Semiconductor device including element isolation insulating film having thermal oxide film
A semiconductor device includes a semiconductor substrate, a base region, an emitter region, a collector region, and an element isolation insulating film. The semiconductor substrate has a main surface. The base region has a first conductivity type and is disposed in a surface layer of the semiconductor substrate that is close to the main surface. The emitter region has a second conductivity type and is disposed in a surface layer of the base region. The collector region has the second conductivity type and is disposed at a portion in the surface layer of the semiconductor substrate apart from the emitter region. The element isolation insulating film is disposed on the main surface, and has a thermal oxide film being in contact with a junction interface between the base region and the emitter region.
1 . A semiconductor device comprising:
a semiconductor substrate having a main surface;
a base region having a first conductivity type and disposed in a surface layer of the semiconductor substrate that is close to the main surface;
an emitter region having a second conductivity type reverse to the first conductivity type and disposed in a surface layer of the base region;
a collector region having the second conductivity type and disposed at a portion in the surface layer of the semiconductor substrate that is apart from the emitter region; and
an element isolation insulating film disposed on the main surface, and having a thermal oxide film being in contact with a junction interface between the base region and the emitter region, wherein
the semiconductor substrate includes an active layer of the second conductivity type that provides the surface layer of the semiconductor substrate,
the base region includes a first region and a second region, the first region encloses the emitter region, and the second region extends from the first region toward the collector region and has an impurity concentration higher than an impurity concentration of the first region,
a bottom surface of the second region is located at a depth shallower than a bottom surface of the first region with reference to the main surface, and
the bottom surface of the second region is in contact with the active layer.
2 . The semiconductor device according to claim 1 , wherein
the junction interface between the base region and the emitter region is in contact with a bottom surface of the element isolation insulating film.
3 . The semiconductor device according to claim 1 , further comprising
a wiring portion disposed on the main surface of the semiconductor substrate and electrically connected to the base region, wherein
the wiring portion extends to a position closer to the collector region than an end portion of the base region that is close to the collector region in plan view from a thickness direction of the semiconductor substrate.
4 . The semiconductor device according to claim 1 , wherein
the bottom surface of the second region is entirely in contact with the active layer.
5 . The semiconductor device according to claim 1 , wherein
an entirety of the bottom surface of the second region is in contact with the active layer.
6 . The semiconductor device according to claim 1 , wherein
the second region is separated from the collector region via the active layer.