Granted Patent B2

US 12,577,441 · App. 17/869,168 · Granted Mar 17, 2026

Inventors: Daisuke Watanabe (Saitama, JP); Kota Suetsugu (Saitama, JP); Akira Yamakami (Saitama, JP); Yumi Kagiyama (Saitama, JP)

Assignee: DIC Corporation

C09J11/08C09J7/38C09J153/02C09J2301/302C09J2301/408C09J2301/414

Abstract

Claims (21)

1 . An adhesive tape comprising:

a substrate layer; and

an adhesive layer,

wherein:

the substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 400% to 3000%,

the following relational expression (i) is satisfied:

[Math. 1]

P 400 /P 0 ≤0.9  (i), and

P 0 denotes an initial cleavage strength N/cm 2 of the adhesive tape, and P 400 denotes a cleavage strength N/cm 2 when the adhesive tape is stretched by 400%, and

the adhesive layer has a storage modulus G′ in a range of 2.0×10 5 to 1.0×10 7 Pa at 23° C.

2 . The adhesive tape according to claim 1 , wherein the adhesive layer contains filler.

3 . The adhesive tape according to claim 2 , wherein the filler is a silicone resin.

4 . The adhesive tape according to claim 1 , wherein the adhesive layer contains a styrene block copolymer.

5 . The adhesive tape according to claim 1 , wherein the adhesive layer contains a triblock copolymer with a repeating unit represented by

wherein A, B, and C independently denote a repeating unit,

A and C independently denote an alkyl methacrylate monomer unit,

B denotes an alkyl acrylate monomer unit,

p, q, and r independently denote a degree of polymerization of monomer units respectively,

A and C are the same or denote an alkyl methacrylate monomer unit with a different chemical structure, and

* denotes a bonding arm to another atom.

6 . The adhesive tape according to claim 1 , wherein the adhesive layer further contains a tackifier resin.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (13)