IP Library Granted Patent US 12,544,962
Granted Patent B2
US 12,544,962 · App. 18/428,696 · Granted Feb 10, 2026

Aluminum profile injection bonding method

Inventor: Byungchan Kim (Busan, KR)
B29C45/14467B29C66/52231B29C66/61B29C2045/14967
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Quick Facts
Patent No.
US 12,544,962
App. No.
18/428,696
Granted
Feb 10, 2026
Kind
B2
Abstract

An aluminum profile injection bonding method including a product preparation operation of manufacturing a plurality of aluminum profiles to be bonded in accordance with a product design, a mold preparation operation of manufacturing a mold designed in accordance with the aluminum profiles prepared through the product preparation operation, a seating operation of seating the plurality of aluminum profiles to be bonded in the mold in a state of being in contact with each other, and an injection filling operation of constructing the aluminum profiles to be bonded in an integrated form by filling contact portions of the aluminum profiles with an injection molded material through the mold.

Claims (11)

1 . A method for manufacturing an electric vehicle battery housing including a plurality of aluminum profiles, the method comprising:

implementing a joined state of the electric vehicle battery housing by joining the plurality of aluminum profiles having different cross-sectional structures, and

the implementing the joined state of the electric vehicle battery housing by joining the plurality of aluminum profiles having different cross-sectional structures, comprising:

a product preparation operation (S 110 ) of manufacturing a plurality of aluminum profiles to be bonded in accordance with a product design;

a mold preparation operation (S 120 ) of manufacturing a mold designed in accordance with the aluminum profiles prepared through the product preparation operation (S 110 );

a seating operation (S 130 ) of seating the plurality of aluminum profiles to be bonded in the mold in a state of being in contact with each other; and

an injection filling operation (S 140 ) of constructing the aluminum profiles to be bonded in an integrated form by filling contact portions of the aluminum profiles with an injection molded material through the mold,

wherein the mold preparation operation (S 120 ) includes a mold gate forming operation (S 121 ) of forming a mold gate having a structure that allows the injection molded material to be discharged through the mold and guided into an aluminum profile bonding portion in accordance with a formation position of a filling hole of each of the aluminum profiles,

wherein the injection filling operation (S 140 ) includes a side through-hole forming operation (S 141 ) of guiding the injection molded material to be bound to the aluminum profiles in an integrated form by machining a through-hole ( 12 ) in a side surface of each of the aluminum profiles,

wherein the injection filling operation (S 140 ) includes a pin inserting operation (S 142 ) of binding the injection molded material to the aluminum profiles in the integrated form by inserting a pin ( 30 ) into the through-hole formed through the side through-hole forming operation (S 141 ), and

wherein the injection filling operation (S 140 ) includes a block mounting operation (S 143 ) of mounting a block ( 40 ) inside the aluminum profiles to form a space of a predetermined volume adjacent to a bonding portion inside each of the aluminum profiles.

Priority Claims (1)
KR 10-2023-0052787 · Apr 21, 2023 · national
Continuity (1)
Related Publication 20240351253A1 · Oct 24, 2024
References Cited (15)
US 5128085A · Post · 1992 [cited by examiner]
US 6365086B1 · Schoonover · 2002 [cited by examiner]
US 8652382B2 · Eggert · 2014 [cited by examiner]
US 9085107B2 · Wittenberg · 2015 [cited by examiner]
US 10689899B2 · Koster · 2020 [cited by examiner]
DE 2235791A1 · 1974 [cited by applicant]
DE 2444267A1 · 1975 [cited by applicant]
DE 4040048A1 · 1991 [cited by applicant]
DE 102009052110A1 · 2011 [cited by applicant]
DE 102010036641A1 · 2011 [cited by applicant]
DE 102017010863A1 · 2019 [cited by applicant]
JP 07144267A · 1995 [cited by applicant]
JP 11507609 · 1999 [cited by examiner]
KR 101277453B1 · 2013 [cited by applicant]
Communication dated Feb. 18, 2025 issued by the German Patent Office in application No. 10202410930.7. [cited by applicant]