IP Library › Granted Patent US 12,525,465
Granted Patent B2
US 12,525,465 · App. 18/619,636 · Granted Jan 13, 2026

Substrate processing system and substrate processing method

Inventors: Kouzou Kanagawa (Koshi, JP); Kotaro Tsurusaki (Koshi, JP); Keiji Onzuka (Koshi, JP); Yoshihiro Kai (Koshi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/561H01L21/02101
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Quick Facts
Patent No.
US 12,525,465
App. No.
18/619,636
Granted
Jan 13, 2026
Kind
B2
Abstract

A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

Claims (17)

1 . A substrate processing system comprising:

a loading part into which a cassette configured to accommodate a plurality of substrates is loaded;

a batch-type processing part configured to collectively process a lot including the plurality of substrates;

a single-substrate-type processing part configured to process the plurality of substrates of the lot one by one;

an unloading part from which the cassette configured to accommodate the plurality of substrates is unloaded;

an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part; and

an additional interface part configured to deliver the plurality of substrates between the loading part and the batch-type processing part and including a lot formation part configured to form the lot,

wherein the loading part and the unloading part are provided separately, and the additional interface part, the batch-type processing part, the interface part, and the single-substrate-type processing part are arranged between the loading part and the unloading part in this order in a transfer direction of the plurality of substrates and opposite sides of the transfer direction, and

wherein a transfer device in the batch-type processing part moves only in the transfer direction to deliver the plurality of substrates from the batch-type processing part to the interface part.

2 . The substrate processing system of claim 1 , wherein the interface part includes a transfer part configured to transfer the plurality of substrates from the batch-type processing part to the single-substrate-type processing part.

3 . The substrate processing system of claim 2 , wherein the batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape in which the lot is immersed; and

wherein the transfer part is configured to transfer the plurality of substrates held in the processing solution from the processing bath of the batch-type processing part to the single-substrate-type processing part.

4 . The substrate processing system of claim 3 , wherein the processing bath is configured to store pure water in which the lot is immersed.

5 . The substrate processing system of claim 1 , wherein the single-substrate-type processing part comprises a solution processing apparatus configured to process the plurality of substrates one by one with a solution.

6 . The substrate processing system of claim 1 , wherein the single-substrate-type processing part comprises a drying apparatus configured to dry the plurality of substrates one by one with a supercritical fluid.

7 . A substrate processing method using the substrate processing system of claim 1 , the substrate processing method comprising:

transferring the plurality of substrates between the loading part and the unloading part in an order of the additional interface part, the batch-type processing part, the interface part, and the single-substrate-type processing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2024
From: KANAGAWA, KOUZOU; TSURUSAKI, KOTARO; ONZUKA, KEIJI; KAI, YOSHIHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 066963/0794 →
Priority Claims (1)
JP 2019-187084 · Oct 10, 2019 · national
Continuity (3)
Continuation 17886687 · Aug 12, 2022
Division 17063169 · Oct 5, 2020
Related Publication 20240242975A1 · Jul 18, 2024
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