Semiconductor device
The semiconductor device includes a semiconductor layer having an active portion and a gate finger portion, an MIS transistor formed at the active portion including a gate trench and a source region, a channel region and a drain region sequentially along a side surface of the gate trench, a plurality of first gate finger trenches arranged by an extended portion of the gate trench, a gate electrode embedded each in the gate trench and the first gate finger trench, a second conductive-type first bottom-portion impurity region formed at least at a bottom portion of the first gate finger trench, a gate finger which crosses the plurality of first gate finger trenches and is electrically connected to the gate electrode, and a second conductive-type electric field relaxation region formed more deeply than the bottom portion of the first gate finger trench between the mutually adjacent first gate finger trenches.
1 . A semiconductor device comprising:
a semiconductor layer which includes an active portion and a gate finger portion;
an MIS transistor which is formed at the active portion and which includes a gate trench as well as a first conductive-type source region, a second conductive-type channel region and a first conductive-type drain region sequentially along a side surface of the gate trench;
a second conductive-type impurity region formed at the active portion so as to continue to the channel region and extends toward a rear surface of the semiconductor layer down to a position deeper than the channel region and the gate trench in the drain region;
a plurality of first gate finger trenches which are arranged by an extended portion of the corresponding gate trench at the gate finger portion;
a gate electrode embedded each in the gate trench and a first gate finger trench of the plurality of first gate finger trenches via a gate insulating film;
a second conductive-type first bottom-portion impurity region which is formed at least at a bottom portion of the first gate finger trench;
a gate finger which is electrically connected to the gate electrode; and
a second conductive-type electric field relaxation region which is formed more deeply than the bottom portion of the first gate finger trench and covers a region entirely between mutually adjacent first gate finger trenches of the plurality of first gate finger trenches, wherein
the depth of the second conductive-type electric field relaxation region at the gate finger portion is equal to or smaller than the depth of the second conductive-type impurity region at the active portion at the deepest portion, and
the second conductive-type electric field relaxation region is formed continuously at a region deeper than the first gate finger trench from one of the first gate finger trenches to the other of the first gate finger trenches.
2 . The semiconductor device according to claim 1 which additionally includes a second gate finger trench which is formed between the mutually adjacent first gate finger trenches and being integral with the gate trench,
wherein the electric field relaxation region includes a second bottom-portion impurity region formed at least at a bottom portion of the second gate finger trench.
3 . The semiconductor device according to claim 2 , wherein the second gate finger trench extends along the first gate finger trench.
4 . The semiconductor device according to claim 1 , wherein
the region between the mutually adjacent first gate finger trenches includes a flat region in which a surface of the semiconductor layer continues from one of the first gate finger trenches to the other of the first gate finger trenches,
the region additionally includes in the flat region a second conductive-type surface-portion impurity region which is formed more shallowly than the bottom portion of the first gate finger trench, and
the electric field relaxation region includes a region formed so as to continue to the surface-portion impurity region.
5 . The semiconductor device according to claim 1 , wherein
the region between the mutually adjacent first gate finger trenches includes a flat region in which a surface of the semiconductor layer continues from one of the first gate finger trenches to the other of the first gate finger trenches,
the region additionally includes in the flat region a second conductive-type surface-portion impurity region which is formed more shallowly than the bottom portion of the first gate finger trench, and
the electric field relaxation region includes a region which is formed below the surface-portion impurity region, with a clearance kept.
6 . The semiconductor device according to claim 1 , wherein
the region between the mutually adjacent first gate finger trenches includes a flat region in which the surface of the semiconductor layer continues from one of the first gate finger trenches to the other of the first gate finger trenches,
the second conductive-type electric field relaxation region has the same depth as the second conductive-type first bottom-portion impurity regions at bottom portions of the one and the other first gate finger trenches throughout the entire space of the region,
the region between the mutually adjacent first gate finger trenches is entirely covered by the second conductive-type electric field relaxation region.
7 . The semiconductor device according to claim 1 , wherein
the MIS transistor further includes a second conductive-type channel contact region adjacent to the source region in a unit cell between mutually adjacent gate trenches, and a second conductive-type pillar layer formed in a region inside the channel region of each unit cell, and
the second conductive-type pillar layer is formed so as to continue to the channel region and extends toward the rear surface of the semiconductor layer down to a position deeper than the channel region and the gate trench in the drain region.
8 . The semiconductor device according to claim 1 ,
the gate finger portion surrounds the active portion,
the semiconductor device further comprises a source metal covering the active portion and a gate pad,
a removal region surrounding a central portion of the source metal along the gate finger portion is formed at a circumferential edge portion of the source metal,
the gate pad is formed in the removal region, and
the gate finger is formed so as to extend over the entire removal region from the gate pad.
9 . The semiconductor device according to claim 8 , wherein the source metal, the gate pad and the gate finger are made of aluminum.
10 . The semiconductor device according to claim 8 , wherein a pair of the gate fingers are formed in a shape symmetrical to the gate pad.
11 . The semiconductor device according to claim 1 , wherein
the first gate finger trench includes an upper edge which is a corner portion which includes an intersection line between a side surface of the first gate finger trench and a front surface of the semiconductor layer, and
the upper edge includes an inclined surface which allows the surface of the semiconductor layer to continue to an inner surface of the first gate finger trench.
12 . The semiconductor device according to claim 1 , wherein
the first gate finger trench includes an upper edge which is a corner portion which includes an intersection line between a side surface of the first gate finger trench and a front surface of the semiconductor layer, and
the upper edge includes a circular surface which allows the surface of the semiconductor layer to continue to the inner surface of the trench.
13 . The semiconductor device according to claim 1 , wherein the gate insulating film on the bottom portion of the first gate finger trench is thicker than the gate insulating film on a side surface of the first gate finger trench.
14 . The semiconductor device according to claim 1 , wherein the gate insulating film of the first gate finger trench additionally includes on a front surface of the semiconductor layer a portion which is thicker than the gate insulating film on a side surface of the first gate finger trench.
15 . The semiconductor device according to claim 1 , wherein
the first gate finger trench includes a lower edge at the bottom portion thereof, and
the lower edge of the first gate finger trench includes a circular surface which allows a side surface of the first gate finger trench to continue to the bottom portion thereof.
16 . The semiconductor device according to claim 1 , wherein the semiconductor layer is composed of a wide band gap semiconductor.
17 . The semiconductor device according to claim 16 , wherein the semiconductor layer is an SiC semiconductor layer.
18 . The semiconductor device according to claim 1 , wherein avalanche breakdown preferentially occurs at the active portion rather than the gate finger portion.
19 . A semiconductor device comprising:
an SiC semiconductor layer which includes an active portion and a gate finger portion;
an MIS transistor which is formed at the active portion and which includes a gate trench as well as a first conductive-type source region, a second conductive-type channel region and a first conductive-type drain region sequentially along a side surface of the gate trench;
a second conductive-type impurity region formed at the active portion so as to continue to the channel region and extends toward a rear surface of the SiC semiconductor layer down to a position deeper than the channel region and the gate trench in the drain region;
a plurality of first gate finger trenches which are arranged by an extended portion of the corresponding gate trench at the gate finger portion;
a gate electrode embedded each in the gate trench and a first gate finger trench of the plurality of first gate finger trenches via a gate insulating film;
a second conductive-type first bottom-portion impurity region which is formed at least at a bottom portion of the first gate finger trench;
a gate finger which is electrically connected to the gate electrode; and
a second conductive-type electric field relaxation region which is formed more deeply than the bottom portion of the first gate finger trench and covers a region entirely between mutually adjacent first gate finger trenches of the plurality of first gate finger trenches, wherein
the depth of the second conductive-type electric field relaxation region at the gate finger portion is equal to or smaller than the depth of the second conductive-type impurity region at the active portion at the deepest portion,
a region between the mutually adjacent first gate finger trenches includes a flat region in which the surface of the SiC semiconductor layer continues from one of the first gate finger trenches to the other of the first gate finger trenches,
the second conductive-type electric field relaxation region has the same depth as the second conductive-type first bottom-portion impurity regions at bottom portions of the one and the other first gate finger trenches throughout the entire space of the region, the region between the mutually adjacent first gate finger trenches is entirely covered by the second conductive-type electric field relaxation region,
the MIS transistor further includes a second conductive-type channel contact region adjacent to the source region in a unit cell between mutually adjacent gate trenches, and a second conductive-type pillar layer formed in a region inside the channel region of each unit cell,
the second conductive-type pillar layer is formed so as to continue to the channel region and extends toward the rear surface of the SiC semiconductor layer down to a position deeper than the channel region and the gate trench in the drain region, and
the second conductive-type electric field relaxation region-impurity region is formed continuously at a region deeper than the first gate finger trench from one of the first gate finger trenches to the other of the first gate finger trenches.
20 . The semiconductor device according to claim 19 , wherein the gate finger portion surrounds the active portion,
the semiconductor device further comprises a source metal covering the active portion and a gate pad,
a removal region surrounding a central portion of the source metal along the gate finger portion is formed at a circumferential edge portion of the source metal,
the gate pad is formed in the removal region, and
the gate finger is formed so as to extend over the entire removal region from the gate pad.
21 . The semiconductor device according to Claim 20 , wherein the source metal, the gate pad and the gate finger are made of aluminum.
22 . The semiconductor device according to Claim 20 , wherein a pair of the gate fingers are formed in a shape symmetrical to the gate pad.