Elastic wave device
An elastic wave device includes a support substrate, a piezoelectric film directly or indirectly provided on the support substrate, and an IDT electrode on the piezoelectric film. The piezoelectric film includes a first piezoelectric film in which a surface facing the support substrate is a plus surface and a surface facing the IDT electrode is a minus surface, and a second piezoelectric film in which a surface facing the support substrate is a minus surface and a surface facing the IDT electrode is a plus surface, the second piezoelectric film being disposed on the first piezoelectric film. A total of the thickness of the first piezoelectric film and the thickness of the second piezoelectric film is about 1λ or less where λ represents a wavelength determined by an electrode finger pitch of the IDT electrode.
1 . An elastic wave device comprising:
a support substrate;
a piezoelectric film directly or indirectly provided on the support substrate; and
an IDT electrode on the piezoelectric film; wherein
the piezoelectric film includes a first piezoelectric film in which a surface facing the support substrate is a minus surface and a surface facing the IDT electrode is a plus surface, and a second piezoelectric film in which a surface facing the support substrate is a plus surface and a surface facing the IDT electrode is a minus surface, the second piezoelectric film being located on the first piezoelectric film; and
a total of a thickness of the first piezoelectric film and a thickness of the second piezoelectric film is about 1λ or less, where λ represents a wavelength determined by an electrode finger pitch of the IDT electrode.
2 . The elastic wave device according to claim 1 , wherein the total of the thickness of the first piezoelectric film and the second piezoelectric film is about 0.5λ or less.
3 . The elastic wave device according to claim 1 , wherein the total of the thickness of the first piezoelectric film and the second piezoelectric film is about 0.25λ or less.
4 . The elastic wave device according to claim 1 , wherein the first piezoelectric film or the second piezoelectric film closer to the support substrate has a thickness larger than a thickness of another one of the first piezoelectric film or the second piezoelectric film farther from the support substrate.
5 . The elastic wave device according to claim 1 , wherein the first piezoelectric film and the second piezoelectric film are stacked such that the plus surface of the first piezoelectric film is in contact with the plus surface of the second piezoelectric film.
6 . The elastic wave device according to claim 1 , wherein the first piezoelectric film and the second piezoelectric film are each a LiTaO 3 film.
7 . The elastic wave device according to claim 6 , wherein the first piezoelectric film and the second piezoelectric film are each a Y-cut LiTaO 3 film with a cut angle of the first piezoelectric film or the second piezoelectric film being −20° or more and 75° or less.
8 . The elastic wave device according to claim 6 , wherein a cut angle of each of the first piezoelectric film and the second piezoelectric film is a value within a range of about (y±10°)+180n (where n represents an integer of 0, 1, 2, 3 . . . ) or a range of about (y±10°)−180n (where n represents an integer of 0, 1, 2, 3 . . . ), and y satisfies formula (1) below where x (%) represents a ratio of a thickness of one piezoelectric film selected from the first piezoelectric film and the second piezoelectric film to the total thickness of the first piezoelectric film and the second piezoelectric film, the one selected piezoelectric film being adjacent to or in a vicinity of the support substrate:
y=− 0.0009955556 x 3 +0.1552380952 x 2 −4.6325396825 x+ 78.5714285714 formula (1).
9 . The elastic wave device according to claim 1 , wherein the first and second piezoelectric films are each a LiNbO 3 film.
10 . The elastic wave device according to claim 9 , wherein the first and second piezoelectric films are each a Y-cut LiNbO 3 film with a cut angle of about −20° or more and about +90° or less.
11 . The elastic wave device according to claim 9 , wherein a cut angle of each of the first piezoelectric film and the second piezoelectric film is a value within a range of about (y±10°)+180n (where n represents an integer of 0, 1, 2, 3 . . . ) or a range of (y±10°)−180n (where n represents an integer of 0, 1, 2, 3 . . . ), and y satisfies formula (2) below where x (%) represents a ratio of a thickness of one piezoelectric film selected from the first piezoelectric film and the second piezoelectric film to the total thickness of the first piezoelectric film and the second piezoelectric film, the one selected piezoelectric film being adjacent to or in a vicinity of the support substrate:
y= 0.0091 x 2 +0.3543 x+ 24.5 formula (2).
12 . The elastic wave device according to claim 1 , further comprising an insulating film interposed between the first piezoelectric film and the second piezoelectric film.
13 . The elastic wave device according to claim 1 , further comprising a high acoustic velocity material layer interposed between the support substrate and the piezoelectric film, and made of a high acoustic velocity material in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in the first piezoelectric film and the second piezoelectric film.
14 . The elastic wave device according to claim 13 , wherein the support substrate is made of the high acoustic velocity material, and the high acoustic velocity material layer and the support substrate are integrated.
15 . The elastic wave device according to claim 13 , further comprising a low acoustic velocity film interposed between the high acoustic velocity material layer and the piezoelectric film and made of a low acoustic velocity material in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the first piezoelectric film and the second piezoelectric film.
16 . The elastic wave device according to claim 1 , further comprising a dielectric film covering the IDT electrode.
17 . The elastic wave device according to claim 1 , wherein the IDT electrode includes a main electrode layer made of Al or an AlCu alloy.
18 . The elastic wave device according to claim 1 , wherein the support substrate is made of Si having a (111) surface, Si having a (110) surface, or quartz crystal.
19 . The elastic wave device according to claim 1 , wherein the first piezoelectric film and the second piezoelectric film are each made of lithium tantalate or lithium niobate.
20 . An elastic wave device comprising:
a support substrate;
a piezoelectric film directly or indirectly provided on the support substrate; and
an IDT electrode on the piezoelectric film; wherein
the piezoelectric film includes a first piezoelectric film in which a surface facing the support substrate is a plus surface and a surface facing the IDT electrode is a minus surface, and a second piezoelectric film in which a surface facing the support substrate is a minus surface and a surface facing the IDT electrode is a plus surface, the second piezoelectric film being located on the first piezoelectric film; and
a total of a thickness of the first piezoelectric film and a thickness of the second piezoelectric film is about 1λ or less, where λ represents a wavelength determined by an electrode finger pitch of the IDT electrode.