 70% or less.
15 . The multilayer electronic component of claim 1 , wherein the conductive resin layer includes epoxy.
16 . A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and
an external electrode including:
an electrode layer disposed on the body to be connected to the plurality of internal electrodes, and
a conductive resin layer disposed on the electrode layer,
wherein the electrode layer includes an island region,
wherein the island region has an average diameter of 0.3 to 1 μm, and
wherein a ratio of a length of a region on which the electrode layer is disposed to a total length of a surface of the body on which the external electrode is disposed is 50% or more.
17 . The multilayer electronic component of claim 16 , further comprising:
an underlying electrode layer between the body and the electrode layer,
wherein:
the underlying electrode layer includes nickel,
the underlying electrode layer has an average thickness of 2 to 20 μm,
the electrode layer covers the underlying electrode layer,
the island region covers a portion of a surface of the underlying electrode layer,
a ratio of a length of a region on which the electrode layer is disposed to a total length of a surface of the underlying electrode layer is 50% or more, and
the conductive resin layer includes epoxy.
18 . The multilayer electronic component of claim 17 , wherein:
the electrode layer includes copper, and the electrode layer has an average thickness of 0.3 to 1 μm.
19 . The multilayer electronic component of claim 17 , wherein the electrode layer includes a plurality of the island region, and each of the island region is spaced apart from each other.
20 . The multilayer electronic component of claim 17 , wherein the conductive resin layer includes a conductive metal particle that includes a tin particle, and the conductive metal particle has an average particle diameter of 0.3 to 1 μm.
21 . The multilayer electronic component of claim 17 , further comprising:
a copper-tin alloy layer between the electrode layer and the conductive resin layer,
wherein the copper-tin alloy layer has an average thickness of 2 to 30 μm.
22 . A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and
an external electrode including:
an electrode layer disposed on the body to be connected to the plurality of internal electrodes,
an underlying electrode layer between the body and the electrode layer, and
a conductive resin layer disposed on the electrode layer,
wherein the electrode layer includes an island region, and
wherein a ratio of a length of a region on which the electrode layer is disposed to a total length of a surface of the underlying electrode layer is 50% or more.