IP Library › Granted Patent US 12,592,511
Granted Patent B2
US 12,592,511 · App. 18/075,674 · Granted Mar 31, 2026

Metal shell-less receptacle connector

Inventors: Jae-Hyuk Choi (Hanam-si, KR); Chung-Seok Lee (Seongnam-si, KR)
Assignee: EDS Solution Co., Ltd.
H01R13/5202H01R13/512H01R13/5216
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Quick Facts
Patent No.
US 12,592,511
App. No.
18/075,674
Granted
Mar 31, 2026
Kind
B2
Abstract

A metal shell-less receptacle connector includes a ceramic module, a glass seal having an insertion hole into which an outer circumferential portion of the ceramic module is fitted, and a ceramic support having a seal fastening hole into which an outer circumferential portion of the glass seal is fitted and fastening holes to which fasteners are fastened. Contacts and a ceramic material are integrated, whereby high data transmission is enabled due to impedance optimization and low loss characteristics, heat dissipation performance is improved due to high thermal conductivity, and durability is improved due to high strength. Shell-less structure reduces frequency interference, thereby improving the performance of an antenna positioned adjacent to the connector. Glass seal improves waterproof performance. Connector connects to a main board using a flexible printed circuit board, thereby improving the degree of freedom of position.

Claims (17)

1 . A metal shell-less receptacle connector comprising:

a ceramic module;

a glass seal having an insertion hole into which an outer circumferential portion of the ceramic module is fitted; and

a ceramic support having a seal fastening hole into which an outer circumferential portion of the glass seal is fitted and fastening holes to which fasteners are fastened,

wherein the ceramic support has an O-ring seating portion, to which an O-ring is fitted to provide airtightness,

wherein the receptacle connector is connected to a main board by being mounted on a flexible printed circuit board and fixed using an underfill, the flexible printed circuit board having a cut portion on a portion thereof for mounting of the receptacle connector on the main board,

wherein the receptacle connector is connected to a connector connecting part of a frame, the connector connecting part having a through-hole, into which the ceramic module is inserted, in a central portion thereof and fastening holes on both sides of the through-hole, to which the fasteners are fastened, and

wherein the receptacle connector is connected to the main board by connecting the receptacle connector to an outer circumferential portion of the flexible printed circuit board by soldering and fixing the receptacle connector using the underfill.

2 . The metal shell-less receptacle connector of claim 1 , wherein the ceramic module comprises:

an intermediate metal layer;

an upper ceramic insulator and a lower ceramic insulator provided on outer circumferential portions of the intermediate metal layer;

an upper metal contact and a lower metal contact provided on a top surface of the upper ceramic insulator and a bottom surface of the lower ceramic insulator, respectively; and

an upper ceramic plate and a lower ceramic plate provided on a top surface of the upper metal contact and a bottom surface of the lower metal contact, respectively.

3 . The metal shell-less receptacle connector of claim 2 , wherein the ceramic module is configured such that the upper and lower metal contacts are provided on outer circumferential portions of the upper and lower ceramic insulators by one selected from printing, deposition, filling, peeling, direct copper plating, and direct copper bonding.

4 . The metal shell-less receptacle connector of claim 2 , wherein:

the upper ceramic plate is composed of one of high temperature co-fired ceramic, low temperature co-fired ceramic, or low temperature co-fired ceramic on metal, and

the lower ceramic plate is composed of one of the high temperature co-fired ceramic, the low temperature co-fired ceramic, or the low temperature co-fired ceramic on metal.

Assignments (2)
CHANGE OF NAME Recorded Jan 13, 2026
From: PHILTECH CO., LTD.
To: EDS SOLUTION CO., LTD.
Reel/Frame 074331/0957 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2022
From: CHOI, JAE-HYUK; LEE, CHUNG-SEOK
To: PHILTECH CO., LTD.
Reel/Frame 061992/0972 →
Priority Claims (1)
KR 10-2022-0010968 · Jan 25, 2022 · national
Continuity (1)
Related Publication 20230238733A1 · Jul 27, 2023
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