IP Library › Granted Patent US 12,596,668
Granted Patent B2
US 12,596,668 · App. 18/783,335 · Granted Apr 7, 2026

Dual interface high-speed memory subsystem

Inventor: Marco Redaelli (Munich, DE)
Assignee: MICRON TECHNOLOGY, INC.
G06F13/4282G06F9/4401G06F13/16G06F2213/0002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,596,668
App. No.
18/783,335
Granted
Apr 7, 2026
Kind
B2
Abstract

A memory subsystem that includes a memory device, a first host interface, a serial interface controller that provides host access to a boot partition of the memory device using the first host interface, a second host interface, and a high-speed interface controller that provides host access to a user partition of the memory device using the second host interface.

Claims (30)

1 . A memory subsystem comprising:

a non-volatile memory device including a boot partition and a user partition;

a first host interface connecting the memory subsystem to a host;

a serial interface controller providing the host access to the boot partition using the first host interface;

a second host interface connecting the memory subsystem to the same host; and

a high-speed interface controller providing the host access to the user partition using the second host interface.

2 . The memory subsystem of claim 1 , wherein the first host interface is a Quad Serial Peripheral Interface (QSPI) interface.

3 . The memory subsystem of claim 1 , wherein the second host interface is one of a Peripheral Component Interconnect Express (PCIe), Serial Advanced Technology Attachment (SATA), and Unified Protocol (UniPro) interface.

4 . The memory subsystem of claim 1 , wherein the memory device includes timing settings and firmware code that sets a timing configuration of the serial interface controller using the timing settings.

5 . The memory subsystem of claim 4 , wherein the firmware code further initializes the high-speed interface controller.

6 . The memory subsystem of claim 1 , wherein the boot partition includes a primary boot loader that is transferred to a host system through the serial interface.

7 . The memory subsystem of claim 6 , wherein the memory device includes a second stage boot loader that is transferred to the host system through the high-speed interface controller.

8 . The memory subsystem of claim 7 , wherein the second stage boot loader is transferred to the host system responsive to a request from the host system.

9 . The memory subsystem of claim 7 , wherein the serial interface controller and the high-speed interface controller are initialized at least partly in parallel when power is applied to the memory subsystem.

10 . The memory subsystem of claim 9 , wherein upon receiving power, the memory subsystem transfers the primary boot loader from the boot partition memory to the host system along the first host interface before the second host interface is initialized and available for transferring data from the memory device.

11 . A computing system comprising:

a controller; and

a non-volatile memory subsystem coupled to the controller through a first interface that is a serial interface and coupled to the same controller through a second interface that is a high-speed interface, the memory subsystem comprising:

a memory device including a boot partition and a user partition,

a serial interface controller that transfers data from the boot partition to the controller using the serial interface, and

a high-speed interface controller that transfers data from the memory device to the controller using the high-speed interface.

12 . The computing system of claim 11 , wherein the serial interface is a Quad Serial Peripheral Interface (QSPI) interface.

13 . The computing system of claim 11 , wherein the high-speed interface is one of a Peripheral Component Interconnect Express (PCIe), Serial Advanced Technology Attachment (SATA), and Unified Protocol (UniPro) interface.

14 . The computing system of claim 11 , wherein the memory device includes timing settings and firmware code that sets a timing configuration of the serial interface controller using the timing settings.

15 . The computing system of claim 14 , wherein the firmware code initializes the high-speed interface controller.

16 . The computing system of claim 11 , wherein the memory subsystem transfers a primary boot loader from the boot partition to the controller using the serial interface.

17 . The computing system of claim 11 , wherein the memory subsystem transfers a second stage boot loader from the memory device to the controller using the high-speed interface.

18 . The computing system of claim 17 , wherein the memory subsystem transfers the second stage boot loader responsive to receiving a request from the controller for the second stage boot loader.

19 . The computing system of claim 11 , wherein upon receiving power, the memory subsystem transfers a primary boot loader from the boot partition to the controller along the serial interface before the high-speed interface is initialized and available for transferring data from the memory device to the controller.

20 . The computing system of claim 11 , wherein upon receiving power, the memory subsystem initializes the serial interface controller, initializes the high-speed interface controller, transfers a primary boot loader from the boot partition to the controller along the serial interface before the high-speed interface controller is finished initializing, and when high-speed interface controller is finished initializing transfers a second stage boot loader from the memory device to the controller along the high-speed interface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2024
From: REDAELLI, MARCO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 068100/0384 →
Continuity (2)
Provisional Application 63623337 · Jan 21, 2024
Related Publication 20250238391A1 · Jul 24, 2025
References Cited (14)
US 8943234B1 · Voorhees · 2015 [cited by examiner]
US 10579391B2 · Schlanger · 2020 [cited by examiner]
US 10719246B2 · Lee · 2020 [cited by examiner]
US 20090031073A1 · Diggs · 2009 [cited by examiner]
US 20090094620A1 · Kalwitz · 2009 [cited by examiner]
US 20100174866A1 · Fujimoto · 2010 [cited by examiner]
US 20190095271A1 · Lemberg · 2019 [cited by examiner]
US 20190121756A1 · Yang · 2019 [cited by examiner]
US 20200371695A1 · Gopal · 2020 [cited by examiner]
US 20210405919A1 · K · 2021 [cited by examiner]
US 20230259627A1 · Santan · 2023 [cited by examiner]
US 20250085977A1 · Krithivas · 2025 [cited by examiner]
US 20250117205A1 · Minnich · 2025 [cited by examiner]
Texas Instruments, IWR1642 Bootloader Flow Application Report, Jun. 10, 2017 pp. 2-9 (Year: 2017). [cited by examiner]