IP Library Granted Patent US 12,585,241
Granted Patent B2
US 12,585,241 · App. 17/840,386 · Granted Mar 24, 2026

Methods and apparatus for sensor-assisted part development in additive manufacturing

Inventors: Subhrajit Roychowdhury (Cohoes, NY); Naresh S. Iyer (Ballston Spa, NY); Sanghee Cho (Niskayuna, NY); Rogier Sebastiaan Blom (Clifton Park, NY); Brent Brunell (Clifton Park, NY); Xiaohu Ping (Halfmoon, NY); Sharath Aramanekoppa (Bangalore, IN)
Assignee: General Electric Company
G05B19/4099G05B2219/49023
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,585,241
App. No.
17/840,386
Granted
Mar 24, 2026
Kind
B2
Abstract

Methods and apparatus for sensor-based part development are disclosed. An example apparatus includes at least one memory, instructions in the apparatus, and processor circuitry to execute the instructions to identify a reference process observable of a computer-generated part, receive input from at least one sensor during three-dimensional printing to identify an estimated process observable using feature extraction, and adjust at least one three-dimensional printing process parameter to reduce an error identified from a mismatch between the estimated process observable and the reference process observable.

Claims (35)

1 . An apparatus, comprising:

at least one memory;

instructions in the apparatus; and

processor circuitry to execute the instructions to:

identify a reference process observable of a computer-generated part based on a voxelized reference map, the voxelized reference map corresponding to a mapping of voxels representative of three-dimensional (3D) units of an input image, the voxelized reference map determined based on a drill down model identifying a vertical distance from a voxel to a printing powder of a three-dimensional printer;

receive an image input from at least one sensor during three-dimensional printing;

perform feature extraction from the image input using a machine learning model to identify an estimated process observable, the machine learning model trained based on data from one or more three-dimensional printer sensors; and

adjust at least one three-dimensional printing process parameter of the three-dimensional printer to reduce an error identified from a mismatch between the estimated process observable and the reference process observable.

2 . The apparatus of claim 1 , wherein the processor circuitry is to identify the reference process observable based on a material property or a geometric feature of the computer-generated part.

3 . The apparatus of claim 1 , wherein the reference process observable or the estimated process observable is at least one of a meltpool width, a meltpool depth, a meltpool height, a temperature profile, or a cooling rate.

4 . The apparatus of claim 1 , wherein, when the reference process observable is a meltpool characteristic, the processor circuitry is to extract meltpool features, in real-time or offline, using the at least one sensor.

5 . The apparatus of claim 1 , wherein the processor circuitry is to adjust the at least one three-dimensional printing process parameter based on at least one of a real-time feedback implementation, a layer-to-layer feedback implementation, or a build-to-build feedback implementation.

6 . The apparatus of claim 5 , wherein the processor circuitry is to obtain (1) first estimated process observable information from a previous build using the build-to-build feedback implementation and (2) second estimated process observable information from a previous layer of a same build using the layer-to-layer feedback implementation.

7 . The apparatus of claim 1 , wherein the at least one three- dimensional printing process parameter includes at least one of a power, a speed, a focus, a beam shape, or an energy density.

8 . The apparatus of claim 1 , wherein the at least one sensor includes an on-axis sensor or an off-axis sensor.

9 . A method, comprising:

identifying a reference process observable of a computer-generated part based on a voxelized reference map, the voxelized reference map corresponding to a mapping of voxels representative of three-dimensional (3D) units of an input image, the voxelized reference map determined based on a drill down model identifying a vertical distance from a voxel to a printing powder of a three-dimensional printer;

receiving an image input from at least one sensor during three-dimensional printing;

performing feature extraction from the image input using a machine learning model to identify an estimated process observable, the machine learning model trained based on data from one or more three-dimensional printer sensors; and

adjusting at least one three-dimensional printing process parameter of the three-dimensional printer to reduce an error identified from a mismatch between the estimated process observable and the reference process observable.

10 . The method of claim 9 , further including identifying the reference process observable based on a material property or a geometric feature of the computer-generated part.

11 . The method of claim 9 , wherein the reference process observable or the estimated process observable is at least one of a meltpool width, a meltpool depth, a meltpool height, a temperature profile, or a cooling rate.

12 . The method of claim 9 , further including, when the reference process observable is a meltpool characteristic, extracting meltpool features, in real-time or offline, using the at least one sensor.

13 . The method of claim 9 , further including adjusting the at least one three-dimensional printing process parameter based on at least one of a real-time feedback implementation, a layer-to-layer feedback implementation, or a build-to-build feedback implementation.

14 . The method of claim 13 , further including (1) obtaining first estimated process observable information from a previous build using the build-to-build feedback implementation and (2) obtaining second estimated process observable information from a previous layer of a same build using the layer-to-layer feedback implementation.

15 . The method of claim 9 , wherein the at least one three-dimensional printing process parameter includes at least one of a power, a speed, a focus, a beam shape, or an energy density.

16 . The method of claim 9 , wherein the at least one sensor includes an on-axis sensor or an off-axis sensor.

17 . A non-transitory computer readable storage medium comprising instructions that, when executed, cause a processor to at least:

identify a reference process observable based on a computer-generated part based on a voxelized reference map, the voxelized reference map corresponding to a mapping of voxels representative of three-dimensional (3D) units of an input image, the voxelized reference map determined based on a drill down model identifying a vertical distance from a voxel to a printing powder of a three-dimensional printer;

receive an image input from at least one sensor during three-dimensional printing;

perform feature extraction from the image input using a machine learning model to identify an estimated process observable, the machine learning model trained based on data from one or more three-dimensional printer sensors; and

adjust at least one three-dimensional printing process parameter of the three-dimensional printer to reduce an error identified from a mismatch between the estimated process observable and the reference process observable.

18 . The non-transitory computer readable storage medium of claim 17 , wherein the processor is to identify the reference process observable based on a material property or a geometric feature of the computer-generated part.

19 . The non-transitory computer readable storage medium of claim 17 , wherein the processor is to adjust the at least one three-dimensional printing process parameter based on at least one of a real-time feedback implementation, a layer-to-layer feedback implementation, or a build-to-build feedback implementation.

20 . The non-transitory computer readable storage medium of claim 19 , wherein the processor is to obtain (1) first estimated process observable information from a previous build using the build-to-build feedback implementation and (2) second estimated process observable information from a previous layer of a same build using the layer-to-layer feedback implementation.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2025
From: BRUNELL, BRENT
To: GENERAL ELECTRIC COMPANY
Reel/Frame 073199/0885 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2023
From: ROYCHOWDHURY, SUBHRAJIT; IYER, NARESH S.; CHO, SANGHEE; BLOM, ROGIER SEBASTIAAN; ARAMANEKOPPA, SHARATH
To: GENERAL ELECTRIC COMPANY
Reel/Frame 062615/0564 →
Continuity (1)
Related Publication 20230400833A1 · Dec 14, 2023
References Cited (39)
US 6995334B1 · Kovacevic et al. · 2006 [cited by applicant]
US 7497977B2 · Nielsen et al. · 2009 [cited by applicant]
US 10507549B2 · Buller et al. · 2019 [cited by applicant]
US 10821512B2 · Yuan et al. · 2020 [cited by applicant]
US 20100125356A1 · Shkolnik · 2010 [cited by applicant]
US 20170239891A1 · Buller et al. · 2017 [cited by applicant]
US 20190001658A1 · Mathews, Jr. et al. · 2019 [cited by applicant]
US 20190056717A1 · Kothari · 2019 [cited by examiner]
US 20190213789A1 · Uyyala · 2019 [cited by applicant]
US 20190217416A1 · Brochu · 2019 [cited by applicant]
US 20190272665A1 · X · 2019 [cited by applicant]
US 20190389137A1 · Frohnmaier et al. · 2019 [cited by applicant]
US 20200147868A1 · Gold · 2020 [cited by applicant]
US 20200189197A1 · Spears · 2020 [cited by applicant]
US 20200218628A1 · Mathews, Jr. · 2020 [cited by examiner]
US 20200230884A1 · Buggenthin · 2020 [cited by examiner]
US 20200242495A1 · Roychowdhury · 2020 [cited by examiner]
US 20200242496A1 · Salasoo · 2020 [cited by examiner]
US 20200272127A1 · Roychowdhury et al. · 2020 [cited by applicant]
US 20200331059A1 · Acharya · 2020 [cited by examiner]
US 20200393813A1 · Gupta · 2020 [cited by examiner]
US 20210034037A1 · Rangarajan et al. · 2021 [cited by applicant]
US 20210048802A1 · Pal et al. · 2021 [cited by applicant]
US 20210200187A1 · Zeng · 2021 [cited by examiner]
US 20210349428A1 · Riss · 2021 [cited by examiner]
US 20220402038A1 · Tourangeau · 2022 [cited by applicant]
US 20230158595A1 · Huang · 2023 [cited by examiner]
US 20230400833A1 · Roychowdhury et al. · 2023 [cited by applicant]
CN 112487601A · 2021 [cited by applicant]
WO 2018029478A1 · 2018 [cited by applicant]
WO 2018031594 · 2018 [cited by applicant]
WO 2018070993 · 2018 [cited by applicant]
WO 2020028431 · 2020 [cited by applicant]
WO 2021015714 · 2021 [cited by applicant]
Rongxuan et al., “In Situ Melt Pool Measurements for Laser Powder Bed Fusion Using Multi-Sensing and Correlation Analysis,” Scientific Reports, vol. 12, No. 1, URL:[https://www.nature.com/articles/s41598-022-18096-w], d… [cited by applicant]
European Patent Office, “Extended European Search Report,” issued in connection with European Patent Application No. 23178993.4, mailed on Sep. 29, 2023, 7 pages. [cited by applicant]
European Patent Office, “Extended European Search Report,” issued in connection with European Application No. 23156555.7, dated Nov. 10, 2023, 10 pages. [cited by applicant]
United States Patent and Trademark Office, “Non-Final Office Action,” issued in connection with U.S. Appl. No. 17/840,401, dated May 9, 2025, 23 pages. [cited by applicant]
The State Intellectual Property Office of the People's Republic of China, “First Office Action and First Search,” issued in connection with Application No. 202310549272.6, dated Dec. 26, 2025, 20 pages [English translat… [cited by applicant]