IP Library Granted Patent US 12,562,495
Granted Patent B2
US 12,562,495 · App. 18/659,665 · Granted Feb 24, 2026

Antenna assembly

Inventors: Weichun Eric Lin (San Diego, CA); Jon Eu Lyu (Irvine, CA); Manjurul Ahsan Riheen (Santee, CA); Shigeaki Kinori (Shiga, JP)
Assignee: KYOCERA AVX Components (San Diego), Inc.
H01Q13/20H01Q13/0233
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,562,495
App. No.
18/659,665
Granted
Feb 24, 2026
Kind
B2
Abstract

An antenna assembly is provided. The antenna assembly includes a ceramic carrier having a first surface and a second surface, the second surface being opposite the first surface. The antenna assembly further includes an antenna pattern. The antenna pattern includes a first antenna portion positioned at least partially on the first surface of the ceramic carrier. The antenna pattern further includes a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to the second surface of the ceramic carrier.

Claims (42)

1 . An antenna assembly, comprising:

a ceramic carrier having a first surface and a second surface, the second surface being opposite the first surface;

an antenna pattern, comprising:

a first antenna portion positioned at least partially on the first surface of the ceramic carrier; and

a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to the second surface of the ceramic carrier;

wherein the plurality of conductive vias is located along a first sidewall of the ceramic carrier, the first sidewall being greater in length than adjacent sidewalls of the ceramic carrier.

2 . The antenna assembly of claim 1 , wherein the plurality of conductive vias is positioned along a sidewall of the ceramic carrier, each conductive via of the plurality of conductive vias being located a distance from the sidewall.

3 . The antenna assembly of claim 1 , wherein the antenna pattern further comprises:

a third antenna portion positioned on the second surface of the ceramic carrier,

wherein the second antenna portion electrically couples the first antenna portion to the third antenna portion.

4 . The antenna assembly of claim 1 , wherein the antenna pattern further comprises:

a fourth antenna portion positioned on the second surface of the ceramic carrier; and

a fifth antenna portion positioned on the second surface of the ceramic carrier,

wherein the second antenna portion electrically couples the first antenna portion to the fourth antenna portion,

wherein the second antenna portion electrically couples the first antenna portion to the fifth antenna portion.

5 . The antenna assembly of claim 1 , wherein the antenna assembly comprises a GPS antenna.

6 . The antenna assembly of claim 5 , wherein the GPS antenna operates at an L1 frequency band.

7 . The antenna assembly of claim 6 , wherein the antenna assembly has a return loss in a range of about −12 dB to about −16 dB.

8 . The antenna assembly of claim 6 , wherein the antenna assembly has a band width in a range of about 80 MHz to about 85 MHz.

9 . The antenna assembly of claim 6 , wherein the antenna assembly has a radiation efficiency in a range of about −0.30 to about −0.40.

10 . The antenna assembly of claim 5 , wherein the GPS antenna operates at an L5 frequency band.

11 . The antenna assembly of claim 10 , wherein the antenna assembly has a return loss in a range of about −25 dB to about −30 dB.

12 . The antenna assembly of claim 10 , wherein the antenna assembly has a band width in a range of about 130 MHz to about 135 MHz.

13 . The antenna assembly of claim 10 , wherein the antenna assembly has a radiation efficiency in a range of about −0.20 to about −0.30.

14 . The antenna assembly of claim 1 , further comprising:

a circuit board,

wherein the circuit board is coupled to the second surface of the ceramic carrier.

15 . The antenna assembly of claim 1 , wherein the antenna assembly does not include a metal sidewall.

16 . A communication device, comprising:

an antenna, comprising:

a first antenna portion positioned at least partially on a first surface of a ceramic carrier; and

a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to a second surface of the ceramic carrier,

wherein the second surface of the ceramic carrier is opposite the first surface of the ceramic carrier and the plurality of conductive vias is located along a first sidewall of the ceramic carrier, the first sidewall being greater in length than adjacent sidewalls of the ceramic carrier.

17 . The communication device of claim 16 , wherein the plurality of conductive vias is positioned along a sidewall of the ceramic carrier, each conductive via of the plurality of conductive vias being located a distance from the sidewall.

18 . The communication device of claim 16 , wherein the antenna further comprises:

a third antenna portion positioned on the second surface of the ceramic carrier,

wherein the second antenna portion electrically couples the first antenna portion to the third antenna portion.

19 . The communication device of claim 16 , wherein the antenna further comprises:

a fourth antenna portion positioned on the second surface of the ceramic carrier; and

a fifth antenna portion positioned on the second surface of the ceramic carrier,

wherein the second antenna portion electrically couples the first antenna portion to the fourth antenna portion,

wherein the second antenna portion electrically couples the first antenna portion to the fifth antenna portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2024
From: LIN, WEICHUN ERIC; LYU, JON EU; RIHEEN, MANJURUL AHSAN; KINORI, SHIGEAKI
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 067370/0093 →
Continuity (2)
Provisional Application 63581506 · Sep 8, 2023
Related Publication 20250087892A1 · Mar 13, 2025
References Cited (48)
US 7372412B2 · Koide · 2008 [cited by applicant]
US 7429952B2 · Sun · 2008 [cited by applicant]
US 7545029B2 · Wilson et al. · 2009 [cited by applicant]
US 7683837B2 · Noro · 2010 [cited by applicant]
US 7714785B2 · Hsu et al. · 2010 [cited by applicant]
US 7825860B2 · Ying · 2010 [cited by applicant]
US 8044871B2 · Takisawa et al. · 2011 [cited by applicant]
US 8174455B2 · Miyoshi et al. · 2012 [cited by applicant]
US 8179322B2 · Nissinen · 2012 [cited by applicant]
US 8797222B2 · Chamseddine · 2014 [cited by applicant]
US 9325071B2 · Fasenfest · 2016 [cited by applicant]
US 9653808B2 · Hwang et al. · 2017 [cited by applicant]
US 9799958B2 · Sampo et al. · 2017 [cited by applicant]
US 10020560B1 · Chou et al. · 2018 [cited by applicant]
US 10374314B2 · Iino · 2019 [cited by applicant]
US 10381733B2 · Hwang et al. · 2019 [cited by applicant]
US 10439266B2 · Hwang et al. · 2019 [cited by applicant]
US 10916836B2 · Thiam et al. · 2021 [cited by applicant]
US 10923823B2 · Hwang et al. · 2021 [cited by applicant]
US 11005166B2 · Hwang et al. · 2021 [cited by applicant]
US 11005182B2 · Kowaita et al. · 2021 [cited by applicant]
US 11309631B2 · Iino · 2022 [cited by applicant]
US 11670871B2 · Lim et al. · 2023 [cited by applicant]
US 20080165063A1 · Schlub · 2008 [cited by examiner]
US 20100171679A1 · Ohshima · 2010 [cited by applicant]
US 20110260928A1 · Ito et al. · 2011 [cited by applicant]
US 20200243977A1 · Shamblin · 2020 [cited by examiner]
US 20200373261A1 · Marin · 2020 [cited by examiner]
US 20220190464A1 · Gavagnin et al. · 2022 [cited by applicant]
US 20220311142A1 · Hwang et al. · 2022 [cited by applicant]
US 20220328967A1 · Kaufmann · 2022 [cited by applicant]
US 20230299487A1 · Hwang · 2023 [cited by applicant]
US 20240047879A1 · Nozaki et al. · 2024 [cited by applicant]
US 20240072444A1 · Hwang · 2024 [cited by applicant]
CN 210628489U · 2020 [cited by examiner]
CN 115275578A · 2022 [cited by applicant]
CN 115939751A · 2023 [cited by applicant]
JP 2001267834A · 2001 [cited by applicant]
KR 100979746B1 · 2010 [cited by applicant]
WO WO2007136182A1 · 2007 [cited by applicant]
WO WO2021056171A1 · 2021 [cited by applicant]
WO WO2022181295A1 · 2022 [cited by applicant]
WO WO2022181576 · 2022 [cited by applicant]
WO WO2022239768A1 · 2022 [cited by applicant]
WO WO2023026790A1 · 2023 [cited by applicant]
digikey.com, “P522304, 9000154 Datasheet by Kyocera AVX”, Nov. 27, 2018, https://www.digikey.com/en/htmldatasheets/production/753120/0/0/1/p522304-datasheet, retrieved on May 9, 2024, 8 pages. [cited by applicant]
Supplemental Statement from Applicant dated May 9, 2024. [cited by applicant]
PCT App. No. PCT/US2024/031354; International Search Report and Written Opinion, mailed Sep. 12, 2024, 10 pages. [cited by applicant]