Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
A silicon carbide die package with multiple wire access points utilizing top and bottom enclosure plate clamps housing a silicon carbide die on a printed wiring board with wire contact pads, and a set of set screws providing downward pressure from the top enclosure plate inside the center of a cylindrical isolation housing to an isolation ball positioned above a clamp discs to clamp a wire end between the clamp disc and the wire contact pad.
1 . An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
the wiring board including a wire contact pad;
an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
a compressive fabric positioned between the pressure end and the wire contact pad; and
an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end and the compressive fabric, the insulating guidance housing positioned above the wire contact pad;
the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the pressure end.
2 . The electrical circuit packaging apparatus of claim 1 , further comprising:
the enclosure bottom plate defining a bottom support area opposite the adjustable clamping pressure extension.
3 . The electrical circuit packaging apparatus of claim 1 , further comprising:
the adjustable clamping pressure extension including a wire set screw threadably engaged with the enclosure top plate, the wire set screw including the pressure end.
4 . The electrical circuit packaging apparatus of claim 2 , further comprising:
the enclosure top plate defining a top wire set aperture and top set threads above the wire contact pad.
5 . The electrical circuit packaging apparatus of claim 4 , further comprising:
the enclosure bottom plate defining a bottom support area opposite the top wire set aperture.
6 . An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
the wiring board including a wire contact pad;
an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
an clamp disc;
a compressive fabric;
an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end, the clamp disc, and the compressive fabric, the insulating guidance housing positioned above the wire contact pad;
the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the clamp disc.
7 . The electrical circuit packaging apparatus of claim 6 , further comprising:
the enclosure bottom plate defining a bottom support area opposite the adjustable clamping pressure extension.
8 . The electrical circuit packaging apparatus of claim 6 , further comprising:
the adjustable clamping pressure extension including a wire set screw threadably engaged with the enclosure top plate, the wire set screw including the pressure end.
9 . The electrical circuit packaging apparatus of claim 7 , further comprising:
the enclosure top plate defining a top wire set aperture and top set threads above the wire contact pad.
10 . The electrical circuit packaging apparatus of claim 9 , further comprising:
the enclosure bottom plate defining a bottom support area opposite the top wire set aperture.
11 . An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
at least one enclosure post threadably engaging an enclosure nut to connect the enclosure top plate and enclosure bottom plate,
the enclosure post and enclosure nut having a matching coefficient of thermal expansion;
the wiring board including a wire contact pad;
an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture, the insulating guidance housing positioned above the wire contact pad;
the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the pressure end.