Multilayer hydrophobic film
An inert coating is applied to less than an entirety of a surface of a substrate to form exposed regions on the substrate between the inert coating. Precursors are introduced around the substrate thereby forming a polymer coating directly on the exposed regions of the substrate. The polymer coating can be adsorbed on the exposed regions of the substrate.
1 . A method of deposition comprising:
applying an inert coating to less than an entirety of a surface of a substrate thereby forming exposed regions on the substrate between the inert coating, wherein the inert coating is N,N-dimethyltrimethylsilylamine, N,N-diethyltrimethylsilylamine, chlorotrimethylsilane, methoxytrimethylsilane, ethoxytrimethylsilane, trimethylsilyl trifluoromethanesulfonate, trimethylsilyl fluorosulfonate, or trimethylsilyl chloride; and
introducing precursors around the substrate thereby forming a polymer coating directly on the exposed regions of the substrate and sidewalls of the inert coating, wherein the precursors include dimethyldichlorosilane (DDMS), dimethyldimethoxysilane, diethoxydimethylsilane, or c, 1,3-Dichloro-1,1,3,3-tetramethyldisiloxane.
2 . The method of deposition of claim 1 , wherein the polymer coating is only formed on the exposed regions of the substrate and the sidewalls.
3 . The method of deposition of claim 1 , wherein the polymer coating is formed on the exposed regions of the substrate and extends across the inert coating between exposed regions.
4 . The method of deposition of claim 1 , wherein the polymer coating is adsorbed on the exposed regions of the substrate.
5 . The method of claim 1 , wherein the applying is molecular vapor deposition.
6 . The method of claim 1 , wherein the applying is vapor deposition.
7 . The method of claim 1 , wherein the applying is liquid deposition.
8 . The method of deposition of claim 1 , wherein the exposed regions are greater than 10% of the surface, and wherein the polymer coating includes horizontal growth of polymers in the polymer coating.
9 . The method of deposition of claim 1 , wherein the substrate is silicon or aluminum oxide.
10 . A device comprising:
a substrate;
an inert coating disposed on less than an entirety of the substrate, wherein exposed regions of the substrate are formed between the inert coating, wherein the inert coating is N,N-dimethyltrimethylsilylamine, N,N-diethyltrimethylsilylamine, chlorotrimethylsilane, methoxytrimethylsilane, ethoxytrimethylsilane, trimethylsilyl trifluoromethanesulfonate, trimethylsilyl fluorosulfonate, or trimethylsilyl chloride; and
a polymer coating formed directly on the exposed regions of the substrate and sidewalls of the inert coating, wherein the polymer coating is formed from precursors that include dimethyldichlorosilane (DDMS), dimethyldimethoxysilane, diethoxydimethylsilane, or c, 1,3-Dichloro-1,1,3,3-tetramethyldisiloxane.
11 . The device of claim 10 , wherein the substrate is silicon or aluminum oxide.
12 . The device of claim 10 , wherein the polymer coating is only formed on the exposed regions of the substrate and the sidewalls.
13 . The device of claim 10 , wherein the polymer coating is formed on the exposed regions of the substrate and extends across the inert coating between exposed regions.
14 . The device of claim 10 , wherein the polymer coating is adsorbed on the exposed regions of the substrate.
15 . The device of claim 10 , wherein the exposed regions are greater than 10% of the surface.