Foldable electronic device
A foldable electronic device includes a first body, a second body, a pivot, and a sensing component. The pivot is pivotally connected between the first body and the second body. The first body and the second body are configured to rotate relative to each other through the pivot, and the pivot includes a driving element. The sensing component is coupled to the pivot and the second body, and includes a sensing substrate and an interfering element connecting the sensing substrate. The driving element structurally interferes with the interfering element while rotating along with the pivot, so as to drive the interfering element to rotate, such that the sensing substrate rotates between an initial position where the sensing substrate leans on a back surface of the second body, and an operating position where an acute angle is formed between the sensing substrate and the back surface of the second body.
1 . A foldable electronic device, comprising:
a first body and a second body, wherein the second body comprises a front surface facing the first body and a back surface opposite to the front surface;
a pivot pivotally connected between the first body and the second body, wherein the first body and the second body rotate relative to each other through the pivot, and the pivot comprises a driving element; and
a sensing component coupled to the pivot and the second body and comprising a sensing substrate and an interfering element connecting the sensing substrate, wherein the driving element structurally interferes with the interfering element while rotating along with the pivot, so as to drive the interfering element to rotate, such that the sensing substrate rotates between an initial position where the sensing substrate directly contacts a part of the back surface of the second body and an operating position where an acute angle is formed between the sensing substrate and the back surface of the second body, wherein when the sensing substrate is at the initial position, an outer surface of the sensing substrate is substantially coplanar with another part of the back surface adjacent thereto.
2 . The foldable electronic device according to claim 1 , wherein the second body further comprises a sliding rail, and the interfering element further comprises a slider slidably disposed in the sliding rail, wherein when the driving element drives the interfering element to rotate, the slider slides along the sliding rail to cause the sensing component to rotate relative to the second body.
3 . The foldable electronic device according to claim 1 , wherein the interfering element is rotatably inserted into the second body.
4 . The foldable electronic device according to claim 1 , wherein the driving element comprises a protrusion, and the protrusion is configured to push the interfering element to drive the interfering element to rotate when the pivot rotates.
5 . The foldable electronic device according to claim 1 , further comprising an elastic restoring element connected between the second body and the interfering element to use an elastic restoring force of the elastic restoring element to restore the sensing substrate at the operating position to the initial position.
6 . The foldable electronic device according to claim 1 , wherein the driving element comprises a gear, and the interfering element comprises a rack engaged with the gear, wherein the gear drives the rack to rotate when the pivot rotates.
7 . The foldable electronic device according to claim 1 , wherein the sensing substrate comprises a sensor electrically connected to the second body.
8 . The foldable electronic device according to claim 7 , wherein the sensor comprises an ultrasonic sensor or a pressure sensor.
9 . The foldable electronic device according to claim 1 , wherein the second body further comprises a plurality of heat dissipation ports disposed on the back surface of the second body.
10 . The foldable electronic device according to claim 9 , wherein the sensing substrate covers the plurality of heat dissipation ports when the sensing substrate is at the initial position, and the sensing substrate exposes the plurality of heat dissipation ports when the sensing substrate is at the operating position.