Formation method of semiconductor device with stacked conductive structures
A method for forming a semiconductor device structure is provided. The method includes forming a first conductive structure surrounded by a first dielectric layer and forming a second dielectric layer over the first conductive structure and the first dielectric layer. The method also includes forming a via hole in the second dielectric layer, and the via hole exposes the first conductive structure. The method further includes partially removing the first conductive structure through the via hole to form a recess in the first conductive structure. In addition, the method includes forming a second conductive structure filling the recess and the via hole.
1 . A method for forming a semiconductor device structure, comprising:
forming a source/drain structure over a semiconductor substrate;
forming a first conductive structure over the source/drain structure;
forming a dielectric layer over the first conductive structure;
forming a via hole in the dielectric layer to partially expose the first conductive structure;
partially removing the first conductive structure through the via hole to form a recess in the first conductive structure, wherein the recess has a width that is greater than a bottom width of the via hole;
forming an interfacial layer in the recess, wherein the interfacial layer is in direct contact with the first conductive structure, and an entirety of the first conductive structure is below the interfacial layer; and
forming a second conductive structure to fill the recess and the via hole, wherein the interfacial layer and the second conductive structure are formed in-situ in a same process chamber without breaking vacuum before the second conductive structure is formed.
2 . The method for forming a semiconductor device structure as claimed in claim 1 , wherein the second conductive structure is formed to be in direct contact with the interfacial layer and the dielectric layer.
3 . The method for forming a semiconductor device structure as claimed in claim 1 , wherein the interfacial layer is selectively deposited on a surface of the first conductive structure exposed by the recess, and the interfacial layer does not extend along a sidewall of the via hole.
4 . The method for forming a semiconductor device structure as claimed in claim 1 , wherein the first conductive structure, the interfacial layer, and the second conductive structure are made of different materials.
5 . The method for forming a semiconductor device structure as claimed in claim 1 , further comprising forming a second dielectric layer over the semiconductor substrate before the dielectric layer is formed, wherein the second dielectric layer surrounds the first conductive structure.
6 . The method for forming a semiconductor device structure as claimed in claim 5 , wherein the recess partially exposes the second dielectric layer before the second conductive structure is formed.
7 . The method for forming a semiconductor device structure as claimed in claim 6 , wherein the second conductive structure is in direct contact with the second dielectric layer.
8 . The method for forming a semiconductor device structure as claimed in claim 5 , further comprising forming an etch stop layer over the second dielectric layer and the first conductive structure before the dielectric layer is formed.
9 . The method for forming a semiconductor device structure as claimed in claim 1 , wherein an entirety of the interfacial layer is below a bottommost surface of the dielectric layer.
10 . The method for forming a semiconductor device structure as claimed in claim 1 , wherein the first conductive structure comprises a metal material.
11 . A method for forming a semiconductor device structure, comprising:
forming a first conductive structure surrounded by a first dielectric layer;
forming a second dielectric layer over the first conductive structure and the first dielectric layer;
forming a via hole in the second dielectric layer, wherein the via hole exposes the first conductive structure while the first dielectric layer is covered by the second dielectric layer;
partially removing the first conductive structure through the via hole to form a recess in the first conductive structure;
forming an interfacial layer in the recess, wherein the interfacial layer is in direct contact with the first conductive structure;
forming a second conductive structure filling the recess and the via hole, wherein the second conductive structure is in direct contact with the first dielectric layer; and
forming an etch stop layer over the first dielectric layer and the first conductive structure before the second dielectric layer is formed, wherein the recess exposes a lower surface of the etch stop layer after the formation of the interfacial layer and before the formation of the second conductive structure.
12 . The method for forming a semiconductor device structure as claimed in claim 11 , wherein the recess exposes a sidewall of the first dielectric layer.
13 . The method for forming a semiconductor device structure as claimed in claim 11 , wherein the second conductive structure has a first portion and a second portion, the first portion penetrates through the second dielectric layer, the second portion extends into the first conductive structure, a top of the second portion of the second conductive structure is wider than a bottom of the first portion of the second conductive structure.
14 . The method for forming a semiconductor device structure as claimed in claim 11 , wherein the interfacial layer and the second conductive structure are formed in-situ in a same process chamber.
15 . The method for forming a semiconductor device structure as claimed in claim 11 , wherein an entirety of the interfacial layer is below a bottommost surface of the second dielectric layer.
16 . A method for forming a semiconductor device structure, comprising:
forming a first conductive structure surrounded by a first dielectric layer, wherein the first conductive structure comprises cobalt, ruthenium, tungsten, molybdenum, aluminum, or a combination thereof;
forming a second dielectric layer over the first conductive structure and the first dielectric layer;
forming a via hole in the second dielectric layer, wherein the via hole exposes the first conductive structure;
partially removing the first conductive structure through the via hole to form a recess in the first conductive structure;
forming a second conductive structure filling the recess and the via hole, wherein the second conductive structure is in direct contact with the first dielectric layer; and
forming an interfacial layer directly on the first conductive structure before the formation of the second conductive structure.
17 . The method for forming a semiconductor device structure as claimed in claim 16 , wherein the interfacial layer is in direct contact with the first dielectric layer and the second conductive structure.
18 . The method for forming a semiconductor device structure as claimed in claim 16 , wherein the interfacial layer is selectively formed on the first conductive structure, and the interfacial layer does not extend along a sidewall of the via hole.
19 . The method for forming a semiconductor device structure as claimed in claim 16 wherein the second conductive structure is physically separated from the first conductive structure by the interfacial layer.
20 . The method for forming a semiconductor device structure as claimed in claim 16 , wherein a topmost surface of the interfacial layer is located vertically between a bottommost surface of the second conductive structure and the second dielectric layer.