Camera module and electronic device comprising same
A camera module according to an embodiment may comprise: a printed circuit board including a first opening; a housing assembly comprising a housing arranged on a first surface of the printed circuit board; a first rear member comprising a plate arranged on a second surface of the printed circuit board, and arranged to overlap with the first opening and a part of the printed circuit board; a second rear member comprising a support arranged on the second surface of the printed circuit board and including a second opening in which the first rear member is arranged, and has a thickness thicker than a thickness of the first rear member; an image sensor arranged on one surface of the first rear member and exposed toward the housing assembly through the first opening; and at least one lens aligned to have the same optical axis of the image sensor, and arranged in the inner space of the housing assembly.
1 . A camera module comprising:
a printed circuit board including a first opening;
a housing assembly comprising a housing disposed on a first surface of the printed circuit board;
a first back member comprising a plate disposed on a second surface of the printed circuit board and disposed to overlap the first opening and a portion of the printed circuit board;
a second back member comprising a support disposed on the second surface of the printed circuit board, including a second opening in which the first back member is disposed, and having a thickness thicker than a thickness of the first back member;
an image sensor disposed on one surface of the first back member and exposed toward the housing assembly through the first opening; and
at least one lens disposed in an interior space of the housing assembly aligned to have a same optical axis as the image sensor.
2 . The camera module of claim 1 , wherein the first back member includes a metal plate having a flatness of a specified value or more.
3 . The camera module of claim 2 , wherein the second back member comprises a same material as the first back member.
4 . The camera module of claim 1 , wherein the second back member comprises a shock absorbing material or a material having higher strength than a strength of the first back member.
5 . The camera module of claim 1 , wherein the second back member includes a plurality of sub-back members.
6 . The camera module of claim 1 , wherein the second back member includes:
a first sub-back member including a third opening; and
a second sub-back member disposed in the third opening and including the second opening.
7 . The camera module of claim 6 , wherein the first back member has a first thickness,
the first sub-back member has a second thickness greater than the first thickness, and
the second sub-back member has a third thickness greater than the first thickness and less than the second thickness.
8 . The camera module of claim 6 , wherein the first back member comprises a shock absorbing material or a material having higher strength than a strength of the first back member, and
the second sub-back member comprises a same material as the first back member.
9 . The camera module of claim 1 , wherein the second back member has a stacked structure in a direction of the optical axis, and
the second back member includes:
a first sub-back member attached to the printed circuit board; and
a second sub-back member attached to the first sub-back member.
10 . The camera module of claim 9 , wherein the first back member has a first thickness,
the first sub-back member has a second thickness equal to or greater than the first thickness, and
the second sub-back member has a third thickness less than the first thickness.
11 . The camera module of claim 9 , wherein the first sub-back member comprises a same material as the first back member, and
the second sub-back member comprises a shock absorbing material or a material having higher strength than a strength of the first back member.
12 . The camera module of claim 1 , wherein the first back member is spaced apart from the second back member by a specified distance.
13 . An electronic device comprising:
a first plate;
a second plate; and
a camera module at least partially disposed in a space formed between the first plate and the second plate,
wherein the camera module includes:
a printed circuit board including a first opening;
a housing assembly comprising a housing disposed on a first surface of the printed circuit board;
a first back member comprising a plate disposed on a second surface of the printed circuit board and disposed to overlap the first opening and a portion of the printed circuit board;
a second back member comprising a support disposed on the second surface of the printed circuit board, including a second opening in which the first back member is disposed, and having a thickness thicker than a thickness of the first back member;
an image sensor disposed on one surface of the first back member and exposed toward the housing assembly through the first opening; and
at least one lens disposed in an interior space of the housing assembly aligned to have a same optical axis as the image sensor.
14 . The electronic device of claim 13 , further comprising a support disposed in a space formed between the first plate and the second plate,
wherein the second back member is configured to support the camera module by contacting at least a portion of the support, and
the first back member is spaced apart from the support by a specified distance.
15 . The electronic device of claim 13 , wherein the second back member has a stacked structure in a direction of the optical axis,
the second back member includes:
a first sub-back member attached to the printed circuit board; and
a second sub-back member attached to the first sub-back member,
the first back member has a first thickness,
the first sub-back member has a second thickness equal to or greater than the first thickness, and
the second sub-back member has a third thickness less than the first thickness.
16 . The electronic device of claim 13 , wherein the first back member includes a metal plate having a flatness of a specified value or more.
17 . The electronic device of claim 13 , wherein the second back member includes a plurality of sub-back members.
18 . The electronic device of claim 17 , wherein the second back member includes:
a first sub-back member including a third opening; and
a second sub-back member disposed in the third opening and including the second opening.
19 . The electronic device of claim 18 , further comprising a support disposed in a space formed between the first plate and the second plate.
20 . The electronic device of claim 19 , wherein the first sub-back member is configured to support the camera module by contacting at least a portion of the support, and
the second sub-back member is spaced apart from the support by a first distance, and
the first sub-back member is spaced apart from the support by a second distance greater than the first distance.