Semiconductor package and method of manufacturing semiconductor package
Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistribution layer, a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer, an encapsulant on the semiconductor chip, at least one antenna pattern on the encapsulant, a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer, and electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer, wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices.
1 . A semiconductor package comprising:
a redistribution structure comprising a first surface and a second surface opposite to each other, the redistribution structure comprising a redistribution layer;
a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer;
an encapsulant on the semiconductor chip;
at least one antenna pattern on the encapsulant;
a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer; and
electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer,
wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices,
wherein the surface of the encapsulant comprises an upper surface opposite to the first surface, and a side surface extending from the upper surface toward the first surface,
wherein the side wiring line extends along the side surface of the encapsulant, and
wherein the side wiring line is in a trench extending along the side surface of the encapsulant.
2 . The semiconductor package of claim 1 , wherein the electronic devices comprise at least one of a power amp module (PAM), a frequency filter, a radio frequency (RF) switch, and passive devices.
3 . The semiconductor package of claim 1 , wherein the side wiring line comprises a first side wiring line connected to a first end of the antenna pattern and a second side wiring line connected to a second end of the antenna pattern.
4 . The semiconductor package of claim 3 , wherein the first side wiring line is configured to transmit a signal generated by the semiconductor chip to the antenna pattern, and
wherein the second side wiring line is configured to transmit a signal received by the antenna pattern to the semiconductor chip.
5 . The semiconductor package of claim 1 , further comprising:
a dielectric layer between the encapsulant and the antenna pattern.
6 . The semiconductor package of claim 5 , wherein the dielectric layer comprises a photosensitive resin, and
wherein the encapsulant comprises a non-photosensitive resin.
7 . The semiconductor package of claim 5 , wherein a thickness of the dielectric layer is greater than or equal to 200 μm in a direction perpendicular to the first surface.
8 . The semiconductor package of claim 1 , wherein the antenna pattern comprises a seed layer on the encapsulant and a plating layer stacked on the seed layer.
9 . The semiconductor package of claim 8 , wherein the seed layer comprises titanium (Ti) or a titanium (Ti) alloy, and
wherein the plating layer comprises copper (Cu) or a copper (Cu) alloy.
10 . The semiconductor package of claim 1 , further comprising:
a core member on the first surface of the redistribution structure and adjacent to the semiconductor chip.
11 . A semiconductor package comprising:
a redistribution structure comprising a first surface and a second surface opposite to each other, the redistribution structure comprising a redistribution layer;
a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer;
an encapsulant on the semiconductor chip;
at least one antenna pattern on the encapsulant, the antenna pattern comprising a first end and a second end spaced apart from each other;
a dielectric layer between the encapsulant and the at least one antenna pattern;
a first side wiring line extending from the first end of the antenna pattern to the redistribution layer;
a second side wiring line extending from the second end of the antenna pattern to the redistribution layer; and
electronic devices comprising first devices on the second surface of the redistribution structure and electrically connected to the first side wiring line through the redistribution layer, and second devices electrically connected to the second side wiring line through the redistribution layer.
12 . The semiconductor package of claim 11 , wherein the first devices comprise a power amp module (PAM), a frequency filter, a radio frequency (RF) switch, and a passive device.
13 . The semiconductor package of claim 11 , wherein the second devices include a frequency filter, a radio frequency (RF) switch, and a passive device.
14 . The semiconductor package of claim 11 , wherein the first side wiring line is configured to transmit a signal generated by the semiconductor chip to the antenna pattern, and
wherein the second side wiring line is configured to transmit a signal received by the antenna pattern to the semiconductor chip.
15 . A semiconductor package comprising:
a redistribution structure comprising a first surface and a second surface opposite to each other, the redistribution structure comprising an insulating layer and a redistribution layer in the insulating layer;
a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer;
an encapsulant on the semiconductor chip on the first surface;
at least one antenna pattern on the encapsulant;
a side wiring line extending from one end of the antenna pattern to the redistribution layer, the side wiring line comprising a first side surface being in contact with the one end of the antenna pattern, the encapsulant, and the insulating layer, and a second side surface opposite to the first side surface, the second side surface being exposed from the encapsulant and the insulating layer; and
electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer.
16 . The semiconductor package of claim 15 , wherein the semiconductor package comprises a side surface provided by the encapsulant and the insulating layer, and
wherein the second side surface is coplanar with the side surface of the semiconductor package.
17 . The semiconductor package of claim 15 , wherein the insulating layer comprises a photosensitive resin, and
wherein the encapsulant comprises a non-photosensitive resin.