IP Library › Granted Patent US 12,586,928
Granted Patent B2
US 12,586,928 · App. 18/619,207 · Granted Mar 24, 2026

Antenna device and communication device

Inventors: Hideki Ueda (Nagaokakyo, JP); Takaya Nemoto (Nagaokakyo, JP); Kengo Onaka (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q21/29H01Q13/02H01Q21/08H01Q21/24
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Quick Facts
Patent No.
US 12,586,928
App. No.
18/619,207
Granted
Mar 24, 2026
Kind
B2
Abstract

An array accommodated in a housing includes multiple antenna elements. The antenna elements face an inside surface of the housing and are arrayed in a first direction at least one-dimensionally. A waveguide is coupled to the antenna elements of the array antenna and extends from the array antenna toward the inside surface of the housing. The waveguide has a housing-side end face facing the inside surface of the housing and an antenna-side end face facing the array antenna. A length from one end to an opposite end of the housing-side end face in the first direction is greater than a length from one end to an opposite end of the antenna-side end face in the first direction. An antenna device that can improve antenna gain without increasing the size of the antenna module is provided.

Claims (77)

1 . An antenna device comprising:

a housing;

an array antenna accommodated in the housing so as to face an inside surface of the housing and including multiple antenna elements that are arrayed in a first direction at least one-dimensionally; and

a waveguide coupled to the antenna elements of the array antenna and extending from the array antenna toward the inside surface of the housing, wherein

the waveguide has a housing-side end face facing the inside surface of the housing and an antenna-side end face facing the array antenna, and

a length from one end to an opposite end of the housing-side end face in the first direction is greater than a length from one end to an opposite end of the antenna-side end face in the first direction such that the housing-side end face serves as a source of secondary waves.

2 . The antenna device according to claim 1 , wherein

the antenna elements of the array antenna are patch antennas.

3 . The antenna device according to claim 1 , wherein

the waveguide is a metallic waveguide.

4 . The antenna device according to claim 3 , wherein

an inside of the metallic waveguide is filled with a dielectric material.

5 . The antenna device according to claim 1 , wherein

the waveguide is a dielectric waveguide,

the inside surface of the housing includes a first region and a second region that are connected to each other with a corner of the housing interposed therebetween,

at least one of the antenna elements of the array antenna faces the first region, and at least remaining one of the antenna elements of the array antenna faces the second region,

the waveguide includes a first waveguide and a second waveguide,

the first waveguide is coupled to the at least one of the antenna elements facing the first region, and

the second waveguide is coupled to the at least remaining one of the antenna elements facing the second region,

a substrate on which the array antenna is disposed; and

a support portion configured to fix the substrate and the waveguide to the housing, wherein

the support portion includes

a bottom portion disposed so as to have a gap from the first region of the inside surface of the housing, the array antenna facing the first region,

a side-wall portion extending from the bottom portion to the inside surface of the housing and being fixed to the housing, and

the waveguide and the substrate are disposed between the first region and the bottom portion,

the support portion is fixed to the housing using a fixation device, or the support portion is formed as an integral part of the housing.

6 . A communication device comprising:

the antenna device according to claim 1 ; and

a high-frequency integrated circuit accommodated in the housing of the antenna device and configured to supply high-frequency signals to the antenna elements of the array antenna.

7 . An antenna device comprising:

a housing;

an array antenna accommodated in the housing so as to face an inside surface of the housing and including multiple antenna elements that are arrayed in a first direction at least one-dimensionally; and

multiple waveguides coupled to respective ones of the antenna elements of the array antenna and extending from the respective ones of the antenna elements toward the inside surface of the housing, wherein

in two of the waveguides coupled to respective two of the antenna elements that are positioned adjacently to each other in the first direction, a gap in the first direction between the housing-side end faces of the two of the waveguides is larger than a gap in the first direction between the antenna-side end faces thereof.

8 . The antenna device according to claim 7 , wherein

the antenna elements of the array antenna are patch antennas.

9 . The antenna device according to claim 7 , wherein

each antenna element of the array antenna includes an end portion of a microstrip line, and

a coupling region between each antenna element of the array antenna and a corresponding one of the waveguides is a microstrip line-waveguide converter.

10 . The antenna device according to claim 9 , wherein

the waveguide is a metallic waveguide.

11 . The antenna device according to claim 10 , wherein

an inside of the metallic waveguide is filled with a dielectric material.

12 . The antenna device according to claim 9 , wherein

the waveguide is a dielectric waveguide.

13 . The antenna device according to claim 12 , wherein

the inside surface of the housing includes a first region and a second region that are connected to each other with a corner of the housing interposed therebetween,

at least one of the antenna elements of the array antenna faces the first region, and at least remaining one of the antenna elements of the array antenna faces the second region,

the waveguide includes a first waveguide and a second waveguide,

the first waveguide is coupled to the at least one of the antenna elements facing the first region, and

the second waveguide is coupled to the at least remaining one of the antenna elements facing the second region.

14 . The antenna device according to claim 12 , further comprising:

a substrate on which the array antenna is disposed; and

a support portion configured to fix the substrate and the waveguide to the housing, wherein

the support portion includes

a bottom portion disposed so as to have a gap from the first region of the inside surface of the housing, the array antenna facing the first region,

a side-wall portion extending from the bottom portion to the inside surface of the housing and being fixed to the housing, and

the waveguide and the substrate are disposed between the first region and the bottom portion.

15 . The antenna device according to claim 14 , wherein

the support portion is fixed to the housing using a fixation device, or the support portion is formed as an integral part of the housing.

16 . The antenna device according to claim 15 , further comprising:

a high-frequency integrated circuit mounted on a surface of the substrate, the surface being opposite to the waveguide, wherein

the high-frequency integrated circuit is thermally coupled to the bottom portion.

17 . The antenna device according to claim 16 , further comprising:

a heat-dissipating member disposed between the high-frequency integrated circuit and the bottom portion.

18 . The antenna device according to claim 12 , further comprising:

a substrate on which the array antenna is disposed;

a motherboard on which the substrate is mounted; and

an adhesion layer that fixes the waveguide to the housing, wherein

attaching the motherboard to the housing causes the array antenna to come to a position at which the array antenna and the waveguide are coupled to each other.

19 . The antenna device according to claim 12 , further comprising:

a substrate on which the array antenna is disposed; and

a motherboard on which the substrate and the waveguide are mounted at a position at which the waveguide and the array antenna are coupled to each other, wherein

the motherboard is fixed to the housing.

20 . A communication device comprising:

the antenna device according to claim 7 ; and

a high-frequency integrated circuit accommodated in the housing of the antenna device and configured to supply high-frequency signals to the antenna elements of the array antenna.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2024
From: UEDA, HIDEKI; NEMOTO, TAKAYA; ONAKA, KENGO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 066929/0033 →
Priority Claims (1)
JP 2021-157780 · Sep 28, 2021 · national
Continuity (2)
Continuation PCTJP2022033462 · Sep 6, 2022
Related Publication 20240243488A1 · Jul 18, 2024
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