Semiconductor device including source/drain pattern with varied germanium concentrations
A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, and a source/drain pattern on a side surface of the channel pattern, the source/drain pattern including a first section between a first level and a second level that is higher than the first level, a first variation section between the second level and a third level that is higher than the second level, and a second section between the third level and a fourth level that is higher than the third level, where a rate of change in germanium concentration in the first variation section in a first direction is greater than a rate of change in germanium concentration in each of the first section and the second section in the first direction, and a germanium concentration at each of the first level and the second level is greater than 0 at % and equal to or less than 10 at %.
1 . A semiconductor device comprising:
a substrate comprising an active pattern;
a channel pattern on the active pattern; and
a source/drain pattern on a side surface of the channel pattern, the source/drain pattern comprising:
a first section between a first level and a second level that is higher than the first level;
a first variation section between the second level and a third level that is higher than the second level; and
a second section between the third level and a fourth level that is higher than the third level,
wherein a rate of change in germanium concentration in the first variation section in a first direction is greater than a rate of change in germanium concentration in each of the first section and the second section in the first direction, and
wherein a germanium concentration at each of the first level and the second level is greater than 0 at % and equal to or less than 10 at %.
2 . The semiconductor device of claim 1 , wherein a germanium concentration in the first section is greater than 0 at % and equal to or less than 10 at %.
3 . The semiconductor device of claim 1 , wherein a difference between a germanium concentration at the third level and a germanium concentration at the fourth level is 10 at % or less.
4 . The semiconductor device of claim 1 , wherein a germanium concentration at each of the third level and the fourth level is equal to or greater than 30 at % and equal to or less than 50 at %.
5 . The semiconductor device of claim 1 , wherein a germanium concentration in the second section is equal to or greater than 30 at % and equal to or less than 50 at %.
6 . The semiconductor device of claim 1 , wherein a rate of change in germanium concentration from the second level to the third level in the first direction is equal to or greater than 6 at %/nm and equal to or less than 10 at %/nm.
7 . The semiconductor device of claim 1 , wherein the source/drain pattern further comprises:
a second variation section between the fourth level and a fifth level that is higher than the fourth level; and
a third section between the fifth level and a sixth level that is higher than the fifth level,
wherein a rate of change in germanium concentration in the second variation section in the first direction is greater than the rate of change in germanium concentration in the third section.
8 . The semiconductor device of claim 7 , wherein the rate of change in germanium concentration in the second variation section in the first direction is greater than the rate of change in germanium concentration in each of the first section and the second section in the first direction.
9 . The semiconductor device of claim 7 , wherein a difference between a germanium concentration at the fifth level and a germanium concentration at the sixth level is 10 at % or less.
10 . The semiconductor device of claim 7 , wherein a germanium concentration at each of the fifth level and the sixth level is equal to or greater than 50 at % and equal to or less than 60 at %.
11 . The semiconductor device of claim 7 , wherein a germanium concentration in the third section is equal to or greater than 50 at % and equal to or less than 60 at %.
12 . The semiconductor device of claim 7 , wherein a rate of change in germanium concentration from the fourth level to the fifth level in the first direction is equal to or greater than 6 at %/nm and equal to or less than 10 at %/nm.
13 . A semiconductor device comprising:
a substrate comprising an active pattern;
a channel pattern on the active pattern; and
a source/drain pattern on a side surface of the channel pattern, the source/drain pattern comprising a first variation section, and
wherein a rate of change in germanium concentration in the first variation section in a first direction is equal to or greater than 6 at %/nm and equal to or less than 10 at %/nm,
wherein the source/drain pattern further comprises:
a first section below the first variation section; and
a second section on the first variation section, and
wherein the rate of change in germanium concentration in the first variation section in the first direction is greater than a rate of change in germanium concentration in each of the first section and the second section in the first direction.
14 . The semiconductor device of claim 13 , wherein a germanium concentration in the first section is greater than 0 at % and equal to or less than 10 at %.
15 . The semiconductor device of claim 13 , wherein a germanium concentration in the second section is equal to or greater than 30 at % and equal to or less than 50 at %.
16 . The semiconductor device of claim 13 , wherein the source/drain pattern further comprises a second variation section on the second section, and
wherein a rate of change in germanium concentration in the second variation section in the first direction is equal to or greater than 6 at %/nm and equal to or less than 10 at %/nm.
17 . The semiconductor device of claim 16 , wherein the source/drain pattern further comprises a third section on the second variation section, and
wherein a germanium concentration in the third section is equal to or greater than 50 at % and equal to or less than 60 at %.
18 . A semiconductor device comprising:
a substrate comprising an active pattern;
a device isolation pattern surrounding the active pattern;
a channel pattern comprising:
a first semiconductor pattern,
a second semiconductor pattern, and
a third semiconductor pattern, each of the first semiconductor pattern, the second semiconductor pattern and the third semiconductor pattern being spaced apart from each other and being sequentially stacked on the active pattern;
a gate electrode on the first semiconductor pattern, the second semiconductor pattern and the third semiconductor pattern;
a gate insulating pattern between the gate electrode and the first semiconductor pattern, the second semiconductor pattern and the third semiconductor pattern;
a gate spacer on a side surface of the gate electrode;
a gate capping pattern on a top surface of the gate electrode; and
a source/drain pattern connected to the first semiconductor pattern, the second semiconductor pattern and the third semiconductor pattern, the source/drain pattern comprising:
a first section between a first level and a second level that is higher than the first level;
a first variation section between the second level and a third level that is higher than the second level; and
a second section between the third level and a fourth level that is higher than the third level,
wherein a rate of change in germanium concentration in the first variation section in a first direction is greater than a rate of change in germanium concentration in each of the first section and the second section in the first direction, and
wherein a thickness of the first variation section is less than a thickness of the second section.
19 . The semiconductor device of claim 18 , wherein a rate of change in germanium concentration from the second level to the third level in the first direction is equal to or greater than 6 at %/nm and equal to or less than 10 at %/nm.