Test device capable of testing micro LED and manufacturing method thereof
Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (μm).
1 . A test device comprising:
an insulation member having a flat plate shape; and
a conductive part integrally provided with a wiring part that is provided inside the insulation member and with a connection part which is provided outside the insulation member and which is configured to be connected to a test object,
wherein the insulation member is an anodic oxide film in which a base metal is anodized and then the base metal is removed.
2 . The test device of claim 1 , wherein a thickness of the conductive part is equal to or less than a thickness of the insulation member.
3 . The test device of claim 1 , wherein the insulation member is a patternable material.
4 . The test device of claim 1 , wherein the conductive part is provided such that a plurality of conductive parts is formed, the connection parts of the conductive parts adjacent to each other comprise a first unit connection part and a second unit connection part that are having shapes left and right symmetrical with each other, and a pitch distance between a tip end part of the first unit connection part and a tip end part of the second unit connection part is smaller than a pitch distance between a base end part of the first unit connection part and a base end part of the second unit connection part.
5 . The test device of claim 1 , wherein the connection part comprises:
a first unit connection part configured to be connected to a first electrode of the test object; and
a second unit connection part configured to be connected to a second electrode of the test object, and
the first unit connection part and the second unit connection part have shapes left and right symmetrical with each other.
6 . The test device of claim 1 , wherein the wiring part comprises a bonding pad to which a circuit part is bonded.
7 . The test device of claim 1 , wherein the conductive part is provided with a plurality of conductive parts, and a pitch distance of the wiring parts at a side of the connection part is smaller than a pitch distance of the wiring parts at a side of a bonding pad.
8 . The test device of claim 1 , wherein the insulation member has a thickness of equal to or more than 10 μm and equal to or less than 200 μm.
9 . A test device comprising:
at least one insulation member having a flat plate shape in which an area of an x-y plane is larger than a thickness in a z direction; and
at least one conductive part having a thickness equal to or less than the thickness of the insulation member, the conductive part having a first portion mounted inside the insulation member and having a second portion that is positioned by extending outward to the insulation member,
wherein the at least one insulation member is a plurality of insulation members, and the at least one conductive part is a plurality of conductive part;
wherein the test device is configured such that the plurality of insulation member is bonded to each other by a bonding part; and
wherein a thickness in the z direction of the bonding part affects a pitch distance between a plurality of conductive parts.
10 . A test device comprising:
at least one insulation member having a flat plate shape that has a first surface of an x-y plane and a second surface of the x-y plane facing the first surface; and
at least one conductive part having at least a portion provided between the first surface and the second surface such that the portion is positioned on a penetration part that extends inward from any one side portion of the insulation member, the conductive part having a remaining portion positioned by extending outward to the insulation member and being configured to be connected to a test object,
wherein the at least one insulation member is a plurality of insulation members, and the at least one conductive part is a plurality of conductive part;
wherein the test device is configured such that the plurality of insulation members is bonded to each other by a bonding part; and
wherein a thickness in a z direction of the bonding part affects a pitch distance between the plurality of conductive parts.