IP Library Granted Patent US 12,598,741
Granted Patent B2
US 12,598,741 · App. 18/103,316 · Granted Apr 7, 2026

Multi-stack bitcell architecture

Inventors: Yannick Marc Nevers (Châteauneuf-Grasse, FR); Valerio Lanieri (Antibes, FR); Amit Chhabra (Delhi, IN)
Assignee: Arm Limited
H10B20/50H10B20/34
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Quick Facts
Patent No.
US 12,598,741
App. No.
18/103,316
Granted
Apr 7, 2026
Kind
B2
Abstract

Various implementations described herein are related to a device having a memory architecture with a multi-stack of transistors that may be arranged in a multi-bitcell stack configuration. Also, the memory architecture may have a wordline that may be shared across the transistors of the multi-stack of transistors with each transistor coupled to a different bitline.

Claims (23)

1 . A device comprising:

a memory architecture having a multi-stack of transistors arranged in a multi-bitcell stack configuration, and wherein a wordline is shared across the transistors of the multi-stack of transistors with each transistor coupled to a different bitline, wherein a global wordline is coupled to the wordline such that the global wordline is shared across the transistors.

2 . The device of claim 1 , wherein the transistors in the multi-stack of transistors are formed in the memory architecture as a three-dimensional (3D) memory structure.

3 . The device of claim 1 , wherein the multi-bitcell stack configuration has at least two transistors in the multi-stack of transistors.

4 . The device of claim 1 , wherein the multi-bitcell stack configuration has at least four transistors in the multi-stack of transistors.

5 . The device of claim 1 , wherein each transistor is coupled to ground or to its corresponding bitline of each different bitline.

6 . The device of claim 1 , wherein each different bitline is separated by an insulator.

7 . The device of claim 1 , wherein a global bitline is coupled to the different bitlines through local bitlines.

8 . A device comprising:

a memory architecture having a multi-stack of transistors arranged in a multi-bitcell stack configuration, and wherein a bitline is shared across the transistors of the multi-stack of transistors with each transistor coupled to a different wordline.

9 . The device of claim 8 , wherein the transistors in the multi-stack of transistors are formed in the memory architecture as a three-dimensional (3D) memory structure.

10 . The device of claim 8 , wherein the multi-bitcell stack configuration has at least two transistors in the multi-stack of transistors.

11 . The device of claim 8 , wherein the multi-bitcell stack configuration has at least four transistors in the multi-stack of transistors.

12 . The device of claim 8 , wherein each transistor is coupled to ground or to its corresponding bitline that is shared across the transistors.

13 . The device of claim 8 , wherein each different wordline is separated by an insulator.

14 . The device of claim 8 , wherein a different global wordline is coupled to each different wordline.

15 . A device comprising:

a memory architecture having a multi-stack of transistors arranged in a multi-bitcell stack configuration, and wherein a first wordline is shared across a first set of transistors of the multi-stack of transistors with each transistor in the first set of transistors coupled to a first set of shared bitlines, and wherein a second wordline is shared across a second set of transistors of the multi-stack of transistors with each transistor in the second set of transistors coupled to a second set of shared bitlines.

16 . The device of claim 15 , wherein the transistors in the multi-stack of transistors are formed in the memory architecture as a three-dimensional (3D) memory structure.

17 . The device of claim 15 , wherein the multi-bitcell stack configuration has at least four transistors in the multi-stack of transistors.

18 . The device of claim 15 , wherein each transistor is coupled to ground or to its corresponding bitline of the first set of bitlines and the second set of bitlines.

19 . The device of claim 15 , wherein the first wordline and the second wordline are separated by an insulator.

20 . The device of claim 15 , wherein a first global wordline is coupled to the first wordline such that the first global wordline is shared across the first set of transistors, and wherein a second global wordline is coupled to the second wordline such that the second global wordline is shared across the second set of transistors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2023
From: NEVERS, YANNICK MARC; LANIERI, VALERIO; CHHABRA, AMIT
To: ARM LIMITED
Reel/Frame 062537/0583 →
Continuity (1)
Related Publication 20240260261A1 · Aug 1, 2024
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