Integrated circuit device and method of manufacturing the same

1 . An integrated circuit device comprising:

a plurality of lower electrodes above a substrate;

a supporter between the plurality of lower electrodes;

an upper electrode on the plurality of lower electrodes; and

a capacitor dielectric film between the upper electrode and the plurality of lower electrodes, wherein

the supporter includes one of a metal oxide, a metal nitride, and a metal oxynitride,

a portion of the capacitor dielectric film includes a dopant, and

the dopant in the portion of the capacitor dielectric film and a metal in the supporter are a same metal.

2 . The integrated circuit device of claim 1 , wherein

the metal in the supporter includes at least one of aluminum (Al), silicon (Si), cobalt (Co), magnesium (Mg), calcium (Ca), yttrium (Y), tantalum (Ta), tin (Sn), molybdenum (Mo), strontium (Sr), lanthanum (La), gadolinium (Gd), and zinc (Zn).

3 . The integrated circuit device of claim 2 , wherein

the supporter is in contact with the capacitor dielectric film at an interface between the supporter and the capacitor dielectric film.

4 . The integrated circuit device of claim 3 , wherein

the portion of the capacitor dielectric film that includes the dopant is adjacent to the interface between the supporter and the capacitor dielectric film.

5 . The integrated circuit device of claim 4 , wherein a concentration of the metal in the portion of the capacitor dielectric film decreases as a distance increases away from the interface between the supporter and the capacitor dielectric film.

6 . The integrated circuit device of claim 5 , wherein

a region of the capacitor dielectric film adjacent to the upper electrode is not substantially doped with the same metal as the metal in the supporter.

7 . The integrated circuit device of claim 5 , wherein

the capacitor dielectric film includes a first dielectric material and a layer of a second dielectric material,

the second dielectric material is different than the first dielectric material, and

the layer of a second dielectric material is in a region of the capacitor dielectric film adjacent to the upper electrode.

8 . The integrated circuit device of claim 7 , wherein

the first dielectric material includes zirconium oxide (ZrO 2 ), and

the second dielectric material includes aluminum oxide (Al 2 O 3 ).

9 . The integrated circuit device of claim 1 , wherein each of the plurality of lower electrodes has a pillar shape or a cylindrical shape and extends in a direction that is perpendicular to the substrate.

10 . The integrated circuit device of claim 9 , wherein

the supporter is in contact with a side wall of each of the plurality of lower electrodes, and

the capacitor dielectric film is conformally on an outer surface of the supporter and an outer surface of each of the plurality of lower electrodes.

11 . An integrated circuit device comprising:

a plurality of lower electrodes above a substrate;

a supporter between the plurality of lower electrodes;

an upper electrode on the plurality of lower electrodes; and

a capacitor dielectric film between the upper electrode and the plurality of lower electrodes, wherein

the supporter includes a first supporter and a second supporter,

the first supporter includes one of a metal oxide, a metal nitride, and a metal oxynitride,

the first supporter is in contact with the capacitor dielectric film,

the second supporter does not include metal,

the second supporter is surrounded by the first supporter,

the second supporter is not in contact with the capacitor dielectric film,

a portion of the capacitor dielectric film includes a dopant, and

the dopant in the portion of the capacitor dielectric film and a metal in the first supporter are a same metal.

12 . The integrated circuit device of claim 11 , wherein

the metal in the first supporter includes at least one of aluminum (Al), silicon (Si), cobalt (Co), magnesium (Mg), calcium (Ca), yttrium (Y), tantalum (Ta), tin (Sn), molybdenum (Mo), strontium (Sr), lanthanum (La), gadolinium (Gd), and zinc (Zn), and

the second supporter includes silicon nitride.

13 . The integrated circuit device of claim 12 , wherein

the portion of the capacitor dielectric film and the first supporter are in contact with each other through an interface between the first supporter and the capacitor dielectric film.

14 . The integrated circuit device of claim 11 , wherein

the first supporter is on each of a top surface of the second supporter and a bottom surface of the second supporter.

15 . The integrated circuit device of claim 14 , wherein

each of the first supporter and the second supporter are in contact with side walls of each of the plurality of lower electrodes, and

the capacitor dielectric film is conformally on an outer surface of the first supporter and outer surfaces of each of the plurality of lower electrodes.

16 . An integrated circuit device comprising:

a substrate including an active region defined by an isolation film;

a gate structure on the substrate, the gate structure crossing the active region and extending in a first direction;

a source/drain in the active region at opposite sides of the gate structure, respectively;

a bit line structure on the substrate, the bit line structure extending in a second direction, the second direction being perpendicular to the first direction;

a plurality of contact structures on the source/drain, respectively;

a plurality of capacitor structures respectively on the plurality of contact structures,

the plurality of capacitor structures including a plurality of lower electrodes, respectively,

each of the plurality of capacitor structures including a corresponding lower electrode among the plurality of lower electrodes, a capacitor dielectric film, and an upper electrode; and

a supporter connecting and supporting the plurality of lower electrodes, wherein

the supporter includes one of a metal oxide, a metal nitride, and a metal oxynitride,

a portion of the capacitor dielectric film includes a dopant, and

the dopant in the portion of the capacitor dielectric film and a metal in the supporter are a same metal.

17 . The integrated circuit device of claim 16 , wherein

the metal in the supporter includes at least one of aluminum (Al), silicon (Si), cobalt (Co), magnesium (Mg), calcium (Ca), yttrium (Y), tantalum (Ta), tin (Sn), molybdenum (Mo), strontium (Sr), lanthanum (La), gadolinium (Gd), and zinc (Zn), and

the supporter is in contact with the capacitor dielectric film at an interface between the supporter and the capacitor dielectric film.

18 . The integrated circuit device of claim 17 , wherein

the capacitor dielectric film has a stack structure of a first dielectric film, a second dielectric film, and a third dielectric film,

the first dielectric film and the third dielectric film include zirconium oxide (ZrO 2 ),

the second dielectric film includes aluminum oxide (Al 2 O 3 ),

an inside of the first dielectric film includes the dopant, and

an inside of each of the second dielectric film and the third dielectric film do not include the dopant.

19 . The integrated circuit device of claim 16 , wherein

the supporter includes a first supporter and a second supporter,

the first supporter includes one of the metal oxide, the metal nitride, and the metal oxynitride,

the first supporter is in contact with the capacitor dielectric film,

the second supporter includes silicon nitride,

the second supporter is surrounded by the first supporter, and

the second supporter is not in contact with the capacitor dielectric film.

20 . The integrated circuit device of claim 16 , wherein the metal reduces a flow of leakage current in the capacitor dielectric film between the plurality of lower electrodes.