Method for manufacturing nitride semiconductor substrate, nitride semiconductor substrate, and laminate structure
A method of making a semiconductor including a step of preparing a base substrate; a first step of epitaxially growing a single crystal of a group III nitride semiconductor having a top surface with (0001) plane exposed, directly on the main surface of the base substrate, forming a plurality of concaves composed of inclined interfaces other than the (0001) plane on the top surface, gradually expanding the inclined interfaces toward an upper side of the main surface of the base substrate, making the (0001) plane disappear from the top surface, and growing a first layer whose surface is composed only of the inclined interfaces; and a second step of epitaxially growing a single crystal of a group III nitride semiconductor on the first layer, making the inclined interfaces disappear, and growing a second layer having a mirror surface, and a semiconductor made thereby.
1 . A nitride semiconductor substrate having a diameter of 2 inches or more and having a main surface whose closest low index crystal plane is a (0001) plane,
wherein when the main surface is observed in a field of view of 250 μm square using a multiphoton excitation microscope, 95% or more of dark spots are dislocations rather than non-emission centers due to foreign matters or point defects, and
the main surface includes non-overlapping 50 μm square dislocation-free regions at a density of 100/cm 2 or more.
2 . The nitride semiconductor substrate according to claim 1 ,
wherein observation of the main surface of the nitride semiconductor substrate in a field of view of 250 μm square using a multiphoton excitation microscope to obtain a dislocation density from a dark spot density, reveals that:
a region having a dislocation density of less than 1×10 6 cm −2 exists in an area of 80% or more of the main surface.
3 . The nitride semiconductor substrate according to claim 1 ,
wherein observation of the main surface of the nitride semiconductor substrate in a field of view of 250 μm square using a multiphoton excitation microscope to obtain a dislocation density from a dark spot density, reveals that:
there is no region in the main surface where the dislocation density exceeds 3×10 6 cm −2 .
4 . The nitride semiconductor substrate according to claim 1 ,
wherein an oxygen concentration in the nitride semiconductor substrate is 5×10 16 cm −3 or less.
5 . The nitride semiconductor substrate according to claim 1 , wherein a hydrogen concentration in the nitride semiconductor substrate is less than 1×10 17 cm −3 .
6 . A nitride semiconductor substrate, having a diameter of 2 inches or more and having a main surface whose closest low index crystal plane is a (0001) plane,
wherein X-ray rocking curve measurement for (0002) plane diffraction, which is performed to the main surface by irradiating with (Cu) Kα1 X-rays through a two-crystal monochromator of Ge (220) plane and a slit, reveals that:
a variation obtained by a difference between maximum and minimum in a size of an off-angle within a diameter of 29.6 mm from a center of the main surface is 0.075° or less,
wherein the off-angle is an angle of <0001> axis with respect to a normal of the main surface measured based on a diffraction peak angle of the (0002) plane, and
difference FWHMa-FWHMb obtained by subtracting FWHMb from FWHMa is 30% or less of FWHMa,
wherein FWHMa is full width at half maximum of the (0002) plane diffraction when a slit width in ω direction is 1 mm, and
FWHMb is full width at half maximum of the (0002) plane diffraction when a slit width in ω direction is 0.1 mm.
7 . The nitride semiconductor substrate according to claim 6 , wherein the variation in the size of the off-angle is 0.057° or less.
8 . A nitride semiconductor substrate, having a diameter of 2 inches or more and having a main surface whose closest low index crystal plane is a (0001) plane,
wherein X-ray rocking curve measurement for (0002) plane diffraction, which is performed to the main surface by irradiating with (Cu) Kα1 X-rays through a two-crystal monochromator of Ge (220) plane and a slit, reveals that:
difference FWHMa-FWHMb obtained by subtracting FWHMb from FWHMa is 30% or less of FWHMa,
wherein FWHMa is full width at half maximum of the (0002) plane diffraction when a slit width in ω direction is 1 mm,
FWHMb is full width at half maximum of the (0002) plane diffraction when a slit width in ω direction is 0.1 mm, and
a difference between a first radius of curvature of the (0001) plane in a direction along <11-20> axis and a second radius of curvature of the (0001) plane in a direction along the <1-100> axis obtained based on a diffraction peak angle of the (0002) plane, is 50% or less of the larger radius of curvature among the first radius of curvature and the second radius of curvature.
9 . The nitride semiconductor substrate according to claim 8 ,
wherein the difference between the first radius of curvature and the second radius of curvature, is 20% or less of the larger radius of curvature among the first radius of curvature and the second radius of curvature.
10 . A nitride semiconductor substrate, having a diameter of 2 inches or more and having a main surface whose closest low index crystal plane is a (0001) plane,
wherein each of a first radius of curvature of the (0001) plane in a direction along <11-20> axis and a second radius of curvature of the (0001) plane in a direction along the <1-100> axis, is 23 m or more, and
a difference between the first radius of curvature and the second radius of curvature, is 50% or less of the larger radius of curvature among the first radius of curvature and the second radius of curvature.
11 . The nitride semiconductor substrate according to claim 10 ,
wherein the difference between the first radius of curvature and the second radius of curvature, is 20% or less of the larger radius of curvature among the first radius of curvature and the second radius of curvature.