IP Library › Granted Patent US 12,533,837
Granted Patent B2
US 12,533,837 · App. 18/470,393 · Granted Jan 27, 2026

Pressure measurement device and injection molding machine

Inventor: Takumi Sako (Kanagawa, JP)
Assignee: Sodick Co., Ltd.
B29C45/77B29C45/2701B29C2045/2722B29C2945/76006B29C2945/7618B29C2945/76381
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Quick Facts
Patent No.
US 12,533,837
App. No.
18/470,393
Granted
Jan 27, 2026
Kind
B2
Abstract

A pressure measurement device mountable to an injection unit that injects molding material of an injection molding machine, and an injection molding machine are provided. The pressure measurement device includes: a measurement cylinder mounted to the injection unit and through which the molding material injected by the injection unit flows; a plurality of dies mounted to the measurement cylinder and through which the molding material flows, and having different specifications; a flow path switching pin that selectively switches a discharge destination of the molding material to any one of the plurality of dies; and a pressure sensor that measures a pressure of the molding material in the measurement cylinder.

Claims (28)

1 . A pressure measurement device mountable to an injection unit that injects molding material of an injection molding machine, the pressure measurement device comprising:

a measurement cylinder mounted to the injection unit and through which the molding material injected by the injection unit flows;

a plurality of dies mounted to the measurement cylinder and through which the molding material flows, and having different specifications;

a flow path switching pin that selectively switches a discharge destination of the molding material to any one of the plurality of dies; and

a pressure sensor that measures a pressure of the molding material in the measurement cylinder,

wherein the measurement cylinder comprises:

a first cylinder screwed with a nozzle mounting hole of the injection unit; and

a second cylinder in which a die mounting hole to which the plurality of dies are mounted is formed on a side surface,

wherein in a front view, an angle formed by a vertical line passing through a central axis of the second cylinder and a straight line passing through a center of the die mounting hole is 40 degrees or less.

2 . The pressure measurement device according to claim 1 ,

wherein the plurality of dies comprise:

a first capillary die in which a first capillary having a cylindrical cross-sectional shape is formed; and

a second capillary die in which a second capillary having a cylindrical cross-sectional shape is formed,

wherein the first capillary has a predetermined inflow angle, diameter, and effective length, and

the second capillary has the same inflow angle and diameter as the first capillary and has a shorter effective length than the first capillary.

3 . The pressure measurement device according to claim 1 ,

wherein the plurality of dies comprise:

a first slit die in which a first slit having a rectangular cross-sectional shape is formed; and

a second slit die in which a second slit having a rectangular cross-sectional shape is formed,

wherein the first slit has a predetermined inflow angle, width, gap, and effective length, and

the second slit has the same inflow angle, width, and gap as the first slit and has a shorter effective length than the first slit.

4 . The pressure measurement device according to claim 1 , comprising:

a fastener,

wherein the fastener fastens the first cylinder and the second cylinder.

5 . The pressure measurement device according to claim 4 ,

wherein the fastener is a cover nut that abuts a flange formed on the first cylinder and is screwed with the second cylinder.

6 . The pressure measurement device according to claim 1 , further comprising:

a heater that heats the measurement cylinder to a desired temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2023
From: SAKO, TAKUMI
To: SODICK CO., LTD.
Reel/Frame 064991/0332 →
Priority Claims (1)
JP 2022-163288 · Oct 11, 2022 · national
Continuity (1)
Related Publication 20240123666A1 · Apr 18, 2024
References Cited (5)
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US 20130255371A1 · Beaumont · 2013 [cited by examiner]
US 20150084221A1 · Oomori · 2015 [cited by applicant]
FR 2686695 · 1993 [cited by applicant]
JP 2002527741 · 2002 [cited by applicant]