Semiconductor device
A source layer is provided on a first p-type layer made of a nitride-based semiconductor, and includes a semiconductor region including electrons as carriers. A drain layer faces the source layer in a first direction on the first p-type layer with a gap being provided therebetween, and includes a semiconductor region including electrons as carriers. A channel structure is provided between the source layer and the drain layer on the first p-type layer, in which a channel region and a gate region are alternately disposed in a second direction perpendicular to the first direction. A channel layer included in the channel structure forms at least a part of the channel region, and is made of a nitride-based semiconductor. A gate layer included in the channel structure forms at least a part of the gate region, and electrically connects a gate electrode and the first p-type layer.
1 . A semiconductor device which has a first direction and a second direction perpendicular to each other in in-plane directions perpendicular to a thickness direction and can operate at microwave frequencies, the semiconductor device comprising:
a first p-type layer being made of a nitride-based semiconductor;
a source layer being provided on the first p-type layer and including a semiconductor region including electrons as carriers;
a source electrode being provided on the source layer;
a drain layer being provided to face the source layer in the first direction on the first p-type layer with a gap being provided between the drain layer and the source layer, and including a semiconductor region including electrons as carriers;
a drain electrode being provided on the drain layer;
a gate electrode being separated from the source electrode and the drain electrode, and being provided between the source electrode and the drain electrode in the first direction; and
a channel structure being provided between the source layer and the drain layer on the first p-type layer, in the channel structure a channel region and a gate region being alternately disposed in the second direction, wherein
the channel structure includes
a channel layer forming at least a part of the channel region, and being made of a nitride-based semiconductor, the channel layer including a first heterojunction layer and a second heterojunction layer stacked on each other, and the first heterojunction layer is disposed between the second heterojunction layer and the first p-type layer, and
a gate layer forming at least a part of the gate region, and electrically connecting the gate electrode and the first p-type layer.
2 . The semiconductor device according to claim 1 , wherein
the gate layer is made of a p-type nitride-based semiconductor.
3 . The semiconductor device according to claim 1 , wherein
the gate layer has a polycrystalline structure.
4 . The semiconductor device according to claim 1 , wherein
the channel layer is formed of an n-type or undoped single layer.
5 . The semiconductor device according to claim 1 , wherein
the channel layer is a heterojunction layer being formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film.
6 . The semiconductor device according to claim 1 , wherein
the channel layer includes multiple heterojunction layers stacked on each other, and each of the multiple heterojunction layers is formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film.
7 . The semiconductor device according to claim 1 , wherein
the source layer includes a first source film and a second source film being provided on the first source film and having a larger band gap than the first source film.
8 . The semiconductor device according to claim 1 , wherein
the drain layer includes a first drain film and a second drain film being provided on the first drain film and having a larger band gap than the first drain film.
9 . The semiconductor device according to claim 1 , further comprising
a second p-type layer being electrically connected to the gate electrode and being made of a nitride-based semiconductor, the second p-type layer being provided on the channel region.
10 . The semiconductor device according to claim 1 , further comprising
an interlayer film being made of a nitride-based semiconductor having a larger band gap than the first p-type layer, the interlayer film being provided between the source layer and the first p-type layer.
11 . The semiconductor device according to claim 1 , further comprising
an interlayer film being made of a nitride-based semiconductor having a larger band gap than the first p-type layer, the interlayer film being provided between the drain layer and the first p-type layer.
12 . The semiconductor device according to claim 1 , wherein
the channel layer has impurity concentration equal to or lower than the impurity concentration of the gate layer.
13 . The semiconductor device according to claim 1 , wherein
the channel layer includes multiple heterojunction layers stacked on each other, and each of the multiple heterojunction layers is formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film, and
the multiple heterojunction layers include the first heterojunction layer and the second heterojunction layer, and average Al composition of the second heterojunction layer in the thickness direction is lower than the average Al composition of the first heterojunction layer in the thickness direction.
14 . The semiconductor device according to claim 1 , wherein
the channel layer includes multiple heterojunction layers stacked on each other, and each of the multiple heterojunction layers is formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film, and
the multiple heterojunction layers include the first heterojunction layer and the second heterojunction layer, and average Al composition of the second heterojunction layer in the thickness direction is higher than the average Al composition of the first heterojunction layer in the thickness direction.
15 . The semiconductor device according to claim 1 , wherein
the channel layer includes a heterojunction layer formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film, and the second channel film has an n type.
16 . The semiconductor device according to claim 1 , wherein
the channel layer includes multiple heterojunction layers stacked on each other, and each of the multiple heterojunction layers is formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film, and
the multiple heterojunction layers include the first heterojunction layer and the second heterojunction layer, and average doping concentration of the second heterojunction layer in the thickness direction is lower than the average doping concentration of the first heterojunction layer in the thickness direction.
17 . The semiconductor device according to claim 1 , wherein
the channel layer includes multiple heterojunction layers stacked on each other, and each of the multiple heterojunction layers is formed of a first channel film and a second channel film being provided on the first channel film and having a larger band gap than the first channel film, and
the multiple heterojunction layers include the first heterojunction layer and the second heterojunction layer, and average doping concentration of the second heterojunction layer in the thickness direction is higher than the average doping concentration of the first heterojunction layer in the thickness direction.
18 . The semiconductor device according to claim 1 , further comprising
a substrate supporting the first p-type layer, wherein
the first p-type layer is disposed between each of the source layer and the drain layer and the substrate.
19 . The semiconductor device according to claim 18 , further comprising
a nucleation layer between the first p-type layer and the substrate.