Reconfigurable surface and manufacturing method thereof
Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.
1 . A reconfigurable surface, configured to modulate a phase of an electromagnetic wave, comprising:
a first substrate;
a plurality of modulating units, disposed on the first substrate, wherein one of the plurality of modulating units comprises:
a first electrode, disposed on the first substrate;
a plurality of second electrodes, disposed adjacent to the first electrode; and
a modulating medium, located between the first electrode and the plurality of second electrodes; and
a ground signal layer, disposed under the first substrate,
wherein the first electrode and the plurality of second electrodes are located between the modulating medium and the first substrate, and
wherein in a top view of the reconfigurable surface, a plurality of sides of the first electrode respectively comprise a plurality of openings, and the plurality of second electrodes are respectively disposed in the plurality of openings.
2 . The reconfigurable surface according to claim 1 , wherein two of the plurality of second electrodes are arranged along a first direction, another two of the plurality of second electrodes are arranged along a second direction, and the first direction and the second direction are perpendicular to each other.
3 . The reconfigurable surface according to claim 1 , wherein the modulating medium comprises in-plane-switching liquid crystal.
4 . The reconfigurable surface according to claim 1 , wherein the modulating medium covers the first electrode and the plurality of second electrodes.
5 . The reconfigurable surface according to claim 1 , further comprising:
a second substrate, opposite to the first substrate, wherein the ground signal layer is located between the first substrate and the second substrate.
6 . The reconfigurable surface according to claim 5 , further comprising:
a welding part, wherein the first substrate and the second substrate are joined to each other by the welding part.
7 . The reconfigurable surface according to claim 1 , wherein the first electrode is electrically connected to a common electrode line.
8 . A reconfigurable surface, configured to modulate a phase of an electromagnetic wave, comprising:
a first substrate;
a plurality of modulating units, disposed on the first substrate, wherein one of the plurality of modulating units comprises:
a first electrode, disposed on the first substrate;
a second electrode, disposed adjacent to the first electrode; and
a modulating medium, located between the first electrode and the second electrode; and
a ground signal layer, disposed under the first substrate,
wherein the modulating medium is located between the first electrode and the second electrode in a thickness direction of the first substrate, and
wherein the first electrode comprises a first portion and a second portion surrounding the first portion, there is a gap between the second portion and the first portion, and the second electrode overlaps with the partial first portion, the partial second portion, and the partial gap.
9 . The reconfigurable surface according to claim 8 , wherein the modulating medium comprises electrically controllable birefringence liquid crystal.
10 . A manufacturing method of a reconfigurable surface, wherein the reconfigurable surface is configured to modulate a phase of an electromagnetic wave, and the manufacturing method of the reconfigurable surface comprises:
forming a modulating structure, comprising:
providing a first substrate;
forming a first electrode and a second electrode on the first substrate; and
forming a modulating medium between the first electrode and the second electrode;
forming a circuit structure, comprising:
providing a second substrate; and
forming a ground signal layer on the second substrate; and
joining the modulating structure to the circuit structure by a welding part,
wherein forming the modulating structure further comprises:
forming a plurality of through holes in the first substrate; and
forming a plurality of conducting lines in the plurality of through holes and under the first substrate, wherein the first electrode and the second electrode are electrically connected to the circuit structure by the plurality of conducting lines and the welding part.
11 . The manufacturing method of the reconfigurable surface according to claim 10 , wherein the modulating medium is located between the first electrode and the second electrode, the first electrode comprises a first portion and a second portion surrounding the first portion, there is a gap between the second portion and the first portion, and forming the modulating structure further comprises:
forming a conductive member in the gap, wherein the second electrode is electrically connected to the circuit structure by the conductive member, at least one of the plurality of conducting lines, and the welding part.
12 . The manufacturing method of the reconfigurable surface according to claim 11 , wherein a thickness of the conductive member is greater than a thickness of the first electrode and a thickness of the second electrode.
13 . The manufacturing method of the reconfigurable surface according to claim 10 , wherein forming the first electrode and the second electrode on the first substrate is earlier than forming the modulating medium between the first electrode and the second electrode.
14 . The manufacturing method of the reconfigurable surface according to claim 13 , wherein the modulating medium comprises in-plane-switching liquid crystal.
15 . The manufacturing method of the reconfigurable surface according to claim 10 , wherein forming the first electrode and the second electrode on the first substrate and forming the modulating medium between the first electrode and the second electrode comprise:
forming the first electrode and the second electrode on the first substrate and a cover plate respectively;
joining the first substrate to the cover plate; and
filling the modulating medium between the first substrate and the cover plate.
16 . The manufacturing method of the reconfigurable surface according to claim 15 , wherein the modulating medium comprises electrically controllable birefringence liquid crystal.