IP Library › Granted Patent US 12,558,884
Granted Patent B2
US 12,558,884 · App. 18/277,673 · Granted Feb 24, 2026

Method for producing laminate and heating element, and defroster

Inventors: Hiroto Iida (Ageo, JP); Makoto Hosokawa (Ageo, JP); Misato Mizoguchi (Ageo, JP); Shinya Hiraoka (Ageo, JP); Toshiyuki Shimizu (Ageo, JP)
Assignee: MITSUI MINING & SMELTING CO., LTD.
B32B37/182B32B15/082B32B15/20B32B27/28B32B37/06B32B37/10H05B3/86B32B2307/302B32B2307/538B32B2307/7376B32B2307/748B32B2309/02B32B2309/12B32B2311/12B32B2329/06B32B2605/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,558,884
App. No.
18/277,673
Granted
Feb 24, 2026
Kind
B2
Abstract

Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Claims (20)

1 . A method for manufacturing a laminate, comprising:

providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 38.5 atomic % or less, and

attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate,

wherein the amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

2 . The method according to claim 1 , wherein the amount of metal components is 33 atomic % or more and 38.5 atomic % or less.

3 . The method according to claim 1 , wherein the amount of metal components is 37 atomic % or more and 38.5 atomic % or less.

4 . The method according to claim 1 , wherein the treated surface comprises an oxide of at least one metal selected from the group consisting of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe.

5 . The method according to claim 1 , wherein the treated surface has a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 μm or more and 0.200 μm or less, and

wherein the Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 μm, and a cutoff wavelength of an L-filter is 10 μm.

6 . The method according to claim 1 , wherein the treated surface has a density of peaks Spd of 100 mm −2 or more and 26000 mm −2 or less, and wherein the Spd is a value measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 2 μm, and cutoff of an L-filter is not performed.

7 . The method according to claim 1 , wherein the treated surface comprises a plurality of roughening particles.

8 . The method according to claim 1 , wherein attachment of the resin film to the copper foil is performed by thermocompression-bonding the resin film and the copper foil at a temperature of 180° C. or less and a pressure of 0.6 MPa or less.

9 . The method according to claim 1 , wherein the resin film has a thickness of 1 μm or more and 1000 μm or less.

10 . The method according to claim 1 , wherein the polyvinyl acetal resin is a polyvinyl butyral resin.

11 . A method for manufacturing a heating element, comprising:

providing a laminate manufactured by the method according to claim 1 ,

processing the copper foil of the laminate to form a heating wire having a predetermined pattern, and

attaching or forming an additional polyvinyl acetal resin film on the laminate in which the heating wire is formed, so as to sandwich the heating wire, to form a heating element.

12 . The method according to claim 11 , wherein the predetermined pattern comprises at least one pattern selected from the group consisting of a linear shape, a wavy line shape, a lattice shape, and a net shape.

13 . A defroster comprising a heating element manufactured by the method according to claim 11 .

Assignments (2)
CHANGE OF NAME Recorded Dec 3, 2025
From: MITSTUI MINING & SMELTING CO., LTD.
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 073640/0560 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2023
From: IIDA, HIROTO; HOSOKAWA, MAKOTO; MIZOGUCHI, MISATO; HIRAOKA, SHINYA; SHIMIZU, TOSHIYUKI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 064626/0860 →
Priority Claims (1)
JP 2021-025643 · Feb 19, 2021 · national
Continuity (2)
Related Publication 20240131832A1 · Apr 25, 2024
Related Publication 20240227377A9 · Jul 11, 2024
References Cited (15)
US 3293109A · Luce · 1966 [cited by examiner]
US 20200017675A1 · Isoue et al. · 2020 [cited by applicant]
US 20200023620A1 · Isoue et al. · 2020 [cited by applicant]
JP 1110794A · 1999 [cited by applicant]
JP 2006159900A · 2006 [cited by applicant]
JP 2006218855A · 2006 [cited by applicant]
JP 4354271B2 · 2009 [cited by applicant]
JP 2015193884A · 2015 [cited by applicant]
JP 201835036A · 2018 [cited by applicant]
JP 2018161889A · 2018 [cited by applicant]
JP 2019142763A · 2019 [cited by applicant]
WO 2014024994A1 · 2014 [cited by applicant]
WO WO2016117512A1 · 2016 [cited by examiner]
WO 2017090386A1 · 2017 [cited by applicant]
WO WO2021157363A1 · 2021 [cited by examiner]