Semiconductor devices
A semiconductor device includes an active pattern disposed on a substrate; a gate structure disposed on the active pattern; channels disposed on the substrate and that are spaced apart from each other in a vertical direction substantially perpendicular to an upper surface of the substrate; a first epitaxial layer disposed on a portion of the active pattern adjacent to the gate structure; and a contact plug disposed on the first epitaxial layer. The contact plug includes a lower portion; a middle portion disposed on the lower portion, where the middle portion has a width that increases from a bottom to a top thereof along the vertical direction; and an upper portion disposed on the middle portion.
1 . A semiconductor device, comprising:
an active pattern disposed on a substrate;
a gate structure disposed on the active pattern;
channels disposed on the substrate, where the channels are spaced apart from each other in a vertical direction that is substantially perpendicular to an upper surface of the substrate;
a first epitaxial layer disposed on a portion of the active pattern adjacent to the gate structure; and
a contact plug disposed on the first epitaxial layer, wherein the contact plug includes:
a lower portion;
a middle portion disposed on the lower portion, wherein the middle portion has a width that increases monotonically along the vertical direction from a bottom to a top thereof; and
an upper portion disposed on the middle portion,
wherein a width in the first direction of the lower portion of the contact plug is substantially constant in the vertical direction, and
wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug, and a width of the lower surface of the middle portion of the contact plug is substantially same as a width of the upper surface of the lower portion of the contact plug.
2 . The semiconductor device as claimed in claim 1 , wherein an upper surface of the middle portion of the contact plug is substantially coplanar with an uppermost surface of the first epitaxial layer.
3 . The semiconductor device as claimed in claim 2 , wherein a width of the upper surface of the middle portion of the contact plug is substantially the equal to a width of a lower surface of the upper portion of the contact plug.
4 . The semiconductor device as claimed in claim 1 , wherein:
the active pattern extends in a first direction substantially parallel to the upper surface of the substrate,
the gate structure extends in a second direction substantially parallel to the upper surface of the substrate and that crosses the first direction,
the first epitaxial layer is formed on the portion of the active pattern adjacent to the gate structure in the first direction, and
the width in the first direction of the middle portion of the contact plug increases from the bottom to the top thereof along the vertical direction.
5 . The semiconductor device as claimed in claim 1 , wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug.
6 . The semiconductor device as claimed in claim 5 , further comprising a second epitaxial layer disposed on the first epitaxial layer, wherein the second epitaxial layer contacts a sidewall of the upper portion of the contact plug.
7 . The semiconductor device as claimed in claim 6 , wherein the second epitaxial layer includes one of silicon or silicon doped with p-type impurities.
8 . The semiconductor device as claimed in claim 6 , further comprising:
a first ohmic contact pattern interposed between the contact plug and the first epitaxial layer; and
a second ohmic contact pattern interposed between the contact plug and the second epitaxial layer.
9 . The semiconductor device as claimed in claim 1 , wherein the first epitaxial layer includes silicon doped with n-type impurities.
10 . A semiconductor device, comprising:
an active pattern disposed on a substrate;
a gate structure disposed on the active pattern;
channels disposed on the substrate, where the channels are spaced apart from each other in a vertical direction that is substantially perpendicular to the upper surface of the substrate;
a first epitaxial layer disposed on a portion of the active pattern adjacent to the gate structure;
a contact plug that includes:
a lower portion and a middle portion sequentially stacked in the vertical direction, wherein the lower portion and the middle portion extend through an upper portion of the first epitaxial layer; and
an upper portion disposed on the middle portion, wherein the upper portion extends in the vertical direction; and
a second epitaxial layer disposed on the middle portion of the contact plug, wherein the second epitaxial layer contacts a portion of a sidewall of the upper portion of the contact plug,
wherein the middle portion has a width that increases monotonically along the vertical direction from a bottom to a top thereof,
wherein a width in the first direction of the lower portion of the contact plug is substantially constant in the vertical direction, and
wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug, and a width of the lower surface of the middle portion of the contact plug is substantially same as a width of the upper surface of the lower portion of the contact plug.
11 . The semiconductor device as claimed in claim 10 , wherein the first epitaxial layer includes silicon doped with n-type impurities.
12 . The semiconductor device as claimed in claim 10 , wherein the second epitaxial layer includes one of silicon or silicon doped with p-type impurities.
13 . The semiconductor device as claimed in claim 10 , wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug.
14 . The semiconductor device as claimed in claim 10 , further comprising:
a first ohmic contact pattern interposed between the first epitaxial layer, and each of the lower portion and the middle portion of the contact plug; and
a second ohmic contact pattern interposed between the second epitaxial layer and the upper portion of the contact plug.
15 . The semiconductor device as claimed in claim 10 , wherein:
the active pattern extends in a first direction substantially parallel to the upper surface of the substrate,
the gate structure extends in a second direction substantially parallel to the upper surface of the substrate and that crosses the first direction,
the first epitaxial layer is formed on the portion of the active pattern adjacent to the gate structure in the first direction,
a width in the first direction of the middle portion of the contact plug increases from a bottom to a top thereof along the vertical direction, and
a width in the first direction of the lower portion of the contact plug increases from a bottom to a top thereof along the vertical direction.
16 . The semiconductor device as claimed in claim 10 , wherein an upper surface of the second epitaxial layer has an upwardly curved convex shape.
17 . A semiconductor device, comprising:
an active pattern disposed on a substrate, wherein the active pattern extends in a first direction that is substantially parallel to an upper surface of the substrate;
a gate structure on the active pattern, wherein the gate structure extends in a second direction that is substantially parallel to the upper surface of the substrate and crosses the first direction;
channels disposed on the active pattern and that are spaced apart from each other in a third direction that is substantially perpendicular to the upper surface of the substrate;
a first epitaxial layer disposed on a portion of the active pattern adjacent in the first direction to the gate structure, wherein the first epitaxial layer includes silicon doped with n-type impurities;
a contact plug disposed on the first epitaxial layer, wherein the contact plug includes:
a lower portion;
a middle portion disposed on the lower portion, wherein the middle portion has a width in the first direction that increases monotonically from a bottom to a top thereof along the vertical direction; and
a upper portion disposed on the middle portion; and
a second epitaxial layer on the middle portion of the contact plug, the second epitaxial layer contacting a portion of a sidewall in the first direction of the upper portion of the contact plug and including silicon or silicon doped with p-type impurities,
wherein a width in the first direction of the lower portion of the contact plug is substantially constant in the vertical direction, and
wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug, and a width of the lower surface of the middle portion of the contact plug is substantially same as a width of the upper surface of the lower portion of the contact plug.
18 . The semiconductor device as claimed in claim 17 , wherein an upper surface of the middle portion of the contact plug is substantially coplanar with an uppermost surface of the first epitaxial layer.
19 . The semiconductor device as claimed in claim 17 , wherein a width of an upper surface of the middle portion of the contact plug is greater than a width of a lower surface of the upper portion of the contact plug.
20 . The semiconductor device as claimed in claim 17 , further comprising:
a first ohmic contact pattern interposed between the contact plug and the first epitaxial layer; and
a second ohmic contact pattern interposed between the contact plug and the second epitaxial layer.