Systems and methods for reducing error log required space at low temperatures
A memory testing device uses a master control unit to concurrently operate multiple, intelligent, slave control units (SCUs). SCUs have one or more processing unit(s) (i.e. Finite State Machines, micro controllers, processors) capable of processing one or more firmware with or without operating system (i.e. bare-metal, embedded OS, RTOS (real time operating system)) to perform a series of task defined by firmware(s) for testing volatile and/or non-volatile memory devices connected into one or more DUT devices plus SCU has capability of having operating system and install and run host applications locally within each SCU units to mimic host applications environments along with performing regular memory testing.
1 . A memory testing apparatus, comprising:
a Master Controller Unit (MCU) configured to provide a first functional test pattern to each of at least a first Slave Controller Unit (first SCU) and a second Slave Controller Unit (second SCU);
wherein the first SCU is configured to use the first functional test pattern to operate at least a first Device Under Test board (first DUT) under a stress condition that includes a first temperature and a second temperature, and the second SCU is configured to use the first functional test pattern to operate at least a second Device Under Test board (second DUT) concurrently with operation of the second DUT;
wherein the first temperature is at about −40° C. and the second temperature is at about 125° C.; and
wherein the first DUT has at least a first memory socket, and the second DUT has at least one additional memory socket.
2 . The memory testing apparatus in claim 1 , wherein the first temperature is at −40° C.
3 . The memory testing apparatus in claim 1 , wherein the second temperature is at 125° C.
4 . A method of conducting parallel tests of multiple Devices Under Test (DUTs), comprising:
using a Master Controller Unit (MCU) to cause a first intelligent Slave Controller Unit (first SCU) to run a first functional test pattern against each of a first set of the DUTs under a stress condition including a first temperature and a second temperature, concurrently with a second SCU (second SCU) running a second functional test pattern against each of a different second set of the DUTs, wherein the first temperature is at about −40° C. and the second temperature is at about 125° C.,
while at least one member of one of the first or second sets of DUTs is running a host application.
5 . The method in claim 4 , wherein the first temperature is at −40° C.
6 . The method in claim 4 , wherein the second temperature is at 125° C.