Electronic device including a lens assembly

1 . An electronic device, comprising:

a substrate including one or more electrical traces and a dielectric material, the substrate comprising a cavity configured to receive one or more components of the electronic device;

a photonic integrated circuit (PIC) coupled with the substrate, the PIC including one or more optical interconnects, wherein:

the PIC is configured to communicate a photonic signal with one or more optical fibers;

the PIC is configured to process the photonic signal into an electronic signal;

the PIC extends between a first end and a second end;

the substrate comprises a face, the PIC comprises a face, the PIC face is on the substrate face, and the PIC face extends beyond the substrate face; and

the PIC includes a first surface and a second surface, and an edge of the PIC extends between the first surface and the second surface;

an electronic integrated circuit (EIC) coupled with the substrate, wherein the EIC is in communication with the PIC, and the EIC is configured to transmit the electronic signal to the PIC or to receive the electronic signal from the PIC; and

a lens assembly in the cavity, wherein:

the lens assembly is coupled with the first end of the PIC and the lens assembly is coupled with the first surface, the second surface, and the edge of the PIC; and

the one or more optical interconnects of the PIC are aligned with the lens assembly such that the lens assembly is configured to transmit the photonic signal between the PIC and the one or more optical fibers.

2 . The electronic device of claim 1 , wherein:

the PIC includes a first surface and a second surface, and an edge of the PIC extends between the first surface and the second surface; and

the lens assembly forms a direct interface with the edge of the PIC.

3 . The electronic device of claim 1 , wherein the lens assembly is coupled to the PIC with an interference fit.

4 . The electronic device of claim 1 , further comprising an adhesive between the lens assembly and the PIC.

5 . The electronic device of claim 4 , wherein the adhesive is between the substrate and the lens assembly.

6 . The electronic device of claim 1 , wherein the lens assembly cooperates with the PIC to inhibit warping of an edge of the PIC.

7 . The electronic device of claim 1 , wherein the lens assembly comprises a socket configured to receive the first end of the PIC.

8 . The electronic device of claim 1 , wherein:

the PIC includes a first surface and a second surface, and an edge of the PIC extends between the first surface and the second surface; and

the one or more optical interconnects comprise an edge coupler exposed at the edge of the PIC.

9 . The electronic device of claim 1 , wherein the PIC includes a first surface and a second surface, and a thickness of the PIC between the first surface and the second surface is less than or equal to approximately 200 micrometers.

10 . The electronic device of claim 1 , wherein the lens assembly is coupled with a first and second surfaces of the PIC.

11 . The electronic device of claim 1 , wherein the lens assembly comprises a plurality of lenses.

12 . The electronic device of claim 1 , further comprising a fiber array unit configured for coupling with the one or more optical fibers.

13 . The electronic device of claim 12 , wherein the fiber array unit extends into the cavity of the substrate.

14 . An electronic device, comprising:

a substrate including one or more electrical traces and a dielectric material, the substrate comprising a cavity configured to receive one or more components of the electronic device;

a photonic integrated circuit (PIC) coupled with the substrate, the PIC including one or more optical interconnects, wherein:

the PIC is configured to communicate a photonic signal with one or more optical fibers;

the PIC is configured to process the photonic signal into an electronic signal;

the PIC extends between a first end and a second end; and

the substrate comprises a face, the PIC comprises a face, the PIC face is on the substrate face, and the PIC face extends beyond the substrate face;

an electronic integrated circuit (EIC) coupled with the substrate, wherein the EIC is in communication with the PIC, and the EIC is configured to transmit the electronic signal to the PIC or to receive the electronic signal from the PIC;

a lens assembly in the cavity, wherein:

the lens assembly is coupled with the first end of the PIC; and

the one or more optical interconnects of the PIC are aligned with the lens assembly such that the photonic signal between PIC and the one or more optical fibers is transmitted through the lens assembly; and

a fiber array unit configured for coupling with the one or more optical fibers, wherein the fiber array unit extends into the cavity of the substrate; and

the lens assembly is separated from the fiber array unit by a transmission gap, and the photonic signal is communicated between the PIC and the fiber array unit through the transmission gap.

15 . The electronic device of claim 14 , wherein:

the lens assembly comprises a first lens coupled with the PIC and a second lens coupled with the fiber array unit; and

the first lens is aligned with the second lens to transmit the photonic signal between the first lens and the second lens.

16 . The electronic device of claim 14 , wherein:

the PIC includes a first surface and a second surface, and an edge of the PIC extends between the first surface and the second surface; and

the lens assembly forms a direct interface with the edge of the PIC.

17 . The electronic device of claim 14 , wherein:

the PIC includes a first surface and a second surface, and an edge of the PIC extends between the first surface and the second surface; and

the lens assembly is coupled with the first surface, the second surface, and the edge of the PIC.

18 . A method for manufacturing an electronic device, the method comprising:

coupling a photonic integrated circuit (PIC) with a substrate, the substrate comprising a cavity configured to receive one or more components of the electronic device, and wherein the PIC extends between a first end and a second end, the PIC extends between a first end and a second end, and-the substrate comprises a face, the PIC comprises a face, the PIC face is on the substrate face, and the PIC face extends beyond the substrate face;

aligning a lens assembly with the first end of the PIC, wherein:

the PIC is configured to communicate a photonic signal with one or more optical fibers; and

the PIC is configured to process the photonic signal into an electronic signal; and

coupling the lens assembly with the first end of the PIC wherein the lens assembly comprises a socket configured to receive the first end of the PIC, locating the first end of the PIC in the socket of the lens assembly.

19 . The method of claim 18 , further comprising coupling the photonic integrated circuit with an electronic integrated circuit, wherein the electronic integrated circuit is configured to transmit the electronic signal to the PIC or to receive the electronic signal from the PIC.

20 . The method of claim 18 , further comprising forming a direct interface between the lens assembly and an edge of the PIC.

21 . The method of claim 18 , wherein the PIC includes a first surface and a second surface, and a thickness of the PIC between the first surface and the second surface is less than or equal to approximately 200 micrometers.

22 . The method of claim 18 , further comprising locating a fiber array unit within the cavity of the substrate.