Silicon controlled rectifiers
The present disclosure relates to semiconductor structures and, more particularly, to silicon control rectifiers and methods of manufacture. The structure includes: a first well in a semiconductor substrate; a second well in the semiconductor substrate; a third well in the semiconductor substrate which isolates the first well from the second well; and a first diffusion region at a surface of the semiconductor substrate and which extends into the first well and the second well, the first diffusion region includes a same polarity as the third well.
1 . A structure comprising:
a first well in a semiconductor substrate;
a second well in the semiconductor substrate;
a third well in the semiconductor substrate which isolates the first well from the second well;
a first diffusion region at a surface of the semiconductor substrate and which extends into the first well and the second well, the first diffusion region comprises a same polarity as the third well; and
a silicide blocking material over the first diffusion region and the third well.
2 . The structure of claim 1 , wherein the first diffusion region is longer than the third well such that the first diffusion region extends into the first well and the second well.
3 . The structure of claim 2 , wherein the first well and the second well comprise P-wells and the third well comprises an N-well.
4 . The structure of claim 3 , wherein the semiconductor substrate comprises semiconductor on insulator material, and the third well contacts to a buried insulator layer under the semiconductor on insulator material to isolate the first well from the second well.
5 . A structure comprising:
a first well in a semiconductor substrate;
a second well in the semiconductor substrate;
a third well in the semiconductor substrate which isolates the first well from the second well; and
a first diffusion region at a surface of the semiconductor substrate and which extends into the first well and the second well, the first diffusion region comprises a same polarity as the third well,
wherein the first well and the second well comprise P-wells and the third well comprises an N-well,
the first diffusion region is longer than the third well such that the first diffusion region extends into the first well and the second well, and
the first well is deeper into the semiconductor substrate than the first diffusion region and has a lower concentration of dopant than the first diffusion region.
6 . The structure of claim 3 , further comprising a second diffusion region comprising a same polarity as the first diffusion region, the second diffusion region contacting the first diffusion region and being separated from the third well by the first diffusion region.
7 . The structure of claim 6 , wherein, relative to one another, the third well comprises a deepest depth in the semiconductor substrate, the second diffusion region comprises an intermediate depth in the semiconductor substrate and the first diffusion region comprises a shallowest depth in the semiconductor substrate.
8 . The structure of claim 6 , wherein, relative to one another, the third well comprises a lowest concentration of dopant, the second diffusion region comprises an intermediate concentration of the dopant and the first diffusion region comprises a highest concentration of the dopant.
9 . The structure of claim 6 , wherein the third well is surrounded by the first diffusion region comprising an N+ diffusion region and the first diffusion region is surrounded by the second diffusion region comprising an N− diffusion region.
10 . The structure of claim 6 , further comprising a silicide blocking material over the first diffusion region, the second diffusion region and the third well.
11 . The structure of claim 1 , further comprising diffusion regions separated by plurality of shallow trench isolation structures and provided in the first well and the second well, the diffusion regions connecting to an anode and a cathode.
12 . A structure comprising:
a first well in a semiconductor substrate and electrically coupled to an anode;
a second well in the semiconductor substrate and electrically coupled to a cathode;
a third well in the semiconductor substrate which isolates the first well from the second well; and
a diffusion region extending over the third well and into the first well and the second well,
wherein the third well and the diffusion region comprise a first polarity type with different dopant concentrations, and the first well and the second well comprise a second polarity type different from the first polarity type.
13 . The structure of claim 12 , wherein the first polarity type is an N-type dopant and the second polarity type is a P-type dopant.
14 . The structure of claim 12 , wherein the third well is deeper in the semiconductor substrate than the diffusion region.
15 . The structure of claim 12 , further comprising a second diffusion region in the first well and the second well, the second diffusion region surrounding and in contact with the diffusion region, being remote from the first well, and which comprises the N-type dopant.
16 . The structure of claim 15 , wherein the second diffusion region has a dopant concentration greater than the third well and the diffusion region has a dopant concentration greater than both the second diffusion region and the third well.
17 . A method comprising:
forming a first well in a semiconductor substrate;
forming a second well in the semiconductor substrate;
forming a third well in the semiconductor substrate which isolates the first well from the second well; and
forming a first diffusion region at a surface of the semiconductor substrate and which extends into the first well and the second well, the first diffusion region comprises a same polarity as the third well,
wherein the third well and the diffusion region comprise a first polarity type with different dopant concentrations, and the first well and the second well comprise a second polarity type different from the first polarity type.