Sinter bonded projectile
View Patent ↗The invention of the present subject matter relates to a sinter bonded projectile comprising a core component and a copper component which has been sintered in such a manner to form a solid mass over the core. More particularly, the invention of the present subject matter provides a core component to which a copper component is melted at a temperature sufficient that it penetrates into the pores and geometry of the core component under compression due to thermal shrinkage, resulting in a tightly bonded solid mass containing no voids. The invention of the present subject matter also provides a process for manufacturing the projectile.
1 . A sinter bonded projectile comprising a core component in the form of tungsten carbide and a copper component which is sintered around and into the core to form a tightly bonded solid mass containing no voids.
2 . The sinter bonded projectile in accordance with claim 1 , wherein said copper component is in the form of copper powder.
3 . The sinter bonded projectile in accordance with claim 2 , wherein said copper powder contains at least 98.5% by weight copper.
4 . The sinter bonded projectile in accordance with claim 1 , wherein said copper component is in the form of copper wire.
5 . The sinter bonded projectile in accordance with claim 4 , wherein said copper wire contains at least 98.5% by weight copper.
6 . The sinter bonded projectile in accordance with claim 1 , wherein said copper component is selected from the group consisting of copper powder and copper wire.
7 . The sinter bonded projectile in accordance with claim 6 wherein said copper component contains at least 98.5% by weight copper.