Robot and substrate shape abnormality examination method
A robot that transfers a substrate includes an arm, a hand, a substrate detector, and a substrate shape abnormality examiner. The hand is installed to the arm and holds and transfers the substrate. The substrate detector detects absence or presence of the substrate in a non-contact manner. The substrate shape abnormality examiner examines the substrate for a shape abnormality based on a height detected by the substrate detector at which the substrate is located when it is not held by the hand.
1 . A robot that transfers a substrate, the robot comprising:
an arm;
a hand that is installed to the arm and holds and transfers the substrate, wherein the hand includes a first finger and a second finger separated along a separation direction;
a mapping sensor including a transmitter installed on the first finger and a receiver installed on the second finger, wherein the mapping sensor detects:
absence or presence of the substrate between the first finger and the second finger using a detection light, and
a height, along a direction perpendicular to the separation direction, at which the substrate is located when not held by the hand; and
circuitry configured to determine whether the substrate includes a shape abnormality by examining the substrate based on a plurality of detected thicknesses, wherein
each of the plurality of detected thicknesses is calculated from height information indicating the height detected by the mapping sensor during vertical movement of the hand, and
each detected thickness is obtained at a different orientation of the hand in a plan view.
2 . The robot according to claim 1 , wherein
the circuitry performs a process of
calculating a maximum value and a minimum value of heights at which the presence of the substrate is detected based on output from the mapping sensor with the hand moved vertically, and
obtaining a detected thickness, which is a difference between the maximum value and the minimum value,
the circuitry performs the process multiple times with an orientation of the detection light varied, and
absence or presence of the shape abnormality of the substrate is determined based on a minimum value of a difference between a detected thickness and an actual thickness of the substrate.
3 . The robot according to claim 1 , further comprising a tilter that tilts an orientation of the hand.
4 . The robot according to claim 1 , wherein
the mapping sensor includes a rangefinder that is installed to the hand to measure a vertical distance to the substrate, and
the circuitry examines the absence or presence of the shape abnormality of the substrate based on each of distances measured by the rangefinder at multiple points of the substrate.
5 . The robot according to claim 1 , wherein the circuitry is further configured to control movement of the hand in a vertical direction, perpendicular to the separation direction, relative to the substrate for the mapping sensor to perform the scanning and while maintaining the hand oriented along a horizontal orientation.
6 . The robot according to claim 5 , wherein the circuitry is further configured to calculate a detected thickness of the substrate based on a distance the hand moved in the vertical direction while the mapping sensor detected the presence of the substrate.
7 . The robot according to claim 6 , wherein the circuitry is further configured to determine whether a difference between the calculated detected thickness and a known actual thickness of the substrate exceeds a predetermined threshold.
8 . The robot according to claim 7 , wherein the circuitry is further configured to determine that the substrate includes the shape abnormality in a case that the difference exceeds the predetermined threshold.
9 . The robot according to claim 8 , wherein in the case that the difference exceeds the predetermined threshold, the circuitry is further configured to control a tilter to change a tilt of the hand relative to a horizontal plane to change an orientation of the detection light relative to the substrate.
10 . The robot according to claim 9 , wherein after the tilt of the hand is changed, the circuitry is configured to acquire a renewed detected thickness by moving the hand vertically relative to the substrate.
11 . The robot according to claim 5 , wherein the circuitry is configured to control the movement of the hand in the vertical direction at a constant speed during the scanning by the mapping sensor.
12 . The robot according to claim 1 , wherein the circuitry is further configured to acquire roll tilt information based on the output of the mapping sensor.
13 . The robot according to claim 3 , wherein the tilter includes a tilter mechanism located between the arm and the hand.
14 . The robot according to claim 13 , wherein the tilter includes a top plate supporting the hand and a bottom plate fixed to the arm.
15 . The robot according to claim 14 , wherein the tilter further includes
a height adjuster between the top plate and the bottom plate, and
the height adjuster includes at least two supports which change a height between the top plate and the bottom plate.
16 . A substrate shape abnormality examination method applied to a robot that transfers a substrate, the robot including an arm, a hand installed to the arm and a mapping sensor installed to the arm, the substrate shape abnormality examination method comprising:
detecting, with the mapping sensor which includes a transmitter installed on a first finger of the hand and a receiver installed on a second finger the hand:
absence or presence of the substrate between the first finger and the second finger using a detection light, and
a height, along a direction perpendicular to the separation direction, at which the substrate is located when not held by the hand; and
determining whether the substrate includes a shape abnormality by examining the substrate based on a plurality of detected thicknesses, wherein
each of the plurality of detected thicknesses is calculated from height information indicating the height detected by the mapping sensor during a vertical movement of the hand, and
each detected thickness is obtained at a different orientation of the hand in a plan view.
17 . The substrate shape abnormality examination method according to claim 16 , further comprising controlling movement of the hand in a vertical direction, perpendicular to the separation direction, relative to the substrate for the mapping sensor to perform the scanning and while maintaining the hand oriented along a horizontal orientation.
18 . The substrate shape abnormality examination method according to claim 17 , further comprising calculating a detected thickness of the substrate based on a distance the hand moved in the vertical direction while the mapping sensor detected the presence of the substrate.
19 . The substrate shape abnormality examination method according to claim 18 , further comprising determining whether a difference between the calculated detected thickness and a known actual thickness of the substrate exceeds a predetermined threshold.
20 . The substrate shape abnormality examination method according to claim 19 , further comprising controlling, in the case that the difference exceeds the predetermined threshold, a tilter to change a tilt of the hand relative to a horizontal plane to change an orientation of the detection light relative to the substrate.