IP Library › Granted Patent US 12,528,229
Granted Patent B2
US 12,528,229 · App. 18/254,372 · Granted Jan 20, 2026

Cutting tool for gang saw

Inventors: Hee-Dong Park (Yongin-si, KR); Nam-Kwang Kim (Cheongju-si, KR); Doo-Hoe Kim (Cheongju-si, KR); Dae-Yeon Rhee (Suwon-si, KR)
Assignee: EHWA DIAMOND IND. CO., LTD.
B28D1/06B28D1/127
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Quick Facts
Patent No.
US 12,528,229
App. No.
18/254,372
Granted
Jan 20, 2026
Kind
B2
Abstract

A cutting tool includes a blade formed so as to extend in the width direction or length direction of a workpiece; at least one cutting tip formed so as to protrude from the lower portion of the blade so as to cut the workpiece by reciprocating by means of a swinging motion; and a brazing part formed between the blade and the at least one cutting tip so as to silver-braze the blade and the at least one cutting tip. The brazing part includes a first silver solder layer; a metal sheet layer formed on the first silver solder layer and having a melting point that is higher than a silver brazing process temperature; and a second silver solder layer formed on the metal sheet layer.

Claims (12)

1 . A cutting tool for a gang saw, comprising:

a blade configured to extend in a width direction or a length direction of a workpiece;

at least one cutting tip protruding from a lower portion of the blade and configured to cut the workpiece while reciprocating in a swinging motion; and

a joint portion disposed between the blade and the at least one cutting tip and configured to bond the blade and the at least one cutting tip by a brazing,

wherein the joint portion includes a first brazing layer, a metal sheet layer disposed on the first brazing layer and having a melting point higher than a temperature of a brazing bonding process, and a second brazing layer disposed on the metal sheet layer,

based on a direction in which the blade extends laterally, a length of the metal sheet layer constituting the joint portion is equal to, or greater in a lateral direction, than a length of the cutting tip bonded to the joint portion, and

wherein in a blade region adjacent to the cutting tip, a heat-affected zone (HAZ) is disposed, and the joint portion is configured to have a size capable of covering at least a portion of a surface of the heat-affected zone.

2 . The cutting tool for a gang saw of claim 1 , wherein the first and second brazing layers are formed of a Cu—Ag-based material, and have the same compositional component.

3 . The cutting tool for a gang saw of claim 1 , wherein the first and second brazing layers are Cu—Ag-based materials and have different compositional components.

4 . The cutting tool for a gang saw of claim 1 , wherein the metal sheet layer is formed of any one of Cu, Ni, Co or Fe, or a mixture thereof or a compound thereof.

5 . The cutting tool for a gang saw of claim 1 , wherein a thickness of the joint portion as a multilayer brazing joint layer ranges from 200 to 1200 μm.

6 . The cutting tool for a gang saw of claim 1 , wherein the first and second brazing layers each have a thickness in a range of 50 to 400 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2023
From: PARK, HEE-DONG; KIM, NAM-KWANG; KIM, DOO-HOE; RHEE, DAE-YEON
To: EHWA DIAMOND IND. CO., LTD.
Reel/Frame 063970/0907 →
Priority Claims (1)
KR 10-2020-0182560 · Dec 23, 2020 · national
Continuity (1)
Related Publication 20240033973A1 · Feb 1, 2024
References Cited (29)
US 2442153A · Van Der Pyl · 1948 [cited by examiner]
US 2924050A · Barron · 1960 [cited by examiner]
US 3009456A · Fessel · 1961 [cited by examiner]
US 4205564A · Kolb · 1980 [cited by examiner]
US 4407263A · Murata · 1983 [cited by examiner]
US 4682987A · Brady · 1987 [cited by examiner]
US 4784033A · Hayden · 1988 [cited by examiner]
US 5314512A · Sexton · 1994 [cited by examiner]
US 5318006A · Walen · 1994 [cited by examiner]
US 5368078A · Rupe · 1994 [cited by examiner]
US 5791330A · Tselesin · 1998 [cited by examiner]
US 6712062B2 · Wildenburg · 2004 [cited by examiner]
US 8327944B2 · King · 2012 [cited by examiner]
US 20030148723A1 · Wildenburg · 2003 [cited by examiner]
US 20040237723A1 · Kanada · 2004 [cited by examiner]
US 20090229592A1 · Kim · 2009 [cited by examiner]
US 20160082619A1 · Park · 2016 [cited by examiner]
US 20160107334A1 · Rhee et al. · 2016 [cited by applicant]
CN 1617782A · 2005 [cited by applicant]
CN 105935805B · 2017 [cited by applicant]
CN 108582503B · 2020 [cited by applicant]
DE 8713250U1 · 1987 [cited by applicant]
EP 0309660A1 · 1989 [cited by applicant]
EP 1481782A1 · 2004 [cited by applicant]
KR 100680851B1 · 2007 [cited by applicant]
KR 101439885B1 · 2014 [cited by applicant]
KR 1020140144090A · 2014 [cited by applicant]
KR 102152036B1 · 2020 [cited by applicant]
Extended European Search Report (EESR) corresponding to counterpart European Patent Application EP 21911389.1 dated Apr. 10, 2024. [cited by applicant]