Device and method for determining wafer bow
An apparatus for measuring bow of a wafer includes a substrate holder including a support surface configured to support a wafer, and an air flow system including a plurality of air outlets in the support surface which are configured to output air for elevating the wafer above the substrate holder. A capacitor array unit including a plurality of electrodes laterally spaced from one another in the capacitor array unit, each electrode facing the support surface and being spaced a respective fixed distance from the support surface such that each electrode can form a capacitor with an opposing area of a wafer elevated by the substrate holder.
1 . An apparatus for measuring bow of a wafer, comprising:
a substrate holder comprising:
a support surface configured to support a wafer, and
an air flow system including a plurality of air outlets in the support surface which are configured to output air for elevating the wafer above the substrate holder;
a capacitor array unit comprising a plurality of electrodes laterally spaced from one another in the capacitor array unit, each electrode facing the support surface and being spaced a respective fixed distance from the support surface such that each electrode can form a capacitor with an opposing area of a wafer elevated by the substrate holder;
a controller electrically connected to each electrode and configured to be electrically connected to a wafer supported by the support surface, the controller comprising:
a voltage source configured to provide a voltage to each electrode; and
a capacitance measurement device configured to measure a capacitance on each electrode based on a respective voltage provided thereto; and
a processing unit including a processor and a memory for storing software which, when executed by the processor, calculates a distance from each electrode to an opposing area of a wafer provided on the substrate holder based on a capacitance measured on each respective electrode,
wherein
the memory stores software which, when executed by the processor, provides a wafer bow mapping based on the distance from each electrode to the opposing area of a wafer provided on the substrate holder, or
the memory stores software which, when executed by the processor, provides a 3D wafer bow mapping based on the distance from each electrode to the opposing area of a wafer provided on the substrate holder.
2 . The apparatus of claim 1 , wherein the air flow system includes a plurality of air inlets with each air inlet coupled to a respective plurality of the air outlets.
3 . The apparatus of claim 1 , wherein the air outlets are arranged on the support surface in a grid array pattern.
4 . The apparatus of claim 1 , wherein the plurality of electrodes are provided in a common plane such that the respective fixed distances of each electrode are equal.
5 . The apparatus of claim 1 , wherein the capacitor array unit comprises:
an insulating structure having a first surface facing the support surface and a second surface opposite to the first surface, the insulating structure supporting the plurality of electrodes; and
a plurality of signal lines supported by the insulating structure, each signal line being connected to a respective one of the plurality of electrodes.
6 . The apparatus of claim 5 , wherein each of the electrodes comprises a capacitor plate provided on the first surface of the insulating structure.
7 . The apparatus of claim 5 , wherein each of the electrodes comprises a capacitor plate which is at least partially embedded within the insulating structure.
8 . The apparatus of claim 5 , wherein each of the signal lines is at least partially embedded within the insulating structure.
9 . The apparatus of claim 5 , further comprising a cable coupled to the capacitor array unit and configured to bundle the plurality of signal lines as an input-output cable for the capacitor array unit.
10 . The apparatus of claim 1 , wherein the memory stores software which, when executed by the processor, controls air flow from the plurality of air outlets.
11 . A method of measuring wafer bow comprising:
providing a plurality of electrodes each facing a respective area of a wafer provided on a support surface such that the electrode and respective area form a capacitor;
elevating the wafer by air flow from the support surface;
measuring a capacitance value at each electrode;
calculating a distance from each electrode to its respective area based on the measured capacitance at a respective electrode;
determining a bow of the wafer based on the calculated distances; and
providing a 3D model of the wafer bow based on the calculated distances.
12 . The method of claim 11 , wherein the providing comprises providing multiple electrodes provided in a grid array.
13 . The method of claim 11 , further comprising controlling a process performed on the wafer based on the determined bow of the wafer.
14 . The method of claim 11 , further comprising performing a bow correction process on the wafer based on the determined bow of the wafer.