Electroconductive thermal insulating material and infrared sensor
View Patent ↗An electroconductive thermal insulating material includes first domains and at least one second domain. The first domains each have a phononic crystal, and the phononic crystal has holes arranged in plan view. The second domain is a domain formed around the first domain in plan view and having no hole.
1 . An infrared sensor comprising:
a substrate;
an infrared receiver; and
an electroconductive thermal insulating material, wherein
the electroconductive thermal insulating material comprises:
first domains each having a phononic crystal, the phononic crystal having holes arranged in plan view;
at least one second domain formed around the first domain in plan view and having no hole,
a connected portion connected to at least one selected from the group consisting of the substrate and a member on the substrate; and
a separated portion separated from the substrate, wherein
the first domains are divided from each other by the second domain,
in plan view, the first domain has a substantially polygonal shape in which at least one interior angle is greater than 90°,
the infrared receiver is joined to the separated portion of the electroconductive thermal insulating material,
the infrared receiver is supported by the electroconductive thermal insulating material in a state where the infrared receiver is separated from the substrate, and
the electroconductive thermal insulating material includes, between a joined portion thereof joined to the infrared receiver and the connected portion, the first domain and the second domain.
2 . The infrared sensor according to claim 1 , wherein
the infrared receiver is a thermopile infrared receiver,
the electroconductive thermal insulating material has:
a first region having a first Seebeck coefficient;
a second region having a second Seebeck coefficient different from the first Seebeck coefficient; and
a joining region joining the first region and the second region to each other, and
the infrared receiver is joined to the joining region of the electroconductive thermal insulating material.
3 . The infrared sensor according to claim 1 , wherein
the infrared receiver is a bolometer infrared receiver, and
the infrared sensor comprises:
a first wiring and a second wiring both electrically connected to the infrared receiver;
a first signal processing circuit electrically connected to the first wiring; and
a second signal processing circuit electrically connected to the second wiring.
4 . The infrared sensor according to claim 1 , wherein
the first domain and the second domain are formed throughout the separated portion of the electroconductive thermal insulating material.
5 . The infrared sensor according to claim 1 , wherein
in plan view, the first domain has a shape capable of tessellation.
6 . The infrared sensor according to claim 1 , wherein
in plan view, the first domain has a substantially obtuse triangular shape, a substantially parallelogrammic shape, or a substantially parallel hexagonal shape.
7 . The infrared sensor according to claim 1 , wherein
in plan view, the first domain has a substantially hexagonal shape, and
the first domains are arranged in a substantially honeycomb pattern.
8 . The infrared sensor according to claim 1 , wherein
the holes are arranged with a periodicity P in plan view, and
the first domain has an area of 25 P 2 or more in plan view.
9 . The infrared sensor according to claim 1 , wherein
the second domain includes:
a base layer formed to be flush with the first domain; and
a reinforcing layer disposed on the base layer.