Granted Patent B2

US 12,575,063 · App. 18/900,960 · Granted Mar 10, 2026

Inventor: Jemm Yue Liang (Sunnyvale, CA)

Assignee: xMEMS Labs, Inc.

H05K7/20327H05K7/20345H05K7/20354H05K7/20318

Abstract

Claims (37)

1 . A cooling system, comprising:

a channel, encompassing a heat source;

a coolant-droplets introducer, configured to inject coolant droplets into a gaseous flow to form a mist-stream, wherein the mist-stream is injected into the channel encompassing the heat source, wherein the coolant droplets vaporize as coolant gas in the channel due to heat generated by the heat source;

a compressor, configured to pump the coolant gas from the channel encompassing the heat source into a condenser; and

the condenser, configured to condense the coolant gas into coolant liquid;

wherein the coolant liquid is introduced to the coolant-droplets introducer to form the coolant droplets;

wherein an air conduit and a coolant conduit are separately coupled to the channel;

wherein the coolant droplets are forced into different regions of the channel before vaporizing as the coolant gas.

2 . The cooling system of claim 1 , comprising:

a pressure regulating valve, configured to regulate a pressure difference between a pressure corresponding to the channel and a pressure corresponding to the condenser.

3 . The cooling system of claim 1 , comprising:

a heat remover, configured to remove heat released by the condenser.

4 . The cooling system of claim 3 ,

wherein the heat remover comprises an air movement device.

5 . The cooling system of claim 3 ,

wherein the heat remover comprises a chilling device.

6 . The cooling system of claim 1 , comprising:

the air conduit, connected to the channel; and

the coolant conduit, connected to the coolant-droplets introducer.

7 . The cooling system of claim 1 , wherein the coolant-droplets introducer comprises:

a reservoir part and a mister part;

wherein the reservoir part is configured to store the coolant liquid;

wherein the mister part is configured to inject the coolant droplets into the channel.

8 . The cooling system of claim 1 , wherein the mist-stream comprises a gaseous transport medium and the coolant droplets, wherein the gaseous transport medium is infused with the coolant droplets.

9 . The cooling system of claim 1 ,

wherein the compressor sustains a pressure difference between the channel and the condenser.

10 . The cooling system of claim 9 ,

wherein the compressor sustains the pressure difference such that a boiling temperature of a coolant in the channel is lower than a dew temperature of the coolant in the condenser.

11 . The cooling system of claim 1 ,

wherein the heat source comprises through silicon via (TSV) within integrated circuit (IC) package.

12 . The cooling system of claim 1 ,

wherein a temperature of the channel is kept no greater than a specific level or kept within a specific range;

wherein the specific level is corresponding to a boiling point of a coolant at a pressure within the channel.

13 . The cooling system of claim 1 ,

wherein the condenser comprises a tube with a repeating pattern of S-shaped curves.

14 . The cooling system of claim 13 ,

wherein a diameter of the tube within the condenser is gradually narrow from an inlet to an outlet.

Assignments (1)

Continuity (6)

References Cited (25)