Semiconductor device structure and methods of forming the same
View Patent ↗A semiconductor device, along with methods of forming such, are described. The device includes a semiconductor material disposed over a substrate, a first epitaxial source/drain region in contact with a first end of the semiconductor material, a second epitaxial source/drain region in contact with a second end opposite the first end of the semiconductor material, a first dummy gate dielectric layer in contact with the semiconductor material and the first epitaxial source/drain region, a second dummy gate dielectric layer in contact with the semiconductor material and the second epitaxial source/drain region, and an interfacial dielectric disposed between the first and second dummy gate dielectric layers.
1 . A method for forming a semiconductor device, comprising:
forming alternating first and second semiconductor materials over a substrate;
removing a portion of the first and second semiconductor materials and the substrate to form fins;
depositing a dummy gate dielectric layer on the fins;
depositing a dummy gate on the dummy gate dielectric layer;
forming first and second epitaxial source/drain regions on opposite sides of the dummy gate, wherein edge portions of the dummy gate dielectric layer are in contact with the first and second epitaxial source/drain regions;
removing the dummy gate to expose the dummy gate dielectric layer;
removing a portion of the dummy gate dielectric layer, wherein the edge portions of the dummy gate dielectric remain; and
forming a gate stack over the substrate.
2 . The method of claim 1 , wherein the portion of the dummy gate dielectric layer is removed by a cyclic etching process.
3 . The method of claim 2 , wherein the cyclic etching process comprises one or more cycles of forming a reaction product and removing the reaction product.
4 . The method of claim 3 , wherein the one or more cycles comprise one to five cycles.
5 . The method of claim 3 , wherein the reaction product is formed by reacting etchants with a surface of the dummy gate dielectric layer.
6 . The method of claim 5 , wherein the etchants comprise HF and NH 3 .
7 . The method of claim 6 , wherein the reaction product comprises ammonium fluorosilicate.
8 . A method for forming a semiconductor device, comprising:
forming a fin, wherein the fin comprises alternating first and second semiconductor materials over a substrate;
depositing a dummy gate dielectric layer on the fin;
depositing a dummy gate on the dummy gate dielectric layer;
forming gate spacers on opposite sides of the dummy gate;
removing the dummy gate to expose the dummy gate dielectric layer;
performing a cyclic etching process to remove a portion of the dummy gate dielectric layer, wherein portions of the gate spacers are removed by the cyclic etching process, and one of the remaining gate spacers includes a slanted side surface; and
forming a gate stack over the substrate.
9 . The method of claim 8 , wherein remaining portions of the dummy gate dielectric layer are disposed under the remaining gate spacers.
10 . The method of claim 9 , wherein a recess is formed between the remaining gate spacers and the remaining portions of the dummy gate dielectric layer.
11 . The method of claim 10 , wherein the recess has varying critical dimensions.
12 . The method of claim 11 , wherein the recess has a first critical dimension located between top portions of the remaining gate spacers, a second critical dimension located between portions of the remaining gate spacers below the top portions of the remaining gate spacers, and a third critical dimension located between the portions of the dummy gate dielectric layer.
13 . The method of claim 12 , wherein the first critical dimension is greater than the second critical dimension, and the second critical dimension is greater than the third critical dimension.
14 . The method of claim 13 , further comprising forming an interfacial dielectric between the remaining portions of the dummy gate dielectric layer.
15 . The method of claim 14 , wherein the interfacial dielectric and the remaining portions of the dummy gate dielectric layer comprise a same material.
16 . The method of claim 15 , wherein the interfacial dielectric is formed by a first process, and the dummy gate dielectric layer is formed by a second process different from the first process.
17 . The method of claim 16 , wherein the first process is a thermal or chemical oxidation process, and the second process is a deposition process.
18 . A method for forming a semiconductor device, comprising:
forming a fin;
depositing a dummy gate dielectric layer on the fin;
depositing a dummy gate on the dummy gate dielectric layer;
forming gate spacers on opposite sides of the dummy gate;
removing the dummy gate to expose the dummy gate dielectric layer;
removing a portion of the dummy gate dielectric layer, wherein edge portions of the dummy gate dielectric layer are disposed under the gate spacers, and the edge portions; and
forming an interfacial dielectric between the edge portions of the dummy gate dielectric layer, wherein the interfacial dielectric is thinner than the edge portions of the dummy gate dielectric layer.
19 . The method of claim 18 , wherein the dummy gate dielectric layer is deposited by a plasma enhanced atomic layer deposition process.
20 . The method of claim 19 , wherein the interfacial dielectric is formed by an oxidation process.