IP Library Granted Patent US 12,560,728
Granted Patent B2
US 12,560,728 · App. 18/470,937 · Granted Feb 24, 2026

Radiation detector having improved equalization of pixel response

Inventors: Krzysztof Iniewski (Port Moody, CA); Olivier Tousignant (Brentwood Bay, CA); Michael Ayukawa (Victoria, CA)
Assignee: REDLEN TECHNOLOGIES, INC.
G01T1/241G01T1/20184G01T1/243G01T1/244G01T1/247G01T1/2985H10F39/1895H10F39/811
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Quick Facts
Patent No.
US 12,560,728
App. No.
18/470,937
Granted
Feb 24, 2026
Kind
B2
Abstract

A radiation detector unit including an interposer configured to electrically connect a pixelated radiation sensor positioned on a front side of the interposer to an application-specific integrated circuit (ASIC) positioned on a back side of the interposer, where the interposer has at least one feature which equalizes the energy resolution (ER) response of edge and center pixel detectors of the pixelated radiation sensor within 10% of one another.

Claims (6)

1 . A device, comprising:

an interposer configured to electrically connect a pixelated radiation sensor positioned on a front side of the interposer to an application-specific integrated circuit (ASIC) positioned on a back side of the interposer, wherein the interposer has at least one feature which equalizes the energy resolution (ER) response of edge and center pixel detectors of the pixelated radiation sensor within 10% of one another, and wherein the at least one feature comprises at least one of a via and a lateral trace within the interposer that does not carry electrical power or data signals and is configured to provide at least one of thermal redistribution and strain-relief.

2 . The device of claim 1 , wherein the at least one feature comprises at least one of metal vias and lateral metal traces configured to provide thermal redistribution.

3 . The device of claim 1 , wherein the least one of the via and the lateral trace comprises the via.

4 . The device of claim 1 , wherein the least one of the via and the lateral trace comprises the lateral trace.

5 . The device of claim 1 , further comprising the pixelated radiation sensor positioned on the front side of the interposer, and the ASIC positioned on the back side of the interposer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2023
From: INIEWSKI, KRZYSZTOF; TOUSIGNANT, OLIVIER; AYUKAWA, MICHAEL
To: REDLEN TECHNOLOGIES, INC.,
Reel/Frame 065024/0935 →
Continuity (2)
Provisional Application 63383157 · Nov 10, 2022
Related Publication 20240159924A1 · May 16, 2024
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