Antenna device comprising a slot opening
A package comprising a substrate, an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects. The antenna device comprises an antenna device dielectric layer; at least one antenna located on a first surface of the antenna device dielectric layer; a shield located on at least one lateral surface of the antenna device; and a slot opening on the first surface of the antenna device.
1 . An antenna device comprising:
an antenna device dielectric layer;
at least one antenna located on a first surface of the antenna device dielectric layer;
a shield located on at least one lateral surface of the antenna device;
a slot opening on a first surface of the antenna device; and
a plurality of interconnects coupled to the shield.
2 . The antenna device of claim 1 , wherein the slot opening is defined by at least a portion of the first surface of the antenna device dielectric layer that is not covered by the at least one antenna.
3 . The antenna device of claim 1 , wherein the shield is configured as an electromagnetic interference (EMI) shield.
4 . The antenna device of claim 1 , wherein the at least one antenna includes a first antenna, a second antenna, and a third antenna.
5 . The antenna device of claim 4 ,
wherein the first antenna has a first triangular planar shape,
wherein the second antenna has a second triangular planar shape, and
wherein the third antenna has a third triangular planar shape.
6 . The antenna device of claim 4 , wherein the slot opening is located between the first antenna, the second antenna and the third antenna.
7 . The antenna device of claim 1 , wherein the first surface of the antenna device includes the first surface of the antenna device dielectric layer.
8 . The antenna device of claim 1 , wherein the plurality of interconnects include a first plurality of interconnects located on at least two metal layers of the antenna device.
9 . The antenna device of claim 1 , wherein the at least one antenna includes at least a portion of a metal layer located on a surface of the antenna device dielectric layer.
10 . The antenna device of claim 1 , further comprising a solder resist layer that is coupled to the at least one antenna and covers the slot opening.
11 . A package comprising:
a substrate;
an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and
an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects, wherein the antenna device comprises:
an antenna device dielectric layer;
at least one antenna located on a first surface of the antenna device dielectric layer;
a shield located on at least one lateral surface of the antenna device; and
a slot opening on a first surface of the antenna device.
12 . The package of claim 11 , wherein the slot opening is defined by at least a portion of the first surface of the antenna device dielectric layer that is not covered by the at least one antenna.
13 . The package of claim 11 , wherein the shield is configured as an electromagnetic interference (EMI) shield.
14 . The package of claim 11 , wherein the at least one antenna includes a first antenna, a second antenna, and a third antenna.
15 . The package of claim 14 ,
wherein the first antenna has a first triangular planar shape,
wherein the second antenna has a second triangular planar shape, and
wherein the third antenna has a third triangular planar shape.
16 . The package of claim 14 , wherein the slot opening is located between the first antenna, the second antenna and the third antenna.
17 . The package of claim 11 , further comprising a plurality of interconnects coupled to the shield.
18 . The package of claim 11 , further comprising a solder resist layer that is coupled to the at least one antenna and covers the slot opening, wherein the at least one antenna includes at least a portion of a metal layer located on a surface of the antenna device dielectric layer.
19 . The package of claim 11 , further comprising:
a flexible connection coupled to the substrate;
a second substrate coupled to the flexible connection; and
a second antenna device coupled to a surface of the second substrate.
20 . The package of claim 11 , further comprising:
a flexible connection coupled to the substrate; and
a second substrate coupled to the flexible connection, wherein the second substrate includes an embedded antenna device.
21 . A substrate comprising:
at least one dielectric layer;
a plurality of interconnects;
a first antenna device located at least partially in the at least one dielectric layer, wherein the first antenna device comprises:
a first antenna device dielectric layer;
at least one first antenna located on a first surface of the first antenna device dielectric layer; and
a first slot opening on a first surface of the first antenna device, and
a second antenna device located at least partially in the at least one dielectric layer, wherein the second antenna device comprises:
a second antenna device dielectric layer;
at least one second antenna located on a first surface of the second antenna device dielectric layer; and
a second slot opening on a first surface of the second antenna device.
22 . The substrate of claim 21 , wherein the first slot opening is defined by at least a portion of the first surface of the first antenna device dielectric layer that is not covered by the at least one first antenna.
23 . The substrate of claim 21 , wherein the first antenna device dielectric layer and the second antenna device dielectric layer are part of the at least one dielectric layer of the substrate.
24 . The substrate of claim 21 , further comprising a metal portion coupled to a lateral surface of the substrate, wherein the metal portion is configured as an electromagnetic interference (EMI) shield for the first antenna device and/or the second antenna device.
25 . The substrate of claim 21 ,
wherein the first antenna device further comprises a first stacked via wall, and
wherein the second antenna device further comprises a second stacked via wall.
26 . The substrate of claim 21 , wherein at least one first antenna includes a first antenna, a second antenna, and a third antenna.
27 . The substrate of claim 26 ,
wherein the first antenna has a first triangular planar shape,
wherein the second antenna has a second triangular planar shape, and
wherein the third antenna has a third triangular planar shape.
28 . The substrate of claim 26 , wherein the first slot opening is located between the first antenna, the second antenna and the third antenna.
29 . A package comprising:
an integrated device; and
a first substrate coupled to the integrated device through at least a first plurality of solder interconnects, wherein the first substrate comprises:
at least one dielectric layer;
a plurality of interconnects;
a first antenna device located at least partially in the at least one dielectric layer, wherein the first antenna device comprises:
a first antenna device dielectric layer;
at least one first antenna located on a first surface of the first antenna device dielectric layer; and
a first slot opening on a first surface of the first antenna device, and
a second antenna device located at least partially in the at least one dielectric layer, wherein the second antenna device comprises:
a second antenna device dielectric layer;
at least one second antenna located on a first surface of the second antenna device dielectric layer; and
a second slot opening on a first surface of the second antenna device.
30 . The package of claim 29 , further comprising:
a flexible connection coupled to the first substrate; and
a second substrate coupled to the flexible connection, wherein the second substrate includes an embedded antenna device.