High frequency and high power thin-film component
A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm 2 at about 28 GHz.
1 . A surface mount component comprising:
an electrically insulating beam that is thermally conductive, the electrically insulating beam having a first end and a second end that is opposite the first end;
a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam; and
a heat sink terminal formed on the electrically insulating beam adjacent the second end of the electrically insulating beam,
wherein the thin-film component has an area power capacity greater than 2 W/mm 2 at a frequency of about 20 GHz or higher,
wherein the heat sink terminal has a centerline extending parallel to the second end of the electrically insulating beam, the centerline offset from the second end of the electrically insulating beam by a heat sink terminal offset distance,
wherein the surface mount component has an overall length from the first end to the second end of the electrically insulating beam,
wherein the overall length of the surface mount component is greater than about 0.1 mm and less than about 5 mm, and
wherein a ratio of the overall length to the heat sink terminal offset distance is about 2 or greater.
2 . The surface mount component of claim 1 , wherein the thin-film component comprises a first terminal and a second terminal, and wherein each of the first terminal, second terminal, and heat sink terminal are disposed on a first surface of the electrically insulating beam.
3 . The surface mount component of claim 1 , wherein the thin-film component comprises a first terminal and a second terminal, wherein the electrically insulating beam comprises a second surface that is opposite the first surface, and wherein at least one of the first terminal, second terminal, or heat sink terminal wraps around the electrically insulating beam such that at least a portion of the at least one of the first terminal, second terminal, or heat sink terminal is disposed on the second surface.
4 . The surface mount component of claim 1 , wherein the thin-film component comprises a first terminal and a second terminal, and wherein at least one of the first terminal, second terminal, or heat sink terminal is configured as a wrap-around terminal.
5 . The surface mount component of claim 1 , wherein the thin-film component is configured as a flip-chip component.
6 . The surface mount component of claim 1 , wherein the thin-film component has a transmission coefficient that varies less than about 20% across frequencies ranging from about 20 GHz to about 40 GHz.
7 . The surface mount component of claim 1 , wherein the thin-film component has a resistance that varies less than about 10% across frequencies ranging from about 20 GHz to about 40 GHz.
8 . The surface mount component of claim 1 , wherein the thin-film component comprises a first terminal, a second terminal, and a resistive layer connected between the first terminal and the second terminal.
9 . The surface mount component of claim 1 , wherein the electrically insulating beam comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
10 . The surface mount component of claim 1 , wherein the electrically insulating beam comprises at least one of aluminum nitride or beryllium oxide.
11 . The surface mount component of claim 1 , wherein an overall width of the surface mount component is greater than about 0.05 mm and less than about 2.5 mm.
12 . The surface mount component of claim 1 , wherein an overall thickness of the surface mount component is greater than about 0.05 mm and less than about 2.5 mm.
13 . A surface mount component comprising:
an electrically insulating beam that is thermally conductive; and
a thin-film component formed on the electrically insulating beam, the thin-film component including a first terminal, a second terminal, a resistive layer electrically connected between the first terminal and the second terminal, and a frequency compensating conductive layer formed over the resistive layer;
wherein the thin-film component has an area power capacity of greater than 2 W/mm 2 at a frequency of about 20 GHz or higher, and
wherein a thickness of the frequency compensating conductive layer ranges from about 0.01 μm to about 100 μm.
14 . The surface mount component of claim 13 , wherein the area power capacity of the thin-film component is less than about 10 W/mm 2 at about 28 GHz.
15 . A surface mount component comprising:
an electrically insulating beam that is thermally conductive, the electrically insulating beam having a first end and a second end that is opposite the first end along an X direction;
a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam, the thin-film component including a first terminal, a second terminal, and a resistive layer electrically connected between the first terminal and the second terminal; and
a heat sink terminal formed on the electrically insulating beam adjacent the second end of the electrically insulating beam, the heat sink terminal has a centerline extending parallel to the second end of the electrically insulating beam, the centerline of the heat sink terminal offset from the second end of the electrically insulating beam along the X direction by a heat sink terminal offset distance,
wherein the electrically insulating beam comprises at least one of aluminum nitride or beryllium oxide,
wherein the thin-film component has an area power capacity greater than 2 W/mm 2 at a frequency of about 20 GHz or higher,
wherein the surface mount component has an overall length from the first end to the second end of the electrically insulating beam,
wherein the overall length of the surface mount component is greater than about 0.1 mm and less than about 5 mm, and
wherein a ratio of the overall length to the heat sink terminal offset distance is about 2 or greater.
16 . The surface mount component of claim 15 , wherein the thin-film component has a power capacity greater than 1 W at a temperature of about 44.8° C.
17 . The surface mount component of claim 15 , wherein the first terminal and the second terminal are offset from each of the first end and a pair of side surfaces of the electrically insulating beam, wherein the first terminal and the second terminal share a centerline extending parallel to the first end of the electrically insulating beam, wherein the centerline of the first terminal and the second terminal is offset from the first end of the electrically insulating beam by a thin-film terminal offset distance, and wherein a ratio of the overall length to the thin-film terminal offset distance is about 2 or greater.