IP Library › Granted Patent US 12,560,865
Granted Patent B2
US 12,560,865 · App. 17/890,409 · Granted Feb 24, 2026

Resist compound, method for forming pattern using same, and method for manufacturing semiconductor device using same

Inventors: Jin Kyun Lee (Incheon, KR); Hyun Taek Oh (Incheon, KR)
Assignee: Samsung Electronics Co., Ltd.
G03F7/038C08F222/402C08F230/04H01L21/0274H01L21/32139
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Quick Facts
Patent No.
US 12,560,865
App. No.
17/890,409
Granted
Feb 24, 2026
Kind
B2
Abstract

Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:

Claims (66)

1 . A compound represented by Formula 1:

wherein, in Formula 1,

R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are each independently one selected from hydrogen, deuterium, and a C 1 -C 3 alkyl,

R 10 is a single bond, a linear C 1 -C 11 alkyl, or a branched C 1 -C 11 alkyl,

R 20 is a C 2 -C 11 perhalogenated alkyl or a C 2 -C 11 perhalogenated alkyl ether perhalogenated alkyl,

X is one selected from H, F, Cl, Br, and I,

n is an integer from 10 to 150, and

wherein a total number of Sn is equal to a total number of R 20 .

2 . The compound of claim 1 , wherein, in Formula 1,

R 20 is represented by C b X 2b O Z , wherein

X is one selected from F and I,

b is an integer from 2 to 11, and

z is an integer selected from 0, 1, 2, and 3.

3 . The compound of claim 1 , wherein, in Formula 1, the C 2 -C 11 perhalogenated alkyl or the C 2 -C 11 perhalogenated alkyl ether perhalogenated alkyl in R 20 is a C 2 -C 11 perfluoroalkyl or a C 2 -C 11 perflouroalkyl ether perflouroalkyl.

4 . The compound of claim 1 , wherein the compound represented by Formula 1 comprises a compound represented by Formula 2:

wherein, in Formula 2,

R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are each independently one selected from hydrogen, deuterium, and a C 1 -C 3 alkyl,

X is one selected from F, Cl, Br, and I,

a is an integer selected from 0 to 11,

b is an integer selected from 2 to 11,

z is an integer selected from 0, 1, 2, and 3, and

n is an integer from 10 to 150.

5 . The compound of claim 4 , wherein

in Formula 2, X is F.

6 . The compound of claim 1 , wherein the compound represented by Formula 1 comprises a compound represented by Formula 3 or a compound represented by Formula 4:

wherein, in Formula 3, n is an integer from 10 to 150,

wherein, in Formula 4, n is an integer from 10 to 150.

7 . The compound of claim 6 , wherein

the compound represented by Formula 1 comprises the compound represented by Formula 3.

8 . The compound of claim 6 , wherein the compound represented by Formula 1 comprises the compound represented by Formula 4.

9 . A method of forming a pattern, the method comprising:

forming a film using the compound of claim 1 ; and

patterning the film.

10 . A method of manufacturing a semiconductor device, the method comprising:

forming a resist film by coating a substrate with a compound represented by Formula 1; and

patterning the resist film,

wherein, in Formula 1,

R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are each independently one selected from hydrogen, deuterium, and a C 1 -C 3 alkyl,

R 10 is a single bond, a linear C 1 -C 11 alkyl, or a branched C 1 -C 11 alkyl,

R 20 is C 2 -C 11 perhalogenated alkyl or C 2 -C 11 perhalogenated alkyl ether perhalogenated alkyl,

X is one selected from H, F, Cl, Br, and I,

n is an integer from 10 to 150,

wherein a total number of Sn is equal to a total number of R 20 .

11 . The method of claim 10 , wherein, in Formula 1,

R 20 is represented by C b X 2b O Z ,

X is one selected from F and I, b is an integer from 2 to 11, and z is an integer selected from 0, 1, 2, and 3.

12 . The method of claim 10 , wherein, in Formula 1, the C 2 -C 11 perhalogenated alkyl or the C 2 -C 11 perhalogenated alkyl ether perhalogenated alkyl in R 20 is a C 2 -C 11 perfluoroalkyl, and X is F.

13 . The method of claim 12 , wherein the patterning of the resist film comprises:

irradiating a light on the resist film; and

removing a portion of the resist film using a developing solution,

wherein the light includes an electron beam or an extreme ultraviolet ray, and

the developing solution includes a highly fluorinated solution.

14 . The method of claim 10 , wherein the compound represented by Formula 1 comprises a compound represented by Formula 2:

wherein, in Formula 2,

R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are each independently one selected from hydrogen, deuterium, and a C 1 -C 3 alkyl,

X is one selected from F and I,

a is an integer selected from 0 to 11,

b is an integer selected from 2 to 11,

z is an integer selected from 0, 1, 2, and 3, and

n is an integer from 10 to 150.

15 . The method of claim 14 , wherein

in Formula 2, X is F.

16 . The method of claim 14 , wherein the compound represented by Formula 2 comprises a compound represented by Formula 3:

wherein, in Formula 3, n is an integer from 10 to 150.

17 . The method of claim 14 , wherein the compound represented by Formula 2 comprises a compound represented by Formula 4:

wherein, in Formula 4, n is an integer from 10 to 150.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2022
From: LEE, JIN KYUN; OH, HYUN TAEK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061236/0396 →
Priority Claims (1)
KR 10-2020-0020174 · Feb 19, 2020 · national
Continuity (2)
Continuation PCTKR2021002121 · Feb 19, 2021
Related Publication 20220404700A1 · Dec 22, 2022
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