Systems and methods for managing temperatures in wellbores
In some implementations, a plurality of thermoelectric devices may be arranged to cool one or more components of a downhole drilling component during drilling operations. A current can be applied to one or more thermoelectric devices to generate a cooling effect. The thermoelectric devices can be located and arranged so that they cool some or all of a bottom hole assembly or components thereof, such as one or more sensors, batteries, processors, electrics, and the like. The thermoelectric devices also may be located and arranged to cool sensors, batteries, other downhole components, and/or drilling mud in a wellbore during drilling operations. A plurality of thermoelectric devices may be used to generate electric power downhole from a temperature difference. The electric power may be used to power sensors, processors, charge batteries, and be used by one or more downhole electric components, such as those in a bottom hold assembly. One or more thermal storage devices may be used with the thermoelectric devices to store thermal energy for use when needed. A control system may be used to control the activation and/or deactivation of one or more thermoelectric devices to provide cooling or electricity when desired and to switch between such operations.
1 . A bottom hole assembly comprising:
a plurality of thermoelectric devices thermally coupled with a component of a bottom hole assembly (BHA) and electrically coupled with a power source, wherein the plurality of thermoelectric devices are adapted to cool at least a portion of the component when the plurality of thermoelectric devices are activated; and
a control system coupled with the power source and/or the plurality of thermoelectric devices, the control system comprising a processor coupled with a memory, wherein the memory comprises control system instructions executable by the processor for activating the plurality of thermoelectric devices when a drilling mud temperature exceeds a threshold therefor.
2 . The bottom hole assembly of claim 1 , wherein the component comprises at least one of: a sensor, a battery, a processor, a memory device, or an electronic device.
3 . The bottom hole assembly of claim 1 , wherein the power source is located within the BHA.
4 . The bottom hole assembly of claim 1 , wherein the power source comprises a plurality of power sources, and wherein the plurality of power sources comprise a battery and a generator or alternator located in or coupled to the BHA.
5 . The bottom hole assembly of claim 1 , wherein the control system is adapted to activate and deactivate the plurality of thermoelectric devices.
6 . The bottom hole assembly of claim 5 , wherein the control system instructions comprise instructions executable by the processor to activate the plurality of thermoelectric devices when the drilling mud temperature exceeds the threshold for a predetermined time period.
7 . The bottom hole assembly of claim 1 , further comprising a thermally conductive material located adjacent or proximal one or more of the plurality of thermoelectric devices and adapted to conduct thermal heat away from the component.
8 . The bottom hole assembly of claim 5 , wherein the control system instructions comprise instructions executable by the processor for receiving information as to when a slide drilling operation is to begin or determining when the slide drilling operation is to begin and for activating the plurality of thermoelectric devices adapted to cool prior to the beginning of the slide drilling operation.
9 . The bottom hole assembly of claim 5 , wherein the control system instructions comprise instructions executable by the processor for receiving information as to when drilling mud flow ceases or is reduced below a threshold therefor or determining when the drilling mud flow ceases or is reduced below the threshold therefor and for activating the plurality of thermoelectric devices in response thereto.
10 . The bottom hole assembly of claim 1 , wherein the plurality of thermoelectric devices are configured to transfer heat from at least a portion of the component in response to electric current application to the plurality of thermoelectric devices.
11 . The bottom hole assembly of claim 1 , further comprising a means for regulating a variable flow rate of fluid across the plurality of thermoelectric devices.
12 . A bottom hole assembly comprising:
a plurality of thermoelectric devices thermally coupled with a component of a bottom hole assembly (BHA) and electrically coupled with a power source, wherein the plurality of thermoelectric devices are adapted to cool at least a portion of the component when the plurality of thermoelectric devices are activated; and
a control system coupled with the power source and/or the plurality of thermoelectric devices, the control system comprising a processor coupled with a memory, wherein the memory comprises control system instructions executable by the processor for receiving information as to when a slide drilling operation is to begin or determining when the slide drilling operation is to begin and for activating the plurality of thermoelectric devices adapted to cool prior to the beginning of the slide drilling operation.
13 . The bottom hole assembly of claim 12 , wherein the component comprises at least one of: a sensor, a battery, a processor, a memory device, or an electronic device.
14 . The bottom hole assembly of claim 12 , wherein the power source is located within the BHA.
15 . The bottom hole assembly of claim 12 , wherein the power source comprises a plurality of power sources, and wherein the plurality of power sources comprise a battery and a generator or alternator located in or coupled to the BHA.
16 . The bottom hole assembly of claim 12 , wherein the control system is adapted to activate and deactivate the plurality of thermoelectric devices.
17 . The bottom hole assembly of claim 12 , further comprising a thermally conductive material located adjacent or proximal one or more of the plurality of thermoelectric devices and adapted to conduct thermal heat away from the component.
18 . The bottom hole assembly of claim 16 , wherein the control system instructions comprise instructions executable by the processor for receiving information as to when drilling mud flow ceases or is reduced below a threshold therefor or determining when the drilling mud flow ceases or is reduced below the threshold therefor and for activating the plurality of thermoelectric devices in response thereto.
19 . The bottom hole assembly of claim 12 , wherein the plurality of thermoelectric devices are configured to transfer heat from at least a portion of the component in response to electric current application to the plurality of thermoelectric devices.
20 . The bottom hole assembly of claim 12 , further comprising a means for regulating a variable flow rate of fluid across the plurality of thermoelectric devices.
21 . The bottom hole assembly of claim 16 , wherein the control system instructions comprise instructions executable by the processor for activating the plurality of thermoelectric devices when a drilling mud temperature exceeds a threshold therefor.
22 . The bottom hole assembly of claim 16 , wherein the control system instructions comprise instructions executable by the processor for receiving information as to when a slide drilling operation is to begin or determining when the slide drilling operation is to begin and for activating the plurality of thermoelectric devices adapted to cool prior to the beginning of the slide drilling operation.
23 . A bottom hole assembly comprising:
a plurality of thermoelectric devices thermally coupled with a component of a bottom hole assembly (BHA) and electrically coupled with a power source, wherein the plurality of thermoelectric devices are adapted to cool at least a portion of the component when the plurality of thermoelectric devices are activated; and
a control system coupled with the power source and/or the plurality of thermoelectric devices, the control system comprising a processor coupled with a memory, wherein the memory comprises control system instructions executable by the processor for activating the plurality of thermoelectric devices when drilling mud flow ceases or is reduced below a threshold therefor.
24 . The bottom hole assembly of claim 23 , wherein the component comprises at least one of: a sensor, a battery, a processor, a memory device, or an electronic device.
25 . The bottom hole assembly of claim 23 , wherein the power source is located within the BHA.
26 . The bottom hole assembly of claim 23 , wherein the power source comprises a plurality of power sources, and wherein the plurality of power sources comprise a battery and a generator or alternator located in or coupled to the BHA.
27 . The bottom hole assembly of claim 23 , wherein the control system is adapted to activate and deactivate the plurality of thermoelectric devices.
28 . The bottom hole assembly of claim 27 , wherein the control system instructions comprise instructions executable by the processor to activate the plurality of thermoelectric devices when a drilling mud temperature exceeds a threshold therefor.
29 . The bottom hole assembly of claim 28 , wherein the control system instructions comprise instructions executable by the processor to activate the plurality of thermoelectric devices when the drilling mud temperature exceeds the threshold for a predetermined time period.
30 . The bottom hole assembly of claim 23 , further comprising a thermally conductive material located adjacent or proximal one or more of the plurality of thermoelectric devices and adapted to conduct thermal heat away from the component.
31 . The bottom hole assembly of claim 27 , wherein the control system instructions comprise instructions executable by the processor for receiving information as to when a slide drilling operation is to begin or determining when the slide drilling operation is to begin and for activating the plurality of thermoelectric devices adapted to cool prior to the beginning of the slide drilling operation.
32 . The bottom hole assembly of claim 23 , wherein the plurality of thermoelectric devices are configured to transfer heat from at least a portion of the component in response to electric current application to the plurality of thermoelectric devices.
33 . The bottom hole assembly of claim 23 , further comprising a means for regulating a variable flow rate of fluid across the plurality of thermoelectric devices.