Power electronics converter thermal management
The disclosure relates to thermal management of a power electronics converter. An example embodiment includes a power electronics converter comprising: a first set of terminals connectable to a first voltage supply; a second set of terminals connectable to a second voltage supply; a plurality of semiconductor switches connected between the first and second sets of terminals; a voltage sensor connected to measure a voltage across the second supply; a current sensor connected to measure a current through the second supply; and a controller connected to provide switching signals to the semiconductor switches and to receive voltage and current signals from the voltage and current sensors, the controller configured, for each of the semiconductor switches, to: determine a junction temperature of the semiconductor switch; compare the determined junction temperature to a reference temperature; and adjust a switching gate voltage applied to the semiconductor switch.
1 . A power electronics converter comprising:
a first set of terminals connectable to a first voltage supply;
a second set of terminals connectable to a second voltage supply;
a plurality of semiconductor switches connected between the first and second sets of terminals;
a voltage sensor connected to measure a voltage across the second supply;
a current sensor connected to measure a current through the second supply; and
a controller connected to provide switching signals to the semiconductor switches and to receive voltage and current signals from the voltage and current sensors, the controller configured, for each of the semiconductor switches, to:
determine a junction temperature of the semiconductor switch;
compare the determined junction temperature to a reference temperature; and
adjust a switching gate voltage applied to the semiconductor switch to reduce a conduction loss if the determined junction temperature exceeds the reference temperature.
2 . The power electronics converter of claim 1 , wherein the first voltage supply is a DC supply and the second voltage supply is an AC supply.
3 . The power electronics converter of claim 2 , wherein the second set of terminals comprises first, second and third terminals, each of the first, second and third terminals connected to a respective node between first, second and third pairs of the plurality of semiconductor switches, each of the first, second and third pairs of the plurality of semiconductor switches connected in series between first and second DC terminals of the DC supply.
4 . The power electronics converter of claim 1 , wherein the first and second voltage supplies are DC voltage supplies.
5 . The power electronics converter of claim 1 , wherein each of the plurality of semiconductor switches comprises a transistor and a reverse-biased diode connected in parallel.
6 . The power electronics converter of claim 5 , wherein each transistor is a bipolar transistor, a power MOSFET or an insulated-gate bipolar transistor, IGBT.
7 . The power electronics converter of claim 6 , wherein each transistor is a SiC- or GaN-based power MOSFET.
8 . The power electronics converter of claim 1 , wherein the controller is configured, for each of the semiconductor switches, to adjust a gate switching frequency applied to the semiconductor switch to reduce a variation in the determined junction temperature if the variation in the determined junction temperature exceeds a reference temperature variation.
9 . The power electronics converter of claim 8 , wherein the controller is configured to shut down operation of the semiconductor switches if, after adjusting the switching gate voltage and adjusting the switching gate frequency, the determined junction temperature exceeds the reference temperature.
10 . The power electronics converter of claim 1 , wherein the controller comprises:
a thermal management controller configured to receive voltage and current signals from the voltage and current sensors and determine the junction temperature of each of the semiconductor switches; and
a gate driver controller configured to provide switching signals to the semiconductor switches.
11 . The power electronics converter of claim 10 , wherein the thermal management controller is configured to determine the junction temperature of each of the semiconductor switches with on a thermal model based on inputs including the received voltage and current signals and a gate switching frequency for each of the semiconductor switches.
12 . A method of operating a power electronics converter comprising:
a first set of terminals connected to a first voltage supply;
a second set of terminals connected to a second voltage supply;
a plurality of semiconductor switches connected between the first and second sets of terminals;
a voltage sensor connected to measure a voltage across the second supply;
a current sensor connected to measure a current through the second supply; and
a controller connected to provide switching signals to the semiconductor switches and to receive voltage and current signals from the voltage and current sensors,
the method comprising, for each of the semiconductor switches, the controller:
determining a junction temperature of the semiconductor switch;
comparing the determined junction temperature to a reference temperature; and
adjusting a switching gate voltage applied to the semiconductor switch to reduce a conduction loss if the determined junction temperature exceeds the reference temperature.
13 . The method of claim 12 , wherein the controller adjusts a gate switching frequency applied to the semiconductor switch to reduce a variation in the determined junction temperature if the variation in the determined junction temperature exceeds a reference temperature variation.
14 . The method of claim 13 , wherein the controller shuts down operation of the semiconductor switches if, after adjusting the switching gate voltage and adjusting the switching gate frequency, the determined junction temperature exceeds the reference temperature.
15 . The method of claim 12 , wherein the controller comprises:
a thermal management controller configured to receive voltage and current signals from the voltage and current sensors and determine the junction temperature of each of the semiconductor switches; and
a gate driver controller configured to provide switching signals to the semiconductor switches.
16 . The method of claim 15 , wherein the thermal management controller determines the junction temperature of each of the semiconductor switches with a thermal model based on inputs including the received voltage and current signals and a gate switching frequency for each of the semiconductor switches.
17 . An aircraft power and propulsion system comprising:
a gas turbine engine; and
an electrical power system comprising an electrical machine and a power electronics converter according to claim 1 ,
wherein the electrical machine of the electrical power system is mechanically coupled with a spool of the gas turbine engine.
18 . An aircraft comprising the power electronics converter according to claim 1 .
19 . The aircraft of claim 18 , wherein the aircraft is a hybrid electric aircraft.