Microelectronic packages with embedded interposers
An electronic device comprises multiple integrated circuit (IC) dice disposed on a package substrate having a substrate area, a mold layer that includes the IC dice, and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer, and an interposer layer extending over the substrate area and comprised of a stiffening material more rigid than a material of the package substrate. The interposer layer includes multiple electrically conductive through layer vias contacting the conductive pillars at a first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer.
1 . An electronic device comprising:
multiple integrated circuit (IC) dice disposed on a package substrate, the package substrate having a substrate area;
a mold layer that includes the IC dice and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer; and
an interposer layer extending over the substrate area and including a stiffening material more rigid than a material of the package substrate, the interposer layer further including multiple electrically conductive through layer vias contacting the conductive pillars at the first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer,
wherein the stiffening material is glass, the interposer layer is a glass interposer layer and the multiple through layer vias are through-glass vias (TGVs) that include metal,
wherein the glass interposer layer is embedded in a redistribution layer contacting the mold layer and including at least one electrically conductive interconnect layer in electrical contact with the TGVs.
2 . The electronic device of claim 1 , including an adhesive layer arranged between the mold layer and the glass interposer layer, and the TGVs extend through the adhesive layer to the conductive pillars of the mold layer.
3 . The electronic device of claim 1 , wherein each TGV includes solder on both ends of the TGV.
4 . The electronic device of claim 1 , wherein the mold layer includes at least one additional contact pillar extending from the first surface of the mold layer to a second opposing surface of the mold layer, and wherein the glass interposer layer includes at least one TGV contacting the at least one additional contact pillar.
5 . The electronic device of claim 1 , including a redistribution layer contacting the glass interposer layer and including at least one electrically conductive interconnect layer in electrical contact with the TGVs.
6 . An electronic device comprising:
multiple integrated circuit (IC) dice disposed on a package substrate, the package substrate having a substrate area;
a mold layer that includes the IC dice and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer; and
an interposer layer extending over the substrate area and including a stiffening material more rigid than a material of the package substrate, the interposer layer further including multiple electrically conductive through layer vias contacting the conductive pillars at the first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer,
wherein the stiffening material is a metal more rigid than the package substrate, the interposer layer is a metal interposer layer, and the multiple through layer vias include an insulating dielectric material separating the metal of the metal interposer layer and the electrically conductive material of the through layer vias.
7 . The electronic device of claim 1 , wherein the glass interposer layer is attached to the mold layer using solder.
8 . A packaged electronic system comprising:
multiple integrated circuit (IC) dice disposed on a package substrate, the package substrate having a substrate area;
a mold layer that includes the IC dice and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer;
a glass interposer layer having substantially a same area as the substrate area and arranged above the mold layer, the glass interposer layer including multiple electrically conductive through glass vias (TGVs) in electrical contact with the conductive pillars and extending through a stiffening material of the glass interposer layer to a second surface of the interposer layer;
an adhesive between the glass interposer layer and the mold layer, the adhesive touching the glass interposer layer; and
an electronic device arranged between the mold layer and the glass interposer layer and in electrical contact with at least two IC dice of the multiple IC dice and in electrical contact with at least one TGV,
wherein the glass interposer layer is embedded in a redistribution layer contacting the mold layer and including at least one electrically conductive interconnect layer in electrical contact with the TGVs.
9 . The packaged electronic system of claim 8 , wherein the electronic device is embedded in an insulating layer arranged between the mold layer and the glass interposer layer, and the insulating layer includes through vias and the TGVs of the glass interposer layer are in electrical contact with the conductive pillars of the mold layer through the through vias of the insulating layer.
10 . The packaged electronic system of claim 8 , including a redistribution layer contacting the glass interposer layer and including at least one electrically conductive interconnect layer in electrical contact with the TGVs.
11 . The packaged electronic system of claim 8 , wherein the electronic device is a die-to-die bridge connector between the at least two IC dice.