RFID package for a tire
View Patent ↗An RFID package for a tire includes a first laminate layer having a first length, a first width, and a first thickness. The RFID package further includes a second laminate layer having a second length, a second width, and a second thickness. An RFID chip is disposed between the first laminate layer and the second laminate layer. At least one of the second length, the second width, and the second thickness is different from the first length, the first width, and the first thickness, respectively.
1 . An RFID package for a tire comprising;
a first laminate layer having a first length, a first width, and a first thickness;
a second laminate layer having a second length, a second width, and a second thickness; and
an RFID chip disposed between the first laminate layer and the second laminate layer;
wherein the first laminate layer is offset from the second laminate layer along at least one of a length of the RFID package and a width of the RFID package.
2 . The RFID package of claim 1 , wherein the second length and the second width are equal to the first length and the first width, respectively.
3 . The RFID package of claim 2 , wherein the second thickness is equal to the first thickness.
4 . The RFID package of claim 1 , wherein the first laminate layer is offset from the second laminate layer along only the length of the RFID package.
5 . The RFID package of claim 1 , wherein the first laminate layer is offset from the second laminate layer along only the width of the RFID package.
6 . The RFID package of claim 1 , wherein the first laminate layer is offset from the second laminate layer along both the length and the width of the RFID package.
7 . The RFID package of claim 1 , further comprising an adhesive that secures the first laminate layer to the second laminate layer.
8 . The RFID package of claim 1 , further comprising mechanical fasteners that secure the first laminate layer to the second laminate layer.
9 . The RFID package of claim 1 , wherein the first laminate layer is secured to the second laminate layer by fusing.
10 . A method of manufacturing an RFID package comprising the steps of:
forming a first laminate layer;
forming a second laminate;
providing an RFID chip between the first laminate layer and the second laminate layer; and
securing the first laminate layer to the second laminate layer;
wherein the step of securing the first laminate layer to the second laminate layer includes offsetting the first laminate layer from the second laminate layer along at least one of a length of the RFID package and a width of the RFID package.
11 . The method of claim 10 , wherein the step of securing includes at least one of using adhesives, using mechanical fasteners, and fusing.
12 . The method of claim 10 , wherein the step of forming the first laminate layer includes forming the first laminate layer with a first length, a first width, and a first thickness, and wherein the step of forming the second laminate layer includes forming the second laminate layer with a second length, a second width, and a second thickness, and wherein the first length, the first width, and the first thickness are equal to the second length, the second width, and the second thickness, respectively.
13 . The method of claim 10 , wherein the step of securing the first laminate layer to the second laminate layer includes offsetting the first laminate layer from the second laminate layer along only the length of the RFID package.
14 . The method of claim 10 , wherein the step of securing the first laminate layer to the second laminate layer includes offsetting the first laminate layer from the second laminate layer along only the width of the RFID package.
15 . The method of claim 10 , wherein the step of securing the first laminate layer to the second laminate layer includes offsetting the first laminate layer from the second laminate layer along both the length and the width of the RFID package.
16 . An RFID package for a tire comprising;
a first laminate layer having a first central portion and a first peripheral portion, a second laminate layer having a second central portion and a second peripheral portion; and
an RFID chip disposed between the first laminate layer and the second laminate layer;
wherein the first laminate layer is tapered so that a thickness of the first laminate layer continuously decreases from a part of the first central portion located over the RFID chip moving outward toward the first peripheral portion.
17 . The RFID package of claim 16 , wherein the taper of the first laminate layer gives the first laminate layer a substantially half-moon-shaped cross section.
18 . The RFID package of claim 16 , wherein the first laminate layer is tapered along a length of the first laminate layer and also a width of the first laminate layer.
19 . The RFID package of claim 16 , wherein the second laminate layer is tapered so that a thickness of the second central portion is greater than a thickness of the second peripheral portion.
20 . The RFID package of claim 16 , wherein the taper of the second laminate layer gives the second laminate layer a substantially half-moon-shaped cross section.